FEMC016GMG-E430

The FEMC016GMG-E430 is a high-performance 16GB embedded MultiMediaCard (eMMC) 5.1 flash storage solution from Flexxon's XTRA III series. Built with Multi-Level Cell (MLC) NAND technology and packaged in a compact 100-ball FBGA, this industrial-grade memory module delivers reliable non-volatile storage for embedded systems requiring robust performance across extended temperature ranges. Designed for industrial applications, this eMMC module integrates controller and flash memory in a single package, simplifying system design while providing the high-speed interface and endurance needed for demanding embedded computing environments.

Operating at clock frequencies up to 200 MHz and supporting dual-voltage I/O (1.8V/3.3V VCCQ), the FEMC016GMG-E430 provides flexible integration options for a wide range of industrial control systems, automation equipment, and embedded platforms. With its industrial temperature rating of -25°C to 85°C and RoHS-compliant construction, this memory solution is engineered to deliver consistent performance in challenging operational environments where reliability and longevity are critical.

Key Features

• 16GB Storage Capacity
  Organized as 128 Gbit (16G × 8) providing substantial non-volatile storage for embedded operating systems, applications, and data logging in industrial systems.
• eMMC 5.1 Interface
  Standards-compliant eMMC 5.1 interface operating at up to 200 MHz clock frequency enables high sequential read and write performance for demanding embedded applications.
• MLC NAND Technology
  Multi-Level Cell flash technology delivers an optimal balance of storage density, performance, and endurance suitable for industrial embedded applications requiring reliable long-term operation.
• Industrial Temperature Range
  Qualified for operation from -25°C to 85°C, ensuring reliable performance in industrial automation, control systems, and other environments subject to temperature variation.
• Dual-Voltage I/O Support
  Supports both 1.8V and 3.3V VCCQ I/O signaling with 3.3V VCC core supply, providing flexible integration with various host controller architectures and reducing design complexity.
• Compact 100-Ball FBGA Package
  Surface-mount 100-ball Fine-pitch Ball Grid Array package minimizes board space requirements while providing reliable connections for industrial operating conditions.
• RoHS Compliant
  Fully compliant with environmental regulations, supporting green manufacturing initiatives and global market requirements.

Typical Applications

• Industrial Automation and Control
  Provides reliable embedded storage for programmable logic controllers (PLCs), human-machine interfaces (HMIs), and industrial PCs requiring robust non-volatile memory for operating systems, control programs, and operational data.
• Embedded Computing Platforms
  Serves as boot and application storage in embedded single-board computers, system-on-module designs, and edge computing devices where compact form factor and industrial temperature operation are essential.
• Transportation and Fleet Management
  Delivers dependable storage for telematics systems, vehicle data recorders, and fleet monitoring equipment operating in extended temperature environments with high reliability requirements.
• Medical and Healthcare Equipment
  Supports embedded storage needs in diagnostic equipment, patient monitoring systems, and portable medical devices where data integrity and operational reliability are critical.
• Communication Infrastructure
  Provides non-volatile storage for network equipment, wireless access points, and communication controllers requiring industrial-grade memory solutions with proven endurance.

Unique Advantages

• Integrated Controller Solution
  Combines NAND flash and integrated controller in a single package, eliminating the need for external flash management and simplifying board design while reducing component count and system cost.
• Extended Temperature Operation
  Industrial-grade temperature rating from -25°C to 85°C ensures reliable operation in harsh environments where consumer-grade memory solutions may fail, reducing field failure rates and maintenance costs.
• Standards-Based eMMC 5.1 Interface
  Implements industry-standard eMMC 5.1 specification ensuring broad compatibility with existing host controllers and eliminating proprietary interface concerns for long-term product support.
• Flexible Voltage Configuration
  Dual I/O voltage support (1.8V/3.3V VCCQ) accommodates various system architectures without additional level shifters, reducing BOM cost and simplifying power management design.
• Compact Surface-Mount Design
  100-ball FBGA package delivers high storage capacity in minimal board space, enabling more compact product designs and reducing overall system size for space-constrained applications.
• Proven MLC Technology
  MLC NAND provides reliable write endurance characteristics suitable for industrial applications with balanced write/erase cycles, offering better longevity than TLC solutions for embedded systems.

Why Choose the FEMC016GMG-E430?

The FEMC016GMG-E430 from Flexxon's XTRA III series represents a proven industrial embedded memory solution combining the performance of eMMC 5.1 interface technology with the reliability required for demanding embedded applications. Its industrial temperature rating, dual-voltage I/O flexibility, and integrated controller architecture make it an ideal choice for design engineers developing industrial control systems, embedded computing platforms, and specialized equipment requiring dependable non-volatile storage. The 16GB capacity provides ample space for complex embedded operating systems and applications while the compact 100-ball FBGA package enables space-efficient designs.

For industrial equipment manufacturers and embedded system designers, the FEMC016GMG-E430 offers long-term reliability backed by RoHS compliance and industrial-grade qualification. The standards-based eMMC 5.1 interface ensures compatibility with a broad ecosystem of host controllers and development tools, reducing integration risk and accelerating time-to-market. Whether designing next-generation industrial automation equipment, ruggedized embedded computing systems, or specialized instrumentation, this memory solution delivers the performance, reliability, and design flexibility required for successful product deployment.

Ready to integrate the FEMC016GMG-E430 into your next industrial design? Request a quote today to discuss your specific application requirements, volume pricing, and delivery options. Our team is available to provide technical support and help you select the optimal memory configuration for your embedded system needs.