FEMC016GBA-T740

The FEMC016GBA-T740 from Flexxon is a high-performance 16GB embedded MultiMediaCard (eMMC) 5.1 flash memory module designed to meet the demanding requirements of automotive and industrial applications. Built on advanced 3D TLC NAND technology and organized as 16G × 8, this non-volatile memory solution delivers reliable storage with a 200 MHz clock frequency and AEC-Q100 Grade 3 qualification for automotive environments.

Housed in a compact 153-ball FBGA surface-mount package, the FEMC016GBA-T740 is part of Flexxon's XTRA VIII Series, offering robust performance across an extended temperature range of -40°C to 85°C. With dual voltage supply support and eMMC 5.1 interface compatibility, this memory module provides the storage capacity and reliability needed for next-generation automotive infotainment systems, advanced driver assistance systems, industrial controllers, and embedded computing platforms.

Key Features

• 16GB Storage Capacity
  Provides 128 Gbit (16GB) of non-volatile flash memory with 16G × 8 organization, delivering ample storage for operating systems, applications, data logging, and multimedia content in embedded systems.
• eMMC 5.1 Interface
  Complies with the eMMC 5.1 standard, enabling high-speed data transfer at 200 MHz clock frequency for responsive system performance and efficient data access in demanding applications.
• 3D TLC NAND Technology
  Utilizes advanced three-dimensional triple-level cell flash memory architecture for high density and cost-effective storage while maintaining reliable performance characteristics.
• Automotive-Grade Qualification
  AEC-Q100 Grade 3 qualified for automotive applications, ensuring reliable operation in the challenging electrical, thermal, and mechanical environments typical of automotive systems.
• Extended Temperature Range
  Operates reliably across -40°C to 85°C, making it suitable for automotive, industrial, and outdoor applications where ambient temperatures vary significantly.
• Flexible Voltage Supply
  Supports dual voltage operation with VCCQ at 1.8V/3.3V and VCC at 3.3V, providing design flexibility and compatibility with various host controller configurations.
• Compact Surface-Mount Package
  Available in a space-efficient 153-ball FBGA package optimized for surface-mount assembly, enabling high-density board layouts and automated manufacturing processes.
• RoHS Compliant
  Meets RoHS environmental compliance standards, supporting green manufacturing initiatives and regulatory requirements for electronic products.

Typical Applications

• Automotive Infotainment Systems
  Provides reliable storage for navigation maps, media libraries, user preferences, and system firmware in dashboard displays and entertainment systems operating in automotive temperature ranges.
• Advanced Driver Assistance Systems (ADAS)
  Stores calibration data, configuration parameters, and operational logs for ADAS applications including camera systems, sensor fusion platforms, and autonomous driving functions.
• Industrial Control Systems
  Serves as embedded storage for programmable logic controllers, human-machine interfaces, and edge computing devices in factory automation, process control, and industrial IoT applications.
• Transportation Electronics
  Delivers dependable data storage for fleet management systems, telematics units, electronic logging devices, and ruggedized computing platforms in commercial and public transportation vehicles.
• Outdoor and Harsh Environment Applications
  Enables reliable operation in outdoor networking equipment, environmental monitoring systems, and ruggedized embedded computers exposed to wide temperature fluctuations and demanding conditions.

Unique Advantages

• Automotive-Qualified Reliability
  AEC-Q100 Grade 3 qualification provides confidence for automotive system designers, with proven reliability testing and quality standards specific to vehicle electronics applications.
• Proven XTRA VIII Architecture
  Part of Flexxon's XTRA VIII Series of eMMC solutions spanning 8GB to 128GB capacities, enabling scalable platform designs and consistent supply chain management across multiple product variants.
• Simplified Integration
  Standard eMMC 5.1 interface and 153-ball FBGA footprint simplify board design and reduce development time, with broad compatibility across established host controller platforms and operating systems.
• Wide Operating Temperature Performance
  The -40°C to 85°C operational range eliminates the need for additional thermal management in many automotive and industrial applications, reducing system complexity and cost.
• Non-Volatile Data Retention
  Flash memory technology ensures data persistence without continuous power, critical for storing configuration, calibration, and operational data in embedded systems with power cycling requirements.
• Manufacturing-Ready Package
  Surface-mount 153-ball FBGA package is designed for high-volume automated assembly with established reflow processes, supporting efficient production scaling and consistent quality.

Why Choose FEMC016GBA-T740?

The FEMC016GBA-T740 combines the storage capacity, interface performance, and environmental robustness required for modern automotive and industrial embedded systems. With AEC-Q100 Grade 3 qualification and an extended -40°C to 85°C operating range, this eMMC solution addresses the reliability demands of applications where failure is not an option. The standard eMMC 5.1 interface and compact 153-FBGA package enable straightforward integration into existing designs while supporting the storage needs of increasingly complex embedded applications.

For design teams developing automotive electronics, industrial controls, or ruggedized embedded systems, the FEMC016GBA-T740 offers a qualified, proven memory solution backed by Flexxon's expertise in automotive-grade storage. The XTRA VIII Series architecture provides a clear upgrade path as storage requirements grow, while RoHS compliance ensures alignment with environmental regulations and corporate sustainability goals.

Ready to integrate reliable automotive-grade storage into your next design? Contact our technical sales team today to request detailed specifications, pricing information, and sample availability for the FEMC016GBA-T740. Our embedded memory specialists can help you evaluate this solution for your specific application requirements and provide the technical support needed to accelerate your development timeline.