FEMC016GBG-T34N

The FEMC016GBG-T34N from Flexxon is a 16GB embedded MultiMediaCard (eMMC) solution designed for demanding industrial applications. Built on advanced 3D TLC NAND technology and compliant with eMMC 5.1 and 4.x standards, this non-volatile flash memory module delivers reliable, high-performance data storage in a compact 153-ball FBGA package. With a 200 MHz clock frequency and industrial-grade temperature tolerance, the FEMC016GBG-T34N is engineered to meet the rigorous requirements of embedded systems in harsh environments.

As part of Flexxon's XTRA V Series, this eMMC module offers a proven balance of capacity, speed, and durability. Its surface-mount format and standardized eMMC interface simplify integration into a wide range of embedded designs, from industrial controllers to connected devices, where space, performance, and long-term reliability are critical.

Key Features

• 16GB Storage Capacity (128 Gbit)
  Provides ample non-volatile flash storage organized as 16G × 8, suitable for operating systems, applications, and data logging in embedded systems.
• eMMC 5.1 / 4.x Interface
  Industry-standard eMMC interface ensures broad compatibility with a wide range of host processors and controllers, enabling straightforward integration and reliable performance.
• 3D TLC NAND Technology
  Advanced three-dimensional Triple-Level Cell architecture delivers high density and cost-effective storage with robust endurance for industrial use cases.
• 200 MHz Clock Frequency
  High-speed operation supports fast read and write transactions, reducing system latency and improving overall application responsiveness.
• Industrial Temperature Range
  Rated for operation from –25°C to 85°C, this module is built to withstand demanding thermal environments commonly found in industrial, transportation, and outdoor equipment.
• Flexible Voltage Supply
  Supports dual I/O voltage levels (VCCQ: 1.8V/3.3V) and 3.3V core supply (VCC), offering compatibility with diverse system power architectures.
• Compact 153-FBGA Package
  Surface-mount 153-ball Fine-pitch Ball Grid Array package provides a small footprint, enabling space-efficient designs in size-constrained embedded applications.
• RoHS Compliant
  Meets environmental compliance standards, ensuring suitability for global markets and environmentally responsible manufacturing.

Typical Applications

• Industrial Automation and Control Systems
  Provides reliable storage for programmable logic controllers (PLCs), human-machine interfaces (HMIs), and industrial PCs operating in factory and process control environments.
• Transportation and Fleet Management
  Serves as embedded storage in telematics units, in-vehicle infotainment systems, and onboard diagnostic equipment exposed to wide temperature swings and vibration.
• Connected IoT Devices
  Enables local data logging, firmware storage, and buffering in smart gateways, edge computing nodes, and connected sensors deployed in field environments.
• Medical and Diagnostic Equipment
  Offers dependable non-volatile storage for patient data, system logs, and operating software in portable and stationary medical devices requiring industrial-grade reliability.
• Digital Signage and Kiosks
  Supports multimedia content storage and system operation in commercial displays and self-service terminals installed in diverse indoor and semi-outdoor locations.

Unique Advantages

• Proven Industrial Reliability: Designed and tested for industrial-grade operation, the FEMC016GBG-T34N delivers consistent performance across the extended temperature range, reducing risk of field failures in harsh environments.
• Standards-Based Integration: Full compliance with eMMC 5.1 and backward compatibility with eMMC 4.x simplifies design-in, reduces validation time, and ensures interoperability with a broad ecosystem of host controllers.
• Space-Efficient Design: The compact 153-ball FBGA footprint minimizes board space requirements, enabling higher component density and more flexible PCB layouts in space-constrained embedded products.
• High-Speed Data Access: Operating at 200 MHz clock frequency, this eMMC module supports rapid boot times, fast application loading, and efficient data throughput, enhancing overall system responsiveness.
• Flexible Power Architecture: Dual I/O voltage support (1.8V/3.3V) allows seamless integration into both legacy and modern low-power system designs, optimizing power management flexibility.
• Environmentally Responsible: RoHS compliance ensures the module meets global environmental regulations, supporting responsible sourcing and end-of-life considerations for manufacturers and OEMs.

Why Choose the FEMC016GBG-T34N?

The FEMC016GBG-T34N is an ideal embedded storage solution for engineers and product designers who require proven reliability, straightforward integration, and industrial-grade performance. Its combination of 16GB capacity, eMMC 5.1 interface, and 3D TLC technology provides a balanced platform for demanding applications where data integrity, environmental resilience, and long-term availability are essential. The industrial temperature rating and compact surface-mount package make it well-suited for deployment in equipment exposed to challenging operating conditions.

Backed by Flexxon's XTRA V Series heritage and comprehensive technical documentation, the FEMC016GBG-T34N offers a reliable, cost-effective storage foundation for your next embedded design. Whether you are developing industrial controllers, transportation systems, or connected devices, this eMMC module delivers the performance and dependability your application demands.

Ready to integrate the FEMC016GBG-T34N into your design? Contact our sales team today to request a quote, discuss volume pricing, or obtain technical support for your specific application requirements.