FEMC016GCB-E540

AXO 5.1 153ball eMMC (3D TLC/3D pSLC)
Part Description

FEMC016GCB-E540 16GB eMMC 5.1 3D pSLC

Quantity 1,120 Available (as of May 4, 2026)
Product CategoryMemory
ManufacturerFlexxon
Manufacturing StatusActive
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package153-FBGAMemory FormatFLASHTechnology3D pSLC
Memory Size128 GbitGradeAutomotive grade 2Clock Frequency200 MHz
VoltageVCCQ: 1.8V/3.3V VCC: 3.3VMemory TypeNon-VolatileOperating Temperature-25°C - 85°C
Packaging153-FBGAMounting MethodSurface MountMemory InterfaceeMMC 5.1
Memory Organization16G x 8Moisture Sensitivity Level3RoHS ComplianceCompliant
REACH ComplianceREACH UnknownQualificationAEC-Q100 Grade 2ECCNEAR99
HTS Code8542.32.00.71

Overview of FEMC016GCB-E540 – 16GB Automotive-Grade eMMC 5.1 with 3D pSLC Technology

The FEMC016GCB-E540 is a high-performance 16GB embedded MultiMediaCard (eMMC) 5.1 storage solution from Flexxon's AXO series, engineered with advanced 3D pseudo-Single Level Cell (pSLC) NAND flash technology. This automotive-grade memory device delivers 128 Gbit of non-volatile storage organized as 16G × 8, operating at 200 MHz clock frequency to provide fast, reliable data access for mission-critical embedded applications.

Qualified to AEC-Q100 Grade 2 standards, the FEMC016GCB-E540 is designed specifically for automotive and industrial systems requiring exceptional endurance, data retention, and reliability across extended temperature ranges. Its 3D pSLC technology delivers superior write performance and significantly longer lifespan compared to conventional MLC or TLC solutions, making it ideal for demanding environments where data integrity and longevity are paramount.

Key Features

  • 16GB 3D pSLC NAND Flash Memory
    Provides 128 Gbit of non-volatile storage using advanced 3D pseudo-Single Level Cell technology, delivering enhanced endurance and reliability compared to traditional multi-level cell architectures. The 16G × 8 memory organization ensures efficient data management for embedded applications.
  • eMMC 5.1 Interface with 200 MHz Clock Speed
    Industry-standard eMMC 5.1 interface operating at 200 MHz clock frequency provides fast data transfer rates and simplified integration with host processors. This proven interface standard reduces design complexity and accelerates time-to-market.
  • Automotive-Grade Qualification
    AEC-Q100 Grade 2 qualified for automotive applications, meeting stringent reliability and quality standards. Operates across an extended temperature range of -25°C to 85°C, ensuring stable performance in harsh automotive and industrial environments.
  • Flexible Voltage Supply Options
    Supports dual voltage operation with VCCQ at 1.8V or 3.3V and VCC at 3.3V, providing design flexibility and compatibility with a wide range of host systems and power architectures.
  • Compact 153-FBGA Package
    Surface-mount 153-ball Fine-Pitch Ball Grid Array package delivers a small footprint for space-constrained designs while maintaining robust electrical performance and thermal characteristics.
  • RoHS Compliant
    Fully compliant with RoHS environmental standards, supporting green manufacturing initiatives and global regulatory requirements.

Typical Applications

  • Automotive Infotainment Systems
    Provides reliable storage for multimedia content, navigation data, and operating systems in automotive head units and entertainment consoles, with automotive-grade qualification ensuring long-term reliability in vehicle environments.
  • Advanced Driver Assistance Systems (ADAS)
    Serves as dependable data storage for sensor fusion algorithms, calibration data, and system logs in ADAS applications where data integrity and rapid access are critical for safety-related functions.
  • Industrial Control Systems
    Delivers robust, long-life storage for firmware, configuration data, and operational logs in industrial automation equipment, PLCs, and HMI terminals operating in extended temperature environments.
  • In-Vehicle Network Devices
    Supports gateway controllers, telematics units, and vehicle communication modules requiring reliable non-volatile memory for protocol stacks, security credentials, and diagnostic data.
  • Rugged Embedded Computing
    Ideal for embedded systems in transportation, energy, and infrastructure applications where extended temperature operation, high write endurance, and automotive-grade reliability are essential.

Unique Advantages

  • Superior Endurance with 3D pSLC Technology:
    The 3D pseudo-Single Level Cell architecture dramatically extends write/erase cycles compared to MLC or TLC flash, reducing maintenance requirements and extending product lifespan in write-intensive applications.
  • Automotive-Qualified Reliability:
    AEC-Q100 Grade 2 qualification ensures the FEMC016GCB-E540 meets rigorous automotive industry standards for quality, reliability, and longevity, providing confidence for safety-critical and long-lifecycle automotive designs.
  • Extended Temperature Performance:
    Guaranteed operation from -25°C to 85°C enables deployment in demanding environmental conditions common in automotive engine compartments, industrial machinery, and outdoor equipment installations.
  • Simplified Integration:
    Standard eMMC 5.1 interface and JEDEC-compliant electrical specifications streamline design-in processes, reduce validation time, and ensure compatibility with a broad ecosystem of processors and development tools.
  • Optimized for Embedded Systems:
    The 153-ball FBGA surface-mount package and flexible voltage options enable compact, cost-effective PCB layouts while supporting both legacy 3.3V and modern 1.8V I/O voltage domains.
  • Environmental Compliance:
    RoHS-compliant construction supports global market access and demonstrates commitment to environmentally responsible manufacturing practices.

Why Choose the FEMC016GCB-E540?

The FEMC016GCB-E540 combines automotive-grade reliability, advanced 3D pSLC flash technology, and industry-standard eMMC 5.1 connectivity to deliver a robust storage solution for demanding embedded applications. Engineers designing automotive systems, industrial equipment, or ruggedized computing platforms will appreciate the combination of AEC-Q100 qualification, extended temperature operation, and superior write endurance that addresses the most challenging requirements of long-lifecycle products.

With its proven eMMC 5.1 interface and 153-ball FBGA package, the FEMC016GCB-E540 offers straightforward integration while the 3D pSLC technology ensures exceptional data retention and reliability over the product's operational lifetime. Whether you're developing next-generation automotive electronics or industrial control systems, this Flexxon AXO series eMMC provides the performance, endurance, and qualification necessary for mission-critical embedded storage applications.

Ready to integrate automotive-grade storage into your next design? Request a quote today to learn more about pricing and availability for the FEMC016GCB-E540, or contact our team to discuss how this high-endurance eMMC solution can meet your specific application requirements.

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    Date Founded: 2007


    Headquarters: Singapore


    Employees: 51-200


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