FEMC128GBE-E540

AXO 5.1 153ball eMMC (3D TLC/3D pSLC)
Part Description

FEMC128GBE-E540 128GB eMMC 5.1 3D TLC

Quantity 1,980 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerFlexxon
Manufacturing StatusActive
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package153-FBGAMemory FormatFLASHTechnology3D TLC
Memory Size1.024 TbitGradeIndustrialClock Frequency200 MHz
VoltageVCCQ: 1.8V/3.3V VCC: 3.3VMemory TypeNon-VolatileOperating Temperature-25°C - 85°C
Packaging153-FBGAMounting MethodSurface MountMemory InterfaceeMMC 5.1
Memory Organization128G x 8Moisture Sensitivity Level3RoHS ComplianceCompliant
REACH ComplianceREACH UnknownQualificationN/AECCNEAR99
HTS Code8542.32.00.71

Overview of FEMC128GBE-E540 – 128GB Industrial-Grade eMMC 5.1 Flash Storage

The FEMC128GBE-E540 is a high-capacity 128GB embedded MultiMediaCard (eMMC 5.1) storage solution from Flexxon's AXO series, designed to deliver reliable non-volatile flash memory for demanding industrial applications. Built with advanced 3D TLC NAND technology in a compact 153-ball FBGA package, this memory module provides robust data storage with eMMC 5.1 interface compatibility, enabling straightforward integration into embedded systems requiring persistent storage.

Engineered for industrial environments, the FEMC128GBE-E540 operates reliably across a wide temperature range of -25°C to 85°C, making it ideal for applications in automation, transportation systems, medical devices, and industrial computing where consistent performance and data integrity are critical requirements.

Key Features

  • High-Capacity 3D TLC Flash Storage
    Delivers 128GB (1.024 Tbit) of non-volatile memory organized as 128G × 8, providing ample storage for operating systems, application code, data logging, and multimedia content in space-constrained embedded designs.
  • eMMC 5.1 Interface
    Features industry-standard eMMC 5.1 protocol with 200 MHz clock frequency, ensuring broad compatibility with modern embedded processors and SoCs while simplifying board design and firmware development.
  • Flexible Voltage Support
    Supports dual I/O voltage operation with VCCQ at 1.8V or 3.3V and VCC at 3.3V, enabling integration with diverse system architectures and power management schemes without additional level shifters.
  • Industrial Temperature Range
    Qualified for operation from -25°C to 85°C, ensuring reliable performance in harsh industrial environments subject to temperature extremes, vibration, and extended operational lifetimes.
  • Compact Surface-Mount Package
    Housed in a space-efficient 153-ball FBGA package designed for surface mount assembly, minimizing PCB footprint and enabling high-density board layouts in size-constrained embedded applications.
  • RoHS Compliant
    Fully compliant with RoHS environmental regulations, supporting sustainable design practices and simplifying compliance for global market deployment.

Typical Applications

  • Industrial Automation and Control
    Provides reliable program storage and data logging for PLCs, industrial PCs, HMIs, and edge computing devices that require persistent memory in factory automation, process control, and robotics applications.
  • Transportation and Telematics Systems
    Serves as embedded storage for fleet management devices, transportation controllers, navigation systems, and onboard diagnostics equipment operating in demanding temperature conditions and requiring long-term data retention.
  • Medical and Healthcare Equipment
    Enables secure storage of patient data, system firmware, and diagnostic logs in medical instrumentation, patient monitoring devices, and portable healthcare equipment where reliability and data integrity are paramount.
  • Digital Signage and Kiosks
    Supports multimedia content storage and system operation for interactive kiosks, digital signage displays, and point-of-sale terminals deployed in commercial environments with extended operational hours.
  • Embedded Computing Platforms
    Functions as boot storage and application memory for single-board computers, embedded modules, and IoT gateways requiring industrial-grade storage in compact form factors.

Unique Advantages

  • Proven Industrial Reliability
    Industrial-grade qualification with extended temperature range ensures consistent operation in harsh environments where consumer-grade storage would fail, reducing field failures and warranty costs.
  • Simplified System Integration
    Standard eMMC 5.1 interface and dual-voltage I/O support enable drop-in compatibility with a wide range of embedded processors, accelerating development cycles and reducing design complexity.
  • Space-Efficient Design
    Compact 153-ball FBGA package minimizes PCB real estate requirements, enabling smaller product form factors and higher component density on embedded system boards.
  • 3D NAND Technology
    Advanced 3D TLC NAND architecture delivers high storage density with improved endurance characteristics compared to planar NAND, supporting applications with moderate to high write cycle requirements.
  • Long-Term Availability
    Part of Flexxon's AXO industrial eMMC series, ensuring consistent supply and product longevity for designs requiring extended product lifecycles and stable bill-of-materials management.
  • Environmental Compliance
    RoHS compliance simplifies regulatory requirements for global market distribution and supports corporate sustainability initiatives without compromising performance or reliability.

Why Choose the FEMC128GBE-E540?

The FEMC128GBE-E540 combines high storage capacity, industrial-grade reliability, and standards-based integration in a compact package optimized for demanding embedded applications. Its 128GB capacity addresses the growing storage requirements of modern embedded systems running complex operating systems and storing significant data volumes, while the eMMC 5.1 interface ensures compatibility with current-generation embedded processors and straightforward software integration.

For engineers developing industrial equipment, transportation systems, medical devices, or other mission-critical embedded products, the FEMC128GBE-E540 provides a reliable storage foundation that operates consistently across wide temperature ranges and demanding environmental conditions. Its industrial qualification, flexible voltage support, and compact footprint make it an excellent choice for designs prioritizing longevity, robustness, and efficient use of board space.

Ready to integrate reliable industrial-grade storage into your embedded design? Request a quote today to learn more about the FEMC128GBE-E540 and how Flexxon's AXO series can meet your application requirements. Our team is available to discuss volume pricing, technical specifications, and delivery options tailored to your project timeline.

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    Headquarters: Singapore


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