FEMC064GCG-T34N
| Part Description |
FEMC064GCG-T34N 64GB eMMC 5.1 / 4.x 3D pSLC |
|---|---|
| Quantity | 1,480 Available (as of May 5, 2026) |
Specifications & Environmental
| Device Package | 153-FBGA | Memory Format | FLASH | Technology | 3D pSLC | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Gbit | Grade | Industrial | Clock Frequency | 200 MHz | ||
| Voltage | VCCQ: 1.8V/3.3V VCC: 3.3V | Memory Type | Non-Volatile | Operating Temperature | -25°C - 85°C | ||
| Packaging | 153-FBGA | Mounting Method | Surface Mount | Memory Interface | eMMC 5.1 / 4.x | ||
| Memory Organization | 64G x 8 | Moisture Sensitivity Level | 3 | RoHS Compliance | Compliant | ||
| REACH Compliance | REACH Unknown | Qualification | N/A | ECCN | EAR99 | ||
| HTS Code | 8542.32.00.71 |
Overview of FEMC064GCG-T34N – 64GB Industrial-Grade 3D pSLC eMMC Memory Solution
The FEMC064GCG-T34N is a high-performance 64GB embedded MultiMediaCard (eMMC) storage solution from Flexxon's XTRA V Series. Built on advanced 3D pseudo-SLC (pSLC) NAND flash technology, this industrial-grade memory device delivers the reliability and endurance required for demanding embedded applications. Supporting both eMMC 5.1 and 4.x interfaces with a 200 MHz clock frequency, the FEMC064GCG-T34N provides robust non-volatile storage in a compact 153-ball FBGA surface-mount package.
Designed for industrial environments with an operating temperature range of -25°C to 85°C, this memory solution combines high capacity with the enhanced write endurance and data retention characteristics of 3D pSLC technology. With flexible voltage support (VCC: 3.3V, VCCQ: 1.8V/3.3V) and RoHS compliance, the FEMC064GCG-T34N is engineered to meet the storage needs of industrial controllers, embedded computing platforms, and mission-critical systems that demand long-term reliability.
Key Features
- 64GB Storage Capacity
512 Gbit (64G × 8 organization) of non-volatile flash memory provides ample space for operating systems, applications, data logging, and firmware storage in embedded systems. - 3D pSLC Technology
Pseudo-SLC architecture delivers superior write endurance, faster write speeds, and improved data retention compared to standard MLC or TLC flash, making it ideal for write-intensive industrial applications. - eMMC 5.1 / 4.x Interface Compatibility
Supports both eMMC 5.1 and legacy 4.x standards with 200 MHz clock frequency, ensuring compatibility with a wide range of host processors and system designs while delivering high-speed data transfer. - Industrial Temperature Range
Rated for operation from -25°C to 85°C, this memory solution maintains reliable performance across the demanding thermal conditions found in industrial automation, transportation systems, and outdoor installations. - Flexible Voltage Support
Dual voltage I/O capability (VCCQ: 1.8V/3.3V) with 3.3V core supply (VCC) enables integration with both modern low-voltage and legacy system architectures without additional level-shifting circuitry. - Compact 153-FBGA Package
Surface-mount 153-ball fine-pitch BGA package delivers high-density storage in a small footprint, optimizing board space utilization in space-constrained embedded designs. - RoHS Compliant
Meets RoHS environmental standards for reduced hazardous substances, supporting green manufacturing initiatives and regulatory compliance requirements.
Typical Applications
- Industrial Automation and Control Systems
Provides reliable, high-endurance storage for programmable logic controllers (PLCs), human-machine interfaces (HMIs), and industrial PCs that require frequent data logging and configuration updates. - Embedded Computing Platforms
Serves as boot media and primary storage for embedded Linux, Android, or real-time operating systems in single-board computers, gateways, and edge computing devices. - Transportation and Telematics
Supports data recording, firmware storage, and operating system requirements in railway systems, fleet management devices, and transportation infrastructure equipment operating across wide temperature ranges. - Medical and Test Equipment
Delivers dependable non-volatile storage for data acquisition systems, diagnostic equipment, and instrumentation requiring consistent write performance and long-term data retention. - Network and Communication Infrastructure
Enables firmware storage, configuration management, and local data buffering in routers, switches, base stations, and telecommunications equipment deployed in industrial environments.
Unique Advantages
- Enhanced Endurance Through pSLC Technology:
3D pSLC operation significantly extends write/erase cycle life compared to standard TLC flash, reducing replacement frequency and total cost of ownership in write-intensive applications. - Wide Temperature Reliability:
Industrial-grade temperature rating (-25°C to 85°C) ensures consistent operation in harsh environments without performance degradation, eliminating the need for temperature-controlled enclosures in many installations. - Backward-Compatible Interface:
Support for both eMMC 5.1 and 4.x standards protects your design investment by enabling use across current and legacy platforms, simplifying product line management and reducing inventory complexity. - Simplified Integration:
Standard eMMC interface with established command protocol and mature software ecosystem reduces development time and risk compared to raw NAND implementations requiring custom controllers and firmware. - Design Flexibility:
Dual I/O voltage support (1.8V/3.3V) allows direct connection to a broad range of processors and system-on-chip devices without additional voltage translation components, reducing BOM cost and board complexity. - Space-Efficient Form Factor:
Compact 153-ball FBGA package maximizes storage density per square millimeter of board space, enabling smaller product designs or freeing area for additional functionality.
Why Choose the FEMC064GCG-T34N?
The FEMC064GCG-T34N combines the capacity, performance, and reliability needed for industrial embedded storage applications. Its 3D pSLC technology addresses the endurance limitations of conventional flash while maintaining cost-effectiveness for 64GB capacity requirements. The industrial temperature rating, flexible voltage support, and standards-based eMMC interface make this device straightforward to integrate into new designs or as a drop-in upgrade for existing platforms requiring enhanced reliability.
Whether you're developing industrial controllers that log operational data continuously, embedded systems requiring robust boot media, or communication infrastructure needing reliable configuration storage, the FEMC064GCG-T34N delivers proven flash technology in a form factor optimized for embedded applications. Flexxon's XTRA V Series provides a scalable memory platform (8GB to 256GB) that supports your product roadmap as storage requirements evolve, backed by a manufacturer focused on industrial and embedded memory solutions.
Ready to enhance your design with industrial-grade 3D pSLC eMMC storage? Contact our sales team today to request a quote for the FEMC064GCG-T34N, discuss volume pricing, or receive technical support for your specific application requirements. Our team is ready to help you specify the right memory solution for your embedded system.

Date Founded: 2007
Headquarters: Singapore
Employees: 51-200
Revenue: NA
Certifications and Memberships: ISO9001:2015