FEMC128GBB-T740

The FEMC128GBB-T740 from Flexxon is a high-capacity 128GB embedded MultiMediaCard (eMMC) 5.1 memory solution built on advanced 3D TLC NAND flash technology. Designed for demanding automotive and industrial applications, this non-volatile memory device delivers reliable data storage in a compact 153-ball FBGA package. With AEC-Q100 Grade 2 qualification and an extended operating temperature range of -40°C to 105°C, the FEMC128GBB-T740 provides robust performance where traditional storage solutions cannot.

As part of Flexxon's XTRA VIII Series, this eMMC module combines high storage density with automotive-grade reliability, making it ideal for advanced driver assistance systems, infotainment platforms, industrial controllers, and embedded computing applications that require both capacity and environmental resilience.

Key Features

• High-Capacity 3D TLC NAND Flash
  128GB (1.024 Tbit) of non-volatile storage organized as 128G × 8, providing ample space for operating systems, applications, multimedia content, and data logging in embedded systems.
• eMMC 5.1 Interface
  Industry-standard eMMC 5.1 interface operating at 200 MHz clock frequency ensures broad compatibility with modern processors and microcontrollers while delivering reliable data transfer performance.
• Automotive-Grade Qualification
  AEC-Q100 Grade 2 qualified for automotive applications with an extended operating temperature range of -40°C to 105°C, ensuring reliable operation in harsh environmental conditions including automotive cockpit and engine compartment installations.
• Dual Voltage Support
  Flexible power supply options with VCC at 3.3V and VCCQ supporting both 1.8V and 3.3V operation, enabling compatibility with diverse system architectures and reducing design constraints.
• Compact 153-Ball FBGA Package
  Surface-mount 153-FBGA package delivers high storage capacity in a small footprint, optimizing board space utilization for space-constrained embedded designs.
• 3D TLC Technology
  Advanced three-dimensional triple-level cell architecture provides an optimal balance between storage density, cost-efficiency, and performance for mainstream automotive and industrial applications.
• RoHS Compliant
  Fully compliant with RoHS environmental regulations, supporting environmentally responsible manufacturing and global market requirements.

Typical Applications

• Automotive Infotainment Systems
  Provides high-capacity storage for navigation databases, multimedia content, user profiles, and operating systems in dashboard displays and rear-seat entertainment systems.
• Advanced Driver Assistance Systems (ADAS)
  Stores calibration data, mapping information, firmware, and configuration parameters for camera-based driver assistance and semi-autonomous driving features.
• Industrial Control and Automation
  Enables reliable data logging, firmware storage, and configuration management in industrial PLCs, HMIs, and factory automation equipment operating in extended temperature environments.
• Embedded Computing Platforms
  Serves as primary boot storage and application memory for embedded Linux, Android, and RTOS-based computing platforms in transportation, medical, and industrial equipment.
• Commercial Vehicle Telematics
  Supports fleet management systems, GPS tracking devices, and digital tachographs requiring robust storage solutions that withstand vibration and temperature extremes.

Unique Advantages

• Proven Automotive Reliability:
  AEC-Q100 Grade 2 qualification ensures the FEMC128GBB-T740 meets stringent automotive industry requirements for quality, reliability, and environmental performance, reducing risk in safety-critical and mission-critical applications.
• Extended Temperature Performance:
  -40°C to 105°C operational range enables deployment in extreme environments from cold-start automotive conditions to high-temperature industrial enclosures without performance degradation.
• Simplified System Integration:
  Industry-standard eMMC 5.1 interface and 153-ball FBGA footprint streamline design-in with established reference designs and reduce time-to-market for new product development.
• Flexible Power Architecture:
  Dual VCCQ voltage support (1.8V/3.3V) provides design flexibility for both legacy 3.3V systems and modern low-power 1.8V platforms, simplifying migration paths and multi-platform designs.
• Space-Efficient Storage:
  High storage density in a compact surface-mount package maximizes available board space for additional functionality while meeting size constraints in automotive and portable applications.
• Long-Term Availability:
  Part of Flexxon's established XTRA VIII Series product line, providing confidence in supply continuity and long-term support for products with extended lifecycles typical of automotive and industrial markets.

Why Choose the FEMC128GBB-T740?

The FEMC128GBB-T740 delivers the intersection of high capacity, automotive-grade reliability, and thermal performance required by today's most demanding embedded applications. Its AEC-Q100 Grade 2 qualification and extended temperature range make it particularly well-suited for automotive OEMs and Tier 1 suppliers developing next-generation vehicle systems, while industrial designers benefit from the same proven reliability for factory automation and harsh-environment deployments.

Built on Flexxon's XTRA VIII platform with proven 3D TLC technology, this eMMC solution offers a dependable foundation for embedded systems that must operate reliably over long product lifecycles. The combination of industry-standard interfaces, flexible power options, and compact packaging ensures straightforward integration into both new designs and platform upgrades, making the FEMC128GBB-T740 an ideal choice for engineers seeking proven, automotive-qualified storage with ample capacity.

Ready to integrate reliable, automotive-grade storage into your next embedded design? Request a quote for the FEMC128GBB-T740 today to discuss your specific application requirements, volume pricing, and technical support options for your project.