FEMC128GBG-T34N

XTRA V 5.1 153ball eMMC (3D TLC/3D pSLC)
Part Description

FEMC128GBG-T34N 128GB eMMC 5.1 / 4.x 3D TLC

Quantity 1,919 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerFlexxon
Manufacturing StatusActive
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package153-FBGAMemory FormatFLASHTechnology3D TLC
Memory Size1.024 TbitGradeIndustrialClock Frequency200 MHz
VoltageVCCQ: 1.8V/3.3V VCC: 3.3VMemory TypeNon-VolatileOperating Temperature-25°C - 85°C
Packaging153-FBGAMounting MethodSurface MountMemory InterfaceeMMC 5.1 / 4.x
Memory Organization128G x 8Moisture Sensitivity Level3RoHS ComplianceCompliant
REACH ComplianceREACH UnknownQualificationN/AECCNEAR99
HTS Code8542.32.00.71

Overview of FEMC128GBG-T34N – 128GB Industrial-Grade eMMC 5.1 Embedded Flash Memory

The FEMC128GBG-T34N from Flexxon's XTRA V Series is a high-capacity 128GB embedded MultiMediaCard (eMMC) solution designed for demanding industrial applications. Built on advanced 3D TLC NAND flash technology, this 153-ball FBGA device delivers reliable non-volatile storage with eMMC 5.1 and 4.x interface compatibility. Engineered to operate across an extended temperature range of -25°C to 85°C, the FEMC128GBG-T34N is ideal for embedded systems requiring robust, long-term data retention in industrial environments.

With a 200 MHz clock frequency and flexible voltage supply options (VCCQ: 1.8V/3.3V, VCC: 3.3V), this industrial-grade eMMC module provides designers with a compact, surface-mount memory solution that simplifies board design while delivering the performance and reliability required for mission-critical embedded applications.

Key Features

  • High-Capacity Storage
    128GB (1.024 Tbit) of non-volatile flash memory organized as 128G × 8, providing ample storage for operating systems, applications, data logging, and multimedia content in space-constrained embedded designs.
  • eMMC 5.1 / 4.x Interface
    Standards-compliant embedded MultiMediaCard interface ensures broad compatibility with modern embedded processors and system-on-chip designs, offering straightforward integration with proven protocol support.
  • 3D TLC NAND Technology
    Advanced three-dimensional triple-level cell flash architecture delivers high storage density and improved endurance compared to planar NAND, enabling cost-effective solutions for industrial data storage applications.
  • 200 MHz Clock Frequency
    Fast clock operation supports high-throughput data transfers, reducing system latency and improving overall application responsiveness for read and write operations.
  • Flexible Voltage Support
    Dual voltage supply options (VCCQ: 1.8V/3.3V, VCC: 3.3V) provide compatibility with a wide range of host platforms and enable power optimization based on system requirements.
  • Industrial Temperature Range
    Qualified for operation from -25°C to 85°C, ensuring reliable performance in harsh industrial environments including manufacturing equipment, transportation systems, and outdoor installations.
  • Compact 153-Ball FBGA Package
    Surface-mount 153-FBGA package delivers high storage capacity in a space-efficient footprint, ideal for designs where board real estate is at a premium.
  • RoHS Compliant
    Meets environmental compliance requirements for lead-free manufacturing and global market deployment.

Typical Applications

  • Industrial Control Systems
    Provides reliable embedded storage for PLCs, HMIs, and industrial PCs where rugged operation and data integrity are essential in factory automation and process control environments.
  • Medical Equipment
    Delivers dependable non-volatile storage for medical imaging systems, patient monitoring devices, and diagnostic equipment requiring long-term data retention and industrial-grade reliability.
  • Transportation and Fleet Management
    Ideal for telematics systems, fleet monitoring devices, and transportation infrastructure where extended temperature operation and reliable data logging are critical requirements.
  • Network and Communication Infrastructure
    Supports routers, gateways, base stations, and edge computing devices requiring robust embedded storage for firmware, configuration data, and local buffering in telecommunications applications.
  • Industrial IoT and Edge Computing
    Enables data collection, local analytics, and system operation in connected industrial devices and edge computing platforms deployed in challenging environmental conditions.

Unique Advantages

  • Proven Industrial Reliability:
    Industrial-grade qualification and extended temperature support ensure consistent performance in demanding environments where consumer-grade memory solutions would fail.
  • Simplified System Design:
    Integrated eMMC controller handles wear leveling, bad block management, and error correction internally, reducing host processor overhead and accelerating time-to-market.
  • Standards-Based Integration:
    JEDEC-compliant eMMC 5.1 / 4.x interface provides plug-and-play compatibility with existing embedded processor ecosystems, minimizing software development effort and integration risk.
  • Cost-Effective High Capacity:
    3D TLC NAND technology delivers 128GB of storage capacity at an attractive price point, enabling feature-rich applications without compromising budget constraints.
  • Flexible Power Architecture:
    Multiple voltage supply options allow designers to match memory interface voltage to system architecture, optimizing power consumption and simplifying voltage regulation design.
  • Long-Term Availability:
    Industrial series designation indicates extended product lifecycle support, providing supply chain stability for applications requiring multi-year production runs.

Why Choose the FEMC128GBG-T34N?

The FEMC128GBG-T34N combines high-capacity 3D TLC flash storage with industrial-grade reliability in a compact, standards-based package. Flexxon's XTRA V Series is engineered specifically for embedded systems requiring robust performance across extended temperature ranges, making this eMMC solution ideal for industrial control, medical, transportation, and infrastructure applications where reliability cannot be compromised.

With its eMMC 5.1 / 4.x interface compatibility, 200 MHz operation, and 153-ball FBGA form factor, the FEMC128GBG-T34N provides embedded system designers with a proven, easy-to-integrate storage solution backed by industrial qualification. Whether you're developing next-generation industrial equipment or upgrading existing platforms, this 128GB eMMC module delivers the capacity, performance, and durability your application demands.

Ready to integrate reliable industrial-grade storage into your next embedded design? Request a quote for the FEMC128GBG-T34N today and discover how Flexxon's XTRA V Series eMMC solutions can enhance your product's performance and longevity. Our technical team is available to assist with your specific application requirements and integration questions.

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