FEMC016GCA-T740

The FEMC016GCA-T740 is a high-performance 16GB embedded MultiMediaCard (eMMC) 5.1 flash memory solution from Flexxon's XTRA VIII series. Built with advanced 3D pseudo-SLC (pSLC) technology, this non-volatile memory device delivers the endurance and reliability of SLC NAND while maintaining cost-effective capacity. Designed to meet the demanding requirements of automotive and industrial applications, the FEMC016GCA-T740 provides robust data storage with AEC-Q100 Grade 3 qualification and extended temperature operation from -40°C to 85°C.

Housed in a compact 153-ball FBGA package and supporting dual voltage operation (1.8V/3.3V), this eMMC solution offers designers a proven, standards-based storage interface with 200 MHz clock frequency and optimized power consumption. The XTRA VIII series combines proven eMMC 5.1 protocol compatibility with 3D pSLC technology to deliver a reliable, high-endurance storage solution for mission-critical embedded systems.

Key Features

• 3D pSLC Technology
  Utilizes advanced 3D pseudo-SLC architecture to deliver SLC-grade endurance and reliability with improved write performance and extended lifespan compared to standard TLC NAND, ideal for write-intensive applications requiring long-term data retention.
• 16GB Capacity (128 Gbit)
  Organized as 16G × 8 with a total capacity of 128 Gbit (16 GB), providing ample storage for operating systems, application code, data logging, and multimedia content in embedded systems.
• eMMC 5.1 Interface
  Industry-standard eMMC 5.1 protocol ensures broad host controller compatibility and simplified integration, with 200 MHz clock frequency supporting high-speed data transfer for demanding applications.
• Automotive-Grade Qualification
  AEC-Q100 Grade 3 qualified for automotive applications, meeting stringent quality and reliability standards required for in-vehicle electronics and harsh-environment industrial systems.
• Extended Temperature Range
  Operates reliably across -40°C to 85°C temperature range, ensuring consistent performance in automotive, industrial control, outdoor equipment, and other harsh-environment applications.
• Dual Voltage Support
  Flexible power supply options with VCC at 3.3V and VCCQ supporting both 1.8V and 3.3V signaling levels, enabling compatibility with a wide range of host system architectures and reducing design complexity.
• Compact Surface-Mount Package
  153-ball FBGA package provides a small footprint for space-constrained designs while maintaining robust signal integrity and thermal performance through surface-mount construction.
• RoHS Compliant
  Fully compliant with RoHS environmental standards, supporting green manufacturing initiatives and meeting global regulatory requirements for hazardous substance restrictions.

Typical Applications

• Automotive Infotainment and Navigation Systems
  Provides reliable storage for operating systems, maps, multimedia content, and user data in dashboard displays, head units, and advanced driver assistance systems where AEC-Q100 qualification and extended temperature operation are essential.
• Industrial Control and Automation
  Serves as dependable embedded storage for PLCs, HMI panels, industrial gateways, and robotics controllers requiring high endurance for continuous data logging and firmware storage in harsh factory environments.
• Transportation and Fleet Management
  Enables data storage in telematics devices, digital tachographs, onboard diagnostics systems, and fleet tracking units where automotive qualification and wide temperature operation ensure reliable performance in mobile applications.
• Medical and Healthcare Equipment
  Supports embedded storage needs in diagnostic instruments, patient monitoring systems, and portable medical devices where data integrity, reliability, and extended operating temperature ranges are critical requirements.
• Smart City Infrastructure
  Powers storage solutions in traffic management systems, surveillance equipment, smart lighting controllers, and outdoor digital signage where automotive-grade reliability and extended temperature tolerance ensure long-term deployment success.

Unique Advantages

• Superior Endurance with 3D pSLC: The pseudo-SLC architecture delivers significantly higher program/erase cycles compared to standard MLC or TLC NAND, reducing total cost of ownership in write-intensive applications and extending product lifespan in mission-critical deployments.
• Automotive-Qualified Reliability: AEC-Q100 Grade 3 certification demonstrates proven reliability through rigorous automotive qualification testing, providing confidence for safety-critical applications and reducing design risk in automotive and industrial projects.
• Standards-Based Integration: eMMC 5.1 compliance ensures straightforward integration with existing host controllers and software stacks, accelerating time-to-market while leveraging mature ecosystem tools, drivers, and reference designs.
• Harsh Environment Operation: The -40°C to 85°C operating temperature range combined with automotive qualification enables deployment in extreme conditions including engine compartments, outdoor installations, and industrial facilities without requiring additional thermal management.
• Flexible Voltage Architecture: Dual voltage support for VCCQ (1.8V/3.3V) simplifies board design by accommodating both legacy and modern I/O voltage domains, reducing BOM cost and enabling voltage-level translation without external components.
• Compact, Production-Ready Package: The 153-ball FBGA surface-mount package optimizes board space utilization while providing excellent manufacturability for high-volume production, with proven assembly processes and solder joint reliability.

Why Choose the FEMC016GCA-T740?

The FEMC016GCA-T740 delivers a compelling combination of automotive-grade reliability, 3D pSLC endurance, and eMMC 5.1 standards compliance in a compact, production-ready package. For system architects and design engineers developing automotive, industrial, and harsh-environment embedded systems, this memory solution eliminates the complexity of managing raw NAND while providing the endurance benefits traditionally associated with SLC technology. The AEC-Q100 Grade 3 qualification and extended temperature operation ensure your design meets the stringent reliability requirements of safety-critical applications.

As part of Flexxon's XTRA VIII series, the FEMC016GCA-T740 represents a proven storage platform backed by comprehensive datasheet specifications, quality manufacturing processes, and RoHS environmental compliance. Whether you're designing next-generation automotive electronics, ruggedized industrial controllers, or mission-critical infrastructure equipment, this 16GB eMMC 5.1 solution provides the reliability, performance, and design flexibility your application demands.

Ready to integrate automotive-grade storage into your next design? Request a quote today to learn more about the FEMC016GCA-T740 and discover how Flexxon's XTRA VIII series can provide the reliable, high-endurance storage solution your application requires. Contact our team to discuss volume pricing, technical specifications, and design support for your embedded storage needs.