FEMC064GCE-T740

XTRA VII 5.1 153ball eMMC (3D TLC/3D pSLC)
Part Description

FEMC064GCE-T740 64GB eMMC 5.1 3D pSLC

Quantity 1,279 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerFlexxon
Manufacturing StatusActive
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package153-FBGAMemory FormatFLASHTechnology3D pSLC
Memory Size512 GbitGradeIndustrialClock Frequency200 MHz
VoltageVCCQ: 1.8V/3.3V VCC: 3.3VMemory TypeNon-VolatileOperating Temperature-25°C - 85°C
Packaging153-FBGAMounting MethodSurface MountMemory InterfaceeMMC 5.1
Memory Organization64G x 8Moisture Sensitivity Level3RoHS ComplianceCompliant
REACH ComplianceREACH UnknownQualificationN/AECCNEAR99
HTS Code8542.32.00.71

Overview of FEMC064GCE-T740 – 64GB Industrial-Grade eMMC 5.1 Memory with 3D pSLC Technology

The FEMC064GCE-T740 is a high-performance 64GB embedded MultiMediaCard (eMMC) 5.1 storage solution from Flexxon's XTRA VII Series. Built on advanced 3D pSLC (pseudo-Single-Level Cell) technology, this industrial-grade memory device delivers enhanced reliability, superior endurance, and consistent performance across demanding operating conditions. Organized as 64G × 8 and housed in a compact 153-ball FBGA package, this memory solution is engineered for industrial applications requiring robust, long-life non-volatile storage.

Designed to operate reliably across an industrial temperature range of -25°C to 85°C, the FEMC064GCE-T740 supports flexible voltage configurations (VCCQ: 1.8V/3.3V, VCC: 3.3V) and operates at clock frequencies up to 200 MHz. This combination of industrial-grade specifications, enhanced pSLC durability, and eMMC 5.1 interface makes it an ideal storage solution for industrial IoT devices, embedded systems, edge computing platforms, and mission-critical applications where data integrity and longevity are paramount.

Key Features

  • 64GB Storage Capacity (512 Gbit)
    Provides ample non-volatile flash memory for data-intensive industrial applications, firmware storage, and embedded operating systems with room for extensive data logging and application requirements.
  • 3D pSLC Technology
    Advanced pseudo-Single-Level Cell architecture delivers superior endurance, enhanced data retention, and improved reliability compared to standard TLC configurations, extending operational lifespan in write-intensive industrial environments.
  • eMMC 5.1 Interface
    Standards-compliant embedded MultiMediaCard interface ensures broad compatibility with modern processors and SoCs while delivering high-speed data transfer performance at clock frequencies up to 200 MHz.
  • Industrial Temperature Range
    Qualified for operation from -25°C to 85°C, enabling reliable performance in harsh industrial environments, outdoor installations, and temperature-variable deployment scenarios.
  • Flexible Voltage Support
    Dual voltage support (VCCQ: 1.8V/3.3V, VCC: 3.3V) provides design flexibility and compatibility with a wide range of host systems and power architectures.
  • Compact 153-FBGA Package
    Surface-mount 153-ball Fine-pitch Ball Grid Array package delivers high-density integration in a space-efficient footprint, ideal for size-constrained embedded designs.
  • RoHS Compliant
    Meets environmental compliance requirements for lead-free manufacturing, supporting green design initiatives and global regulatory standards.

Typical Applications

  • Industrial IoT and Edge Computing
    Provides reliable, high-capacity storage for edge analytics devices, industrial gateways, and IoT sensor hubs requiring persistent data storage and firmware management in industrial environments.
  • Embedded Systems and Controllers
    Serves as primary storage for industrial controllers, HMI terminals, and embedded computers where enhanced endurance and industrial temperature qualification are essential for long-term reliability.
  • Medical and Healthcare Equipment
    Delivers dependable non-volatile storage for diagnostic equipment, patient monitoring systems, and medical imaging devices requiring data integrity and extended product lifecycles.
  • Transportation and Fleet Management
    Supports data logging, navigation systems, and vehicle telematics applications with industrial-grade reliability across wide temperature variations encountered in mobile deployments.
  • Industrial Automation and Robotics
    Enables program storage, configuration management, and operational data logging for programmable logic controllers, robotic systems, and automated manufacturing equipment.

Unique Advantages

  • Enhanced Endurance with 3D pSLC:
    The 3D pSLC technology architecture significantly extends write endurance compared to conventional TLC flash, reducing total cost of ownership in write-intensive applications and extending device service life.
  • Industrial-Grade Reliability:
    Temperature qualification from -25°C to 85°C combined with enhanced pSLC durability ensures consistent operation in challenging industrial environments where consumer-grade components would fail.
  • Simplified Integration:
    Standards-compliant eMMC 5.1 interface reduces design complexity and time-to-market by providing a well-supported, widely-adopted storage interface with mature driver and ecosystem support.
  • Optimized Power Efficiency:
    Dual voltage support and efficient flash architecture enable power-conscious designs, important for battery-operated industrial devices and energy-sensitive embedded applications.
  • Space-Efficient Design:
    The compact 153-FBGA surface-mount package minimizes PCB footprint while delivering 64GB of storage capacity, maximizing design density in space-constrained industrial and embedded products.
  • Long-Term Availability:
    As part of Flexxon's industrial XTRA VII Series, this component is positioned for extended product lifecycle support, critical for industrial designs requiring multi-year availability and consistency.

Why Choose the FEMC064GCE-T740?

The FEMC064GCE-T740 combines high-capacity storage, industrial-grade qualification, and advanced 3D pSLC reliability in a single, compact solution. For design engineers developing industrial equipment, edge computing platforms, or mission-critical embedded systems, this eMMC device delivers the endurance and environmental resilience required for long-life deployments. The 200 MHz clock frequency and eMMC 5.1 interface provide strong performance, while the -25°C to 85°C operating range and enhanced pSLC technology ensure reliable operation across demanding industrial conditions.

Whether you're designing next-generation industrial IoT gateways, ruggedized medical devices, or embedded automation controllers, the FEMC064GCE-T740 offers the proven reliability, sufficient capacity, and industrial qualification needed for professional applications. Backed by Flexxon's XTRA VII Series engineering and RoHS-compliant manufacturing, this memory solution provides the foundation for robust, long-lasting embedded storage architectures.

Ready to integrate industrial-grade eMMC storage into your next design? Request a quote for the FEMC064GCE-T740 today to discuss your specific application requirements, volume pricing, and technical support options. Our team is ready to help you select the optimal storage configuration for your embedded system.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 2007


    Headquarters: Singapore


    Employees: 51-200


    Revenue: NA


    Certifications and Memberships: ISO9001:2015


    Featured Products
    Latest News
    keyboard_arrow_up