FEMC064GCG-E530

AXO 5.1 100ball eMMC (3D TLC/3D pSLC)
Part Description

FEMC064GCG-E530 64GB eMMC 5.1 3D pSLC

Quantity 1,849 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerFlexxon
Manufacturing StatusActive
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package100-FBGAMemory FormatFLASHTechnology3D pSLC
Memory Size512 GbitGradeIndustrialClock Frequency200 MHz
VoltageVCCQ: 1.8V/3.3V VCC: 3.3VMemory TypeNon-VolatileOperating Temperature-25°C - 85°C
Packaging100-FBGAMounting MethodSurface MountMemory InterfaceeMMC 5.1
Memory Organization64G x 8Moisture Sensitivity Level3RoHS ComplianceCompliant
REACH ComplianceREACH UnknownQualificationN/AECCNEAR99
HTS Code8542.32.00.71

Overview of FEMC064GCG-E530 – Industrial 64GB eMMC 5.1 with 3D pSLC Technology

The FEMC064GCG-E530 is a 64GB industrial-grade embedded MultiMediaCard (eMMC) 5.1 solution from Flexxon's AXO Series, engineered with advanced 3D pseudo-Single Level Cell (pSLC) NAND technology. Designed for demanding embedded applications, this non-volatile flash memory module delivers enhanced reliability, extended endurance, and consistent performance across industrial temperature ranges. Operating at 200 MHz with dual voltage support and a compact 100-ball FBGA package, the FEMC064GCG-E530 provides an ideal storage solution for industrial control systems, embedded computing platforms, and mission-critical applications requiring robust data retention.

With its 3D pSLC architecture, this eMMC module offers significantly improved write endurance and data reliability compared to conventional TLC solutions, making it particularly well-suited for write-intensive applications. The FEMC064GCG-E530 combines high-capacity storage with the proven eMMC 5.1 interface standard, ensuring broad compatibility with modern embedded processors while maintaining the rugged characteristics demanded by industrial environments.

Key Features

  • 64GB Storage Capacity with 3D pSLC Technology
    512 Gbit (64GB) of non-volatile flash memory utilizing advanced 3D pseudo-Single Level Cell technology, providing superior endurance and reliability for write-intensive industrial applications compared to standard TLC configurations.
  • eMMC 5.1 Interface Standard
    Industry-standard eMMC 5.1 interface operating at 200 MHz clock frequency ensures broad compatibility with modern embedded processors and system-on-chip platforms, simplifying integration and reducing development time.
  • Industrial Temperature Range
    Qualified for operation from -25°C to 85°C, making this memory solution suitable for challenging industrial environments including factory automation, transportation systems, and outdoor installations.
  • Flexible Voltage Support
    Dual voltage operation with VCCQ supporting both 1.8V and 3.3V signaling, and VCC at 3.3V, providing design flexibility and compatibility with various host system architectures.
  • Compact 100-Ball FBGA Package
    Surface-mount 100-ball Fine-pitch Ball Grid Array package delivers high-density integration in a small footprint, optimizing board space utilization in space-constrained embedded designs.
  • 64G × 8 Memory Organization
    Organized as 64 gigabit by 8-bit architecture, providing efficient data access and straightforward address mapping for embedded system integration.
  • RoHS Compliant
    Fully compliant with RoHS environmental standards, supporting environmentally responsible design practices and global regulatory requirements.

Typical Applications

  • Industrial Control and Automation
    Provides reliable program storage, data logging, and firmware management for PLCs, industrial PCs, and factory automation controllers operating in harsh environments with extended temperature ranges.
  • Embedded Computing Platforms
    Serves as primary storage for single-board computers, embedded modules, and system-on-module designs requiring industrial-grade reliability and consistent performance across temperature extremes.
  • Transportation and Fleet Management
    Enables robust data storage for vehicle telematics, fleet tracking systems, and transportation control units where high write endurance and temperature tolerance are essential.
  • Medical and Laboratory Equipment
    Supports data acquisition, firmware storage, and operational logging in medical diagnostic equipment and laboratory instrumentation requiring dependable long-term data retention.
  • Communication Infrastructure
    Powers storage requirements in network appliances, edge computing devices, and communication equipment where sustained write performance and industrial-grade reliability are critical.

Unique Advantages

  • Enhanced Endurance with 3D pSLC Technology: The 3D pSLC architecture significantly extends write/erase cycle endurance compared to conventional TLC flash, reducing maintenance requirements and extending product lifecycle in write-intensive applications.
  • Industrial-Grade Reliability: Qualified for -25°C to 85°C operation with robust error correction and wear-leveling algorithms, ensuring consistent performance and data integrity in demanding industrial environments.
  • Simplified Integration: Standards-compliant eMMC 5.1 interface eliminates the need for external controllers or complex firmware development, accelerating time-to-market and reducing system complexity.
  • Design Flexibility: Dual VCCQ voltage support (1.8V/3.3V) accommodates various host processor I/O standards, simplifying power supply design and enabling compatibility with diverse embedded platforms.
  • Space-Efficient Form Factor: Compact 100-ball FBGA package with surface-mount technology enables high-density board designs, particularly valuable in space-constrained industrial and embedded applications.
  • Long-Term Availability: Part of Flexxon's industrial AXO Series with capacity options from 16GB to 512GB, providing a consistent product family for platform scalability and long-term design-in confidence.

Why Choose FEMC064GCG-E530?

The FEMC064GCG-E530 delivers an optimal balance of capacity, endurance, and industrial-grade reliability for embedded applications that cannot compromise on data integrity. Its 3D pSLC technology provides the write endurance and performance consistency required by data-intensive industrial applications, while the industry-standard eMMC 5.1 interface ensures straightforward integration with minimal development effort. The industrial temperature qualification and robust packaging make this solution ideal for applications operating beyond consumer-grade environmental conditions.

Engineers and system architects selecting the FEMC064GCG-E530 gain access to a proven storage solution backed by Flexxon's industrial memory expertise and the scalability of the AXO Series product family. Whether designing next-generation industrial controllers, upgrading legacy systems, or developing new embedded platforms, this eMMC module provides the reliability, performance, and long-term availability that industrial applications demand.

Ready to integrate industrial-grade storage into your embedded design? Request a quote for the FEMC064GCG-E530 today or contact our technical sales team to discuss your specific application requirements and volume pricing options.

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    Headquarters: Singapore


    Employees: 51-200


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