FEMC032GBA-E530

The FEMC032GBA-E530 is a high-capacity embedded MultiMediaCard (eMMC) 5.1 storage solution from Flexxon's AXO Series, delivering 32GB (256 Gbit) of reliable non-volatile flash memory in a compact 100-ball FBGA package. Built on advanced 3D TLC NAND technology and compliant with JEDEC eMMC 5.1 standards, this embedded storage module integrates a flash controller and memory array into a single, surface-mount component designed for industrial applications.

Engineered for embedded systems requiring substantial local storage with proven reliability, the FEMC032GBA-E530 provides AEC-Q100 Grade 3 qualification and automotive-grade performance across an operating temperature range of -25°C to 85°C. Its standardized eMMC 5.1 interface running at 200 MHz ensures broad compatibility and simplified integration into a wide range of industrial, automotive, and commercial electronics platforms.

Key Features

• 32GB Storage Capacity (256 Gbit)
  Organized as 32G × 8, providing ample space for operating systems, applications, data logging, and multimedia content in embedded designs.
• eMMC 5.1 Interface
  Fully compliant with JEDEC eMMC 5.1 standard, offering a proven, industry-standard interface with 200 MHz clock frequency for reliable data transfer and broad ecosystem support.
• 3D TLC NAND Technology
  Utilizes advanced three-dimensional triple-level cell flash architecture for high density and cost-effective storage in a compact footprint.
• Automotive-Grade Qualification
  AEC-Q100 Grade 3 qualified, meeting stringent automotive industry reliability and quality standards for demanding embedded applications.
• Dual Voltage I/O Support
  Flexible I/O voltage (VCCQ) support for both 1.8V and 3.3V interfaces with 3.3V core supply (VCC), enabling compatibility with diverse system architectures and power designs.
• Extended Operating Temperature Range
  Rated for operation from -25°C to 85°C, ensuring reliable performance in industrial environments and automotive cabin conditions.
• Compact 100-Ball FBGA Package
  Surface-mount 100-FBGA package provides a small form factor ideal for space-constrained embedded designs while maintaining robust signal integrity.
• RoHS Compliant
  Fully compliant with RoHS environmental standards for lead-free manufacturing and reduced environmental impact.

Typical Applications

• Automotive Infotainment Systems
  Provides reliable storage for navigation databases, multimedia content, user interface software, and system firmware in automotive dashboard and entertainment consoles operating across wide temperature ranges.
• Industrial Control and Automation
  Serves as embedded storage for programmable logic controllers (PLCs), human-machine interfaces (HMIs), and industrial PCs requiring dependable data retention and operating system hosting in factory environments.
• Smart Appliances and IoT Devices
  Enables local storage for firmware, configuration data, and logging in connected home appliances, smart building systems, and Internet of Things edge devices requiring compact, integrated memory solutions.
• Medical and Healthcare Equipment
  Supports embedded storage needs in diagnostic devices, patient monitoring systems, and medical imaging equipment where reliability and data integrity are critical.
• Transportation and Fleet Management
  Ideal for vehicle telematics, fleet tracking systems, digital tachographs, and transportation data recorders requiring robust storage in mobile and vibration-prone environments.

Unique Advantages

• Highly Integrated Storage Solution:
  Combines flash controller and memory array in a single component, eliminating the need for external controllers and simplifying board design while reducing BOM count and overall system complexity.
• Standards-Based Reliability:
  JEDEC eMMC 5.1 compliance ensures proven interoperability, mature driver support across major operating systems, and design confidence through industry-standard implementation.
• Automotive-Qualified Robustness:
  AEC-Q100 Grade 3 qualification provides assurance of rigorous testing for automotive and harsh-environment applications, supporting designs that demand high reliability and extended service life.
• Flexible Power Architecture:
  Dual I/O voltage support (1.8V/3.3V) allows designers to match existing system power rails without additional level translation, reducing power management complexity and component count.
• Temperature-Hardened Performance:
  Specified operation from -25°C to 85°C covers industrial temperature requirements and automotive cabin environments, ensuring consistent performance across seasonal and geographic variations.
• Cost-Effective Capacity:
  3D TLC technology delivers 32GB of storage capacity with favorable economics for applications requiring substantial embedded storage without premium SLC pricing.

Why Choose the FEMC032GBA-E530?

The FEMC032GBA-E530 represents a proven, standards-based approach to embedded storage for industrial and automotive applications. With its AEC-Q100 Grade 3 qualification, extended temperature range, and eMMC 5.1 compliance, this module delivers the reliability and compatibility required for mission-critical embedded systems. The combination of 32GB capacity, dual voltage I/O support, and compact FBGA packaging makes it an excellent choice for designs balancing storage requirements, board space constraints, and long-term product availability.

Engineers and procurement teams working on industrial control systems, automotive electronics, medical devices, and smart connected products will appreciate the simplified integration, mature ecosystem support, and qualification rigor that the FEMC032GBA-E530 brings to embedded storage design. Flexxon's AXO Series provides a scalable family of eMMC solutions (16GB to 512GB) supporting platform designs across multiple product tiers.

Ready to integrate reliable embedded storage into your next design? Request a quote for the FEMC032GBA-E530 today to discuss your specific capacity, qualification, and volume requirements with our team.