FEMC128GBA-E540
| Part Description |
FEMC128GBA-E540 128GB eMMC 5.1 3D TLC |
|---|---|
| Quantity | 1,957 Available (as of May 4, 2026) |
Specifications & Environmental
| Device Package | 153-FBGA | Memory Format | FLASH | Technology | 3D TLC | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 1.024 Tbit | Grade | Automotive grade 3 | Clock Frequency | 200 MHz | ||
| Voltage | VCCQ: 1.8V/3.3V VCC: 3.3V | Memory Type | Non-Volatile | Operating Temperature | -25°C - 85°C | ||
| Packaging | 153-FBGA | Mounting Method | Surface Mount | Memory Interface | eMMC 5.1 | ||
| Memory Organization | 128G x 8 | Moisture Sensitivity Level | 3 | RoHS Compliance | Compliant | ||
| REACH Compliance | REACH Unknown | Qualification | AEC-Q100 Grade 3 | ECCN | EAR99 | ||
| HTS Code | 8542.32.00.71 |
Overview of FEMC128GBA-E540 – 128GB Automotive-Grade eMMC 5.1 Flash Memory
The FEMC128GBA-E540 is a high-capacity 128GB embedded MultiMediaCard (eMMC) 5.1 flash storage solution from Flexxon's AXO series. Built with 3D TLC NAND technology in a compact 153-ball FBGA package, this non-volatile memory device delivers reliable, high-performance storage for embedded systems requiring robust data retention and fast access speeds. Organized as 128G × 8 with a 200 MHz clock frequency, it provides the performance headroom needed for data-intensive automotive, industrial, and connected device applications.
Qualified to AEC-Q100 Grade 3 standards and rated for -25°C to 85°C operation, the FEMC128GBA-E540 is engineered for automotive-grade reliability in environments where consistent performance, temperature resilience, and long-term data integrity are essential. Its eMMC 5.1 interface ensures broad compatibility with modern embedded processors while simplifying integration and reducing time-to-market.
Key Features
- 128GB Capacity with 3D TLC NAND Technology
Delivers 1.024 Tbit of non-volatile flash storage using advanced 3D TLC architecture, providing a compelling balance of density, cost-efficiency, and endurance for embedded applications requiring substantial local storage. - eMMC 5.1 Interface at 200 MHz
Compliant with the eMMC 5.1 specification and operating at up to 200 MHz clock frequency, enabling high sequential read/write throughput and efficient random access performance for multimedia, logging, and firmware storage tasks. - Automotive-Grade Qualification (AEC-Q100 Grade 3)
Meets AEC-Q100 Grade 3 standards with an operating temperature range of -25°C to 85°C, ensuring reliable operation in automotive cockpit, infotainment, telematics, and industrial control environments where temperature cycling and long-term reliability are critical. - Dual-Voltage I/O Support
Features flexible VCCQ support for both 1.8V and 3.3V I/O signaling with VCC at 3.3V, enabling straightforward integration with a wide range of host processors and system architectures without the need for level shifters. - Compact 153-Ball FBGA Package
Surface-mount 153-FBGA package offers a small footprint and optimized pin-out for space-constrained PCB designs, supporting high-density board layouts in automotive dashboards, head units, and embedded controllers. - RoHS Compliant
Fully compliant with RoHS environmental standards, supporting green manufacturing initiatives and regulatory requirements for lead-free, environmentally responsible product designs.
Typical Applications
- Automotive Infotainment and Navigation Systems
Provides high-capacity local storage for maps, multimedia content, user profiles, and firmware updates in automotive head units and instrument clusters, delivering the performance and reliability needed for seamless user experiences. - Telematics and Vehicle Data Logging
Ideal for recording trip data, diagnostics, sensor logs, and event data in telematics control units and black-box recorders, where non-volatile storage and wide temperature tolerance are essential for field deployment. - Industrial Control and Automation
Supports embedded storage for PLCs, HMIs, and industrial gateways requiring robust, high-capacity flash memory for configuration data, event logs, firmware images, and local caching in harsh industrial environments. - Connected IoT and Edge Computing Devices
Enables local data buffering, firmware storage, and application deployment in edge gateways, smart city infrastructure, and connected appliances where reliable, high-capacity eMMC storage simplifies system architecture.
Unique Advantages
- Proven Automotive-Grade Reliability
AEC-Q100 Grade 3 qualification ensures the FEMC128GBA-E540 meets stringent automotive reliability and quality standards, reducing risk and simplifying certification for automotive OEMs and tier-1 suppliers. - Simplified Integration with eMMC 5.1 Standard
The eMMC 5.1 interface is widely supported by embedded processors and microcontrollers, minimizing software porting effort, leveraging mature driver ecosystems, and accelerating time-to-market for new designs. - High Capacity in a Compact Footprint
128GB of storage in a space-efficient 153-FBGA package reduces board real estate requirements and enables sleeker, more integrated product designs without sacrificing storage performance or capacity. - Wide Operating Temperature Range
Rated for -25°C to 85°C operation, this device maintains consistent performance across the temperature extremes encountered in automotive cabins, under-hood environments, and industrial installations, ensuring data integrity and system uptime. - Flexible Voltage I/O for Design Versatility
Dual VCCQ support (1.8V/3.3V) enables designers to match the memory I/O voltage to their host processor signaling levels, simplifying power domain management and reducing external component count. - Cost-Effective 3D TLC Architecture
Leveraging 3D TLC NAND technology, the FEMC128GBA-E540 delivers a strong balance of capacity, performance, and cost, making it an attractive choice for volume production where storage density and budget are both critical factors.
Why Choose the FEMC128GBA-E540?
The FEMC128GBA-E540 combines automotive-grade reliability, high capacity, and industry-standard eMMC 5.1 connectivity in a compact, easy-to-integrate package. Its AEC-Q100 Grade 3 qualification, wide operating temperature range, and flexible I/O voltage support make it an ideal storage solution for automotive infotainment, telematics, industrial control, and connected IoT applications where robust, high-performance non-volatile memory is essential. Flexxon's AXO series delivers proven quality and consistency, backed by comprehensive technical documentation and a scalable product roadmap spanning 16GB to 512GB capacities.
For design teams seeking to reduce integration complexity, lower system cost, and ensure long-term supply and support, the FEMC128GBA-E540 offers a compelling combination of capacity, performance, and automotive-grade durability. Its standardized interface and compact footprint streamline both initial development and future product upgrades, providing a solid foundation for next-generation embedded systems.
Ready to integrate the FEMC128GBA-E540 into your next design? Contact our sales team today to request a quote, discuss volume pricing, or obtain engineering samples for evaluation. We're here to support your project from prototype to production.

Date Founded: 2007
Headquarters: Singapore
Employees: 51-200
Revenue: NA
Certifications and Memberships: ISO9001:2015