FEMC016GCB-T740

The FEMC016GCB-T740 from Flexxon is a high-performance 16GB embedded MultiMediaCard (eMMC 5.1) flash memory solution built on advanced 3D pseudo-Single Level Cell (pSLC) technology. Part of the XTRA VIII Series, this 153-ball FBGA memory module delivers superior reliability and endurance for demanding embedded applications. With AEC-Q100 Grade 2 qualification and an extended operating temperature range of -40°C to 105°C, this memory solution is engineered for automotive and industrial systems that require robust, long-life data storage.

Offering a memory organization of 16G × 8 with a 200 MHz clock frequency, the FEMC016GCB-T740 provides fast data throughput through its eMMC 5.1 interface. The device operates with dual voltage supply support (VCCQ: 1.8V/3.3V, VCC: 3.3V) and features a compact 153-FBGA surface-mount package, making it an ideal choice for space-constrained automotive, industrial control, and transportation applications where reliable non-volatile storage is critical.

Key Features

• 3D pSLC Technology
  Employs advanced 3D pseudo-Single Level Cell architecture that delivers enhanced endurance, improved write performance, and superior data retention compared to traditional TLC flash, making it suitable for write-intensive applications requiring long operational lifetimes.
• High-Performance eMMC 5.1 Interface
  Features a 200 MHz clock frequency and eMMC 5.1 standard compliance, providing fast sequential read/write operations and efficient data transfer for applications demanding responsive storage performance.
• 128 Gbit Storage Capacity
  Offers 16GB (128 Gbit) of non-volatile flash memory organized as 16G × 8, providing ample storage for firmware, operating systems, application code, and data logging in embedded systems.
• Automotive-Grade Qualification
  AEC-Q100 Grade 2 qualified for automotive applications with an operating temperature range of -40°C to 105°C, ensuring reliable operation in harsh environmental conditions including under-hood automotive installations and industrial control environments.
• Flexible Voltage Supply
  Supports dual voltage operation with VCCQ at 1.8V or 3.3V and VCC at 3.3V, enabling compatibility with a wide range of host controllers and system architectures while optimizing power consumption.
• Compact Surface-Mount Package
  Housed in a space-efficient 153-ball FBGA (Fine-pitch Ball Grid Array) package designed for surface-mount technology, minimizing PCB footprint while providing reliable interconnection in high-density embedded designs.
• RoHS Compliant
  Fully compliant with RoHS environmental standards, meeting regulatory requirements for reduced hazardous substances in electronic components.

Typical Applications

• Automotive Infotainment Systems
  Provides reliable storage for navigation maps, multimedia content, user preferences, and operating system files in dashboard displays, head units, and rear-seat entertainment systems where AEC-Q100 qualification and temperature tolerance are essential.
• Advanced Driver Assistance Systems (ADAS)
  Serves as dependable non-volatile memory for firmware storage, configuration data, and event logging in automotive camera systems, radar modules, and sensor fusion units that demand automotive-grade reliability and wide temperature operation.
• Industrial Control and Automation
  Offers robust data storage for programmable logic controllers (PLCs), human-machine interfaces (HMIs), and factory automation equipment operating in industrial environments with extended temperature exposure and high write-cycle requirements.
• Transportation and Telematics
  Delivers durable flash storage for fleet management devices, vehicle tracking systems, and transportation infrastructure equipment where long-term reliability and resistance to temperature extremes are critical operational requirements.
• Medical and Diagnostic Equipment
  Supports embedded storage needs in portable diagnostic devices and medical instruments requiring reliable data retention, extended operational life, and performance consistency across varying environmental conditions.

Unique Advantages

• Enhanced Endurance Through 3D pSLC: The 3D pSLC technology significantly extends program/erase cycle endurance compared to standard TLC flash, reducing the frequency of storage replacement and lowering total cost of ownership in applications with frequent data writes.
• Automotive-Qualified Reliability: AEC-Q100 Grade 2 qualification provides documented reliability testing for automotive applications, reducing design risk and accelerating time-to-market for automotive system developers requiring compliant components.
• Wide Operating Temperature Range: The -40°C to 105°C operating temperature specification ensures consistent performance across extreme environmental conditions, eliminating the need for thermal management in many demanding applications and expanding deployment options.
• Integrated eMMC 5.1 Controller: The integrated controller manages wear leveling, bad block management, and error correction internally, simplifying host system firmware development and reducing the engineering effort required for reliable flash memory integration.
• Simplified Design Integration: The standardized eMMC 5.1 interface and dual voltage support enable straightforward integration with a broad ecosystem of application processors and microcontrollers, reducing design complexity and shortening development cycles.
• Space-Optimized Footprint: The compact 153-FBGA package delivers high storage capacity in a small form factor, enabling designers to maximize functionality while minimizing PCB area consumption in space-constrained embedded systems.

Why Choose the FEMC016GCB-T740?

The FEMC016GCB-T740 delivers an optimal balance of capacity, performance, and reliability for automotive and industrial embedded systems. Its AEC-Q100 Grade 2 qualification and 3D pSLC technology provide the endurance and environmental resilience required for mission-critical applications, while the eMMC 5.1 interface ensures compatibility with modern embedded processors. The extended -40°C to 105°C operating temperature range eliminates thermal constraints that often complicate automotive and industrial deployments, and the integrated controller reduces software complexity.

For design engineers developing automotive infotainment, ADAS, industrial automation, or transportation systems, the FEMC016GCB-T740 offers a proven, automotive-qualified storage solution backed by Flexxon's XTRA VIII Series reliability. The combination of 16GB capacity, high-speed interface, and ruggedized operating specifications makes this eMMC module an excellent choice for applications demanding long service life, consistent performance, and proven environmental resilience in challenging operating conditions.

Ready to integrate robust, automotive-grade eMMC storage into your next embedded design? Contact our technical sales team today to request detailed specifications, samples, or a quotation for the FEMC016GCB-T740. Our experts are available to assist with integration guidance and volume pricing for your project requirements.