FEMC016GBE-T740

The FEMC016GBE-T740 from Flexxon is a high-capacity 16GB embedded MultiMediaCard (eMMC) storage solution built on 3D TLC NAND technology. Part of the XTRA VII Series, this eMMC 5.1-compliant memory module delivers reliable non-volatile storage in a compact 153-ball FBGA package, making it ideal for space-constrained embedded systems requiring persistent data storage with proven industrial temperature performance.

Designed for demanding embedded applications, this memory solution operates across an industrial temperature range of -25°C to 85°C and supports flexible voltage configurations (VCC: 3.3V, VCCQ: 1.8V/3.3V). With a 200 MHz clock frequency and 16G × 8 memory organization, the FEMC016GBE-T740 provides the storage capacity and throughput needed for modern IoT devices, industrial controllers, and embedded computing platforms.

Key Features

• 16GB Storage Capacity (128 Gbit)
  Provides ample non-volatile storage for firmware, operating systems, applications, and data logging in embedded systems, organized as 16G × 8 for efficient data management.
• eMMC 5.1 Interface
  Industry-standard eMMC 5.1 interface enables straightforward integration with a wide range of processors and controllers, simplifying design-in and ensuring broad ecosystem compatibility.
• 3D TLC NAND Technology
  Utilizes advanced 3D TLC (Triple-Level Cell) flash memory architecture, delivering high-density storage with cost-effective capacity suitable for data-intensive embedded applications.
• Industrial Temperature Range
  Qualified for operation from -25°C to 85°C, ensuring reliable performance in harsh environments including industrial automation, outdoor equipment, and transportation systems.
• Dual Voltage I/O Support
  Supports both 1.8V and 3.3V I/O voltage (VCCQ) with 3.3V core voltage (VCC), providing flexible integration with modern low-voltage designs as well as legacy 3.3V systems.
• 200 MHz Clock Frequency
  High-speed clock operation enables fast data transfer rates for responsive system performance in read-intensive and mixed workload applications.
• Compact Surface-Mount Package
  153-ball FBGA package offers space-efficient mounting for compact embedded designs where board real estate is at a premium.
• RoHS Compliant
  Meets environmental compliance standards for modern electronics manufacturing and global market distribution.

Typical Applications

• Industrial Automation and Control
  Provides reliable storage for PLCs, HMIs, and process controllers, storing configuration data, logs, and embedded operating systems in factory automation environments.
• IoT and Edge Computing Devices
  Enables local data storage and firmware management in connected sensors, gateways, and edge processing nodes that require persistent storage with industrial temperature resilience.
• Medical and Healthcare Equipment
  Stores patient data, device configurations, and operational logs in portable medical devices and diagnostic equipment where reliability and data integrity are critical.
• Digital Signage and Kiosks
  Supports content storage and system software for interactive displays, point-of-sale terminals, and self-service kiosks deployed in varied environmental conditions.
• Telecommunications Infrastructure
  Provides embedded storage for network equipment, base stations, and communication modules requiring dependable data retention across wide temperature ranges.

Unique Advantages

• Proven XTRA VII Series Platform
  Part of Flexxon's established XTRA VII Series (8GB to 256GB range), offering consistent architecture and qualification across capacity points for simplified platform scaling and long-term roadmap confidence.
• Industrial-Grade Reliability
  Extended temperature qualification (-25°C to 85°C) and industrial-grade components ensure dependable operation in environments where consumer-grade storage would fail, reducing field failures and warranty costs.
• Simplified Design Integration
  Standard eMMC 5.1 interface with well-documented register structure (OCR, CID, CSD, Extended CSD, RCA, DSR) accelerates development cycles and reduces integration risk through proven industry-standard protocols.
• Flexible Power Design
  Dual VCCQ voltage support (1.8V/3.3V) allows designers to match memory I/O levels to processor specifications, eliminating level-shifter components and reducing BOM complexity in mixed-voltage designs.
• Space-Optimized Footprint
  Compact 153-ball FBGA surface-mount package minimizes PCB area requirements compared to discrete flash solutions, enabling smaller product form factors without sacrificing storage capacity.
• Cost-Effective Capacity
  3D TLC technology delivers 16GB storage capacity at an attractive price point for applications requiring substantial data storage but where SLC endurance levels are not mandated.

Why Choose the FEMC016GBE-T740?

The FEMC016GBE-T740 combines proven eMMC 5.1 technology with industrial-grade environmental qualifications, making it an excellent choice for embedded system designers who need reliable, high-capacity storage that can withstand demanding operating conditions. The 16GB capacity addresses the growing storage requirements of modern embedded applications—from complex embedded Linux systems to data-logging applications—while the industrial temperature range and dual-voltage I/O support ensure broad applicability across diverse market segments.

For engineering teams developing industrial equipment, IoT platforms, or embedded computing products, the FEMC016GBE-T740 offers a well-balanced combination of capacity, performance, and environmental resilience backed by Flexxon's XTRA VII Series platform. The standard eMMC 5.1 interface and comprehensive register set simplify firmware development, while the surface-mount FBGA package streamlines manufacturing and supports automated assembly processes. Whether you're designing a single product or planning a scalable platform across multiple capacity points, this industrial-grade eMMC solution provides the storage foundation your embedded system requires.

Ready to integrate reliable industrial-grade storage into your next embedded design? Request a quote for the FEMC016GBE-T740 today to discuss volume pricing, lead times, and technical support for your specific application requirements. Our team is available to answer technical questions and help you evaluate this eMMC solution for your project.