FEMC016GME-E430

The FEMC016GME-E430 is a high-capacity 16GB embedded MultiMediaCard (eMMC) solution from Flexxon's XTRA III Series, designed specifically for industrial applications requiring reliable, non-volatile storage. Built on MLC (Multi-Level Cell) NAND flash technology and compliant with the eMMC 5.1 standard, this 100-ball FBGA device delivers robust performance across extended temperature ranges. With a 200 MHz clock frequency and flexible dual-voltage I/O support, the FEMC016GME-E430 provides an integrated storage solution that simplifies embedded system design while meeting the demanding requirements of industrial environments.

Engineered for applications where data integrity, temperature resilience, and long-term availability are critical, this industrial-grade eMMC offers 128 Gbit of storage organized as 16G × 8, combining high sequential throughput with the reliability needed for mission-critical deployments. The device operates from -25°C to 85°C and is fully RoHS compliant, making it suitable for a wide range of embedded computing platforms including industrial controllers, medical devices, networking equipment, and IoT gateways.

Key Features

• Industrial-Grade Temperature Range
  Operates reliably across -25°C to 85°C, ensuring consistent performance in harsh environmental conditions including factory automation, transportation systems, and outdoor equipment installations.
• High-Capacity 16GB Storage
  Provides 128 Gbit (16GB) of non-volatile flash memory organized as 16G × 8, offering ample space for operating systems, applications, data logging, and firmware storage in embedded systems.
• eMMC 5.1 Interface Compliance
  Implements the eMMC 5.1 specification with 200 MHz clock frequency support, delivering high-speed sequential read and write performance while maintaining backward compatibility with standard eMMC host controllers.
• MLC NAND Technology
  Utilizes Multi-Level Cell flash technology from the XTRA III Series, balancing storage density, endurance, and cost-effectiveness for industrial applications requiring reliable long-term data retention.
• Flexible Dual-Voltage I/O
  Supports both 1.8V and 3.3V signaling on VCCQ while operating at 3.3V VCC, providing compatibility with a broad range of host processors and system architectures without requiring additional level-shifting circuitry.
• Compact 100-Ball FBGA Package
  Surface-mount 100-ball Fine-pitch Ball Grid Array package minimizes board footprint, enabling space-efficient designs in size-constrained embedded applications while providing robust mechanical connection.
• RoHS Compliant
  Meets environmental compliance standards for lead-free manufacturing, supporting green initiatives and regulatory requirements across global markets.

Typical Applications

• Industrial Automation and Control
  Provides reliable embedded storage for programmable logic controllers (PLCs), human-machine interfaces (HMIs), and industrial PCs requiring rugged, temperature-tolerant memory solutions for firmware, configuration data, and operational logging.
• Medical Devices and Instrumentation
  Serves as the primary storage medium in diagnostic equipment, patient monitoring systems, and portable medical devices where data integrity, long-term reliability, and consistent performance across varying environmental conditions are essential.
• Networking and Communication Equipment
  Supports routers, switches, gateways, and telecommunications infrastructure by storing firmware, configuration files, and system logs in environments subject to extended temperature ranges and continuous operation requirements.
• Transportation and Telematics
  Enables onboard data storage in fleet management systems, vehicle diagnostics, digital signage, and transportation infrastructure where industrial temperature ratings and vibration tolerance are critical.
• IoT Edge Devices and Gateways
  Offers integrated storage for edge computing platforms, industrial IoT gateways, and smart sensors requiring local data buffering, firmware hosting, and operating system storage in compact, thermally challenging environments.

Unique Advantages

• Simplified System Integration: The eMMC 5.1 standard interface eliminates the need for external NAND flash controllers, reducing component count, design complexity, and time-to-market while improving overall system reliability through proven, industry-standard protocols.
• Extended Temperature Reliability: The -25°C to 85°C operating range addresses the demanding thermal environments found in industrial settings, ensuring data availability and performance consistency where commercial-grade components would fail or require additional thermal management.
• Dual-Voltage Compatibility: Support for both 1.8V and 3.3V I/O signaling provides design flexibility across diverse host processor platforms, enabling system architects to optimize power consumption or maintain compatibility with legacy interfaces without additional external components.
• Proven Industrial Pedigree: As part of Flexxon's XTRA III Series specifically developed for industrial applications, this eMMC benefits from design practices, testing protocols, and quality standards tailored to the longevity and reliability requirements of commercial and industrial deployments.
• Space-Efficient Form Factor: The compact 100-ball FBGA package delivers high storage capacity in minimal board area, enabling designers to maximize functionality within constrained enclosures or add storage capability to existing designs without significant layout redesign.
• Environmental Compliance: RoHS compliance ensures compatibility with global environmental regulations and corporate sustainability initiatives, reducing supply chain complexity and supporting green product development strategies.

Why Choose the FEMC016GME-E430?

The FEMC016GME-E430 represents a purpose-built storage solution for industrial embedded systems where standard commercial components cannot meet the environmental, reliability, and integration requirements of mission-critical applications. By combining 16GB of MLC flash capacity with industrial-grade temperature tolerance, eMMC 5.1 interface performance, and flexible voltage compatibility, this device addresses the core challenges facing embedded system designers: reducing component count, ensuring operational reliability across harsh conditions, and accelerating development cycles through standards-based integration.

For engineers developing industrial controllers, medical instrumentation, networking infrastructure, or IoT edge devices, the FEMC016GME-E430 offers the combination of proven technology, environmental resilience, and integration simplicity needed to deliver robust products with confidence. Backed by Flexxon's focus on industrial memory solutions and packaged in a compact, surface-mount form factor, this eMMC provides the foundation for reliable embedded storage in applications where failure is not an option and long-term availability is essential.

Ready to integrate reliable industrial-grade storage into your next embedded design? Request a detailed quote for the FEMC016GME-E430 today to discuss volume pricing, technical specifications, and how this industrial eMMC solution can meet your specific application requirements. Our team is available to provide technical support and help you select the optimal storage configuration for your project.