FEMC128GBA-E540

AXO 5.1 153ball eMMC (3D TLC/3D pSLC)
Part Description

FEMC128GBA-E540 128GB eMMC 5.1 3D TLC

Quantity 1,957 Available (as of May 4, 2026)
Product CategoryMemory
ManufacturerFlexxon
Manufacturing StatusActive
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package153-FBGAMemory FormatFLASHTechnology3D TLC
Memory Size1.024 TbitGradeAutomotive grade 3Clock Frequency200 MHz
VoltageVCCQ: 1.8V/3.3V VCC: 3.3VMemory TypeNon-VolatileOperating Temperature-25°C - 85°C
Packaging153-FBGAMounting MethodSurface MountMemory InterfaceeMMC 5.1
Memory Organization128G x 8Moisture Sensitivity Level3RoHS ComplianceCompliant
REACH ComplianceREACH UnknownQualificationAEC-Q100 Grade 3ECCNEAR99
HTS Code8542.32.00.71

Overview of FEMC128GBA-E540 – 128GB Automotive-Grade eMMC 5.1 Flash Memory

The FEMC128GBA-E540 is a high-capacity 128GB embedded MultiMediaCard (eMMC) 5.1 flash storage solution from Flexxon's AXO series. Built with 3D TLC NAND technology in a compact 153-ball FBGA package, this non-volatile memory device delivers reliable, high-performance storage for embedded systems requiring robust data retention and fast access speeds. Organized as 128G × 8 with a 200 MHz clock frequency, it provides the performance headroom needed for data-intensive automotive, industrial, and connected device applications.

Qualified to AEC-Q100 Grade 3 standards and rated for -25°C to 85°C operation, the FEMC128GBA-E540 is engineered for automotive-grade reliability in environments where consistent performance, temperature resilience, and long-term data integrity are essential. Its eMMC 5.1 interface ensures broad compatibility with modern embedded processors while simplifying integration and reducing time-to-market.

Key Features

  • 128GB Capacity with 3D TLC NAND Technology
    Delivers 1.024 Tbit of non-volatile flash storage using advanced 3D TLC architecture, providing a compelling balance of density, cost-efficiency, and endurance for embedded applications requiring substantial local storage.
  • eMMC 5.1 Interface at 200 MHz
    Compliant with the eMMC 5.1 specification and operating at up to 200 MHz clock frequency, enabling high sequential read/write throughput and efficient random access performance for multimedia, logging, and firmware storage tasks.
  • Automotive-Grade Qualification (AEC-Q100 Grade 3)
    Meets AEC-Q100 Grade 3 standards with an operating temperature range of -25°C to 85°C, ensuring reliable operation in automotive cockpit, infotainment, telematics, and industrial control environments where temperature cycling and long-term reliability are critical.
  • Dual-Voltage I/O Support
    Features flexible VCCQ support for both 1.8V and 3.3V I/O signaling with VCC at 3.3V, enabling straightforward integration with a wide range of host processors and system architectures without the need for level shifters.
  • Compact 153-Ball FBGA Package
    Surface-mount 153-FBGA package offers a small footprint and optimized pin-out for space-constrained PCB designs, supporting high-density board layouts in automotive dashboards, head units, and embedded controllers.
  • RoHS Compliant
    Fully compliant with RoHS environmental standards, supporting green manufacturing initiatives and regulatory requirements for lead-free, environmentally responsible product designs.

Typical Applications

  • Automotive Infotainment and Navigation Systems
    Provides high-capacity local storage for maps, multimedia content, user profiles, and firmware updates in automotive head units and instrument clusters, delivering the performance and reliability needed for seamless user experiences.
  • Telematics and Vehicle Data Logging
    Ideal for recording trip data, diagnostics, sensor logs, and event data in telematics control units and black-box recorders, where non-volatile storage and wide temperature tolerance are essential for field deployment.
  • Industrial Control and Automation
    Supports embedded storage for PLCs, HMIs, and industrial gateways requiring robust, high-capacity flash memory for configuration data, event logs, firmware images, and local caching in harsh industrial environments.
  • Connected IoT and Edge Computing Devices
    Enables local data buffering, firmware storage, and application deployment in edge gateways, smart city infrastructure, and connected appliances where reliable, high-capacity eMMC storage simplifies system architecture.

Unique Advantages

  • Proven Automotive-Grade Reliability
    AEC-Q100 Grade 3 qualification ensures the FEMC128GBA-E540 meets stringent automotive reliability and quality standards, reducing risk and simplifying certification for automotive OEMs and tier-1 suppliers.
  • Simplified Integration with eMMC 5.1 Standard
    The eMMC 5.1 interface is widely supported by embedded processors and microcontrollers, minimizing software porting effort, leveraging mature driver ecosystems, and accelerating time-to-market for new designs.
  • High Capacity in a Compact Footprint
    128GB of storage in a space-efficient 153-FBGA package reduces board real estate requirements and enables sleeker, more integrated product designs without sacrificing storage performance or capacity.
  • Wide Operating Temperature Range
    Rated for -25°C to 85°C operation, this device maintains consistent performance across the temperature extremes encountered in automotive cabins, under-hood environments, and industrial installations, ensuring data integrity and system uptime.
  • Flexible Voltage I/O for Design Versatility
    Dual VCCQ support (1.8V/3.3V) enables designers to match the memory I/O voltage to their host processor signaling levels, simplifying power domain management and reducing external component count.
  • Cost-Effective 3D TLC Architecture
    Leveraging 3D TLC NAND technology, the FEMC128GBA-E540 delivers a strong balance of capacity, performance, and cost, making it an attractive choice for volume production where storage density and budget are both critical factors.

Why Choose the FEMC128GBA-E540?

The FEMC128GBA-E540 combines automotive-grade reliability, high capacity, and industry-standard eMMC 5.1 connectivity in a compact, easy-to-integrate package. Its AEC-Q100 Grade 3 qualification, wide operating temperature range, and flexible I/O voltage support make it an ideal storage solution for automotive infotainment, telematics, industrial control, and connected IoT applications where robust, high-performance non-volatile memory is essential. Flexxon's AXO series delivers proven quality and consistency, backed by comprehensive technical documentation and a scalable product roadmap spanning 16GB to 512GB capacities.

For design teams seeking to reduce integration complexity, lower system cost, and ensure long-term supply and support, the FEMC128GBA-E540 offers a compelling combination of capacity, performance, and automotive-grade durability. Its standardized interface and compact footprint streamline both initial development and future product upgrades, providing a solid foundation for next-generation embedded systems.

Ready to integrate the FEMC128GBA-E540 into your next design? Contact our sales team today to request a quote, discuss volume pricing, or obtain engineering samples for evaluation. We're here to support your project from prototype to production.

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