FEMC016GBB-T740

The FEMC016GBB-T740 is a 16GB embedded MultiMediaCard (eMMC) 5.1 flash memory solution from Flexxon's XTRA VIII Series, engineered for demanding embedded applications. Built with 3D TLC NAND technology in a compact 153-ball FBGA package, this automotive-grade memory device delivers reliable, high-performance non-volatile storage with an extended operating temperature range of -40°C to 105°C.

Designed for systems requiring robust data retention and high-speed access, the FEMC016GBB-T740 combines a 200 MHz clock frequency with eMMC 5.1 interface capabilities. Its AEC-Q100 Grade 2 qualification and automotive-grade reliability make it suitable for harsh-environment applications where data integrity and operational stability are critical. The device operates with flexible voltage supply options (VCCQ: 1.8V/3.3V, VCC: 3.3V) and is fully RoHS compliant.

Key Features

• 16GB Storage Capacity (128 Gbit)
  Organized as 16G × 8, providing ample non-volatile storage for embedded systems, data logging, firmware, and application code in a compact footprint.
• eMMC 5.1 Interface
  Industry-standard interface operating at 200 MHz clock frequency enables high-speed data transfer and simplified integration with host processors and SoCs.
• 3D TLC NAND Technology
  Advanced three-dimensional triple-level cell architecture delivers increased storage density and improved endurance compared to planar NAND solutions.
• Automotive-Grade Qualification
  AEC-Q100 Grade 2 certified for automotive applications, ensuring reliable operation across extended temperature ranges and rigorous environmental conditions.
• Extended Temperature Range
  Operates reliably from -40°C to 105°C, suitable for industrial, automotive, and outdoor applications subject to temperature extremes.
• Flexible Voltage Supply
  Supports dual I/O voltage (VCCQ: 1.8V/3.3V) and 3.3V core voltage (VCC), enabling compatibility with a wide range of host systems and power architectures.
• Compact Surface-Mount Package
  153-ball FBGA package provides space-efficient mounting for size-constrained designs while maintaining robust signal integrity and thermal performance.
• RoHS Compliant
  Meets environmental compliance standards for lead-free manufacturing and global market distribution.

Typical Applications

• Automotive Infotainment and Telematics
  Ideal for in-vehicle infotainment systems, navigation units, and telematics modules requiring reliable data storage in automotive temperature ranges with AEC-Q100 Grade 2 qualification.
• Industrial Control Systems
  Provides robust embedded storage for PLCs, industrial gateways, and control modules operating in harsh environments with temperature extremes from -40°C to 105°C.
• Medical Devices
  Supports diagnostic equipment, portable medical instruments, and patient monitoring systems requiring reliable non-volatile memory for data logging and firmware storage.
• Transportation and Fleet Management
  Enables black box recorders, fleet tracking devices, and vehicle diagnostics systems with dependable data retention across wide temperature ranges.
• Embedded Computing Platforms
  Serves as boot and storage media for single-board computers, embedded modules, and edge computing devices requiring eMMC 5.1 interface compatibility.

Unique Advantages

• Automotive-Qualified Reliability: AEC-Q100 Grade 2 certification ensures the memory meets stringent automotive industry standards for quality and reliability, reducing risk in safety-critical and long-lifecycle applications.
• Wide Operating Temperature Range: The -40°C to 105°C temperature specification eliminates the need for additional thermal management in many applications, simplifying system design and reducing BOM costs.
• Proven eMMC 5.1 Standard: Industry-standard interface ensures broad compatibility with existing host controllers and SoCs, accelerating time-to-market and reducing integration risk.
• 3D NAND Technology Benefits: Advanced 3D TLC architecture provides improved reliability and endurance compared to older planar NAND solutions while maintaining cost-effectiveness at 16GB capacity.
• Dual Voltage I/O Support: Flexible VCCQ voltage support (1.8V/3.3V) enables seamless integration with both legacy 3.3V systems and modern low-power 1.8V designs without level shifters.
• Compact, Space-Efficient Form Factor: The 153-ball FBGA package maximizes storage capacity per board area, critical for space-constrained embedded and automotive applications.

Why Choose the FEMC016GBB-T740?

The FEMC016GBB-T740 combines automotive-grade reliability with the proven performance of the eMMC 5.1 standard, making it an optimal choice for embedded systems requiring dependable non-volatile storage in challenging environments. Its AEC-Q100 Grade 2 qualification and extended -40°C to 105°C operating range ensure consistent operation where commercial-grade memory would fail, while the 200 MHz clock frequency and 16GB capacity meet the demands of modern data-intensive applications.

As part of Flexxon's XTRA VIII Series, this device benefits from comprehensive technical documentation and a robust product roadmap spanning 8GB to 128GB capacities. Whether you're designing automotive electronics, industrial control systems, or rugged embedded platforms, the FEMC016GBB-T740 delivers the combination of performance, reliability, and environmental resilience required for long-lifecycle applications.

Ready to integrate the FEMC016GBB-T740 into your next design? Contact our technical sales team to request a quote, discuss volume pricing, or obtain engineering samples. Our team can provide detailed technical support to ensure seamless integration of this automotive-grade eMMC solution into your application.