FEMC128GBA-E530
| Part Description |
FEMC128GBA-E530 128GB eMMC 5.1 3D TLC |
|---|---|
| Quantity | 528 Available (as of May 5, 2026) |
Specifications & Environmental
| Device Package | 100-FBGA | Memory Format | FLASH | Technology | 3D TLC | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 1.024 Tbit | Grade | Automotive grade 3 | Clock Frequency | 200 MHz | ||
| Voltage | VCCQ: 1.8V/3.3V VCC: 3.3V | Memory Type | Non-Volatile | Operating Temperature | -25°C - 85°C | ||
| Packaging | 100-FBGA | Mounting Method | Surface Mount | Memory Interface | eMMC 5.1 | ||
| Memory Organization | 128G x 8 | Moisture Sensitivity Level | 3 | RoHS Compliance | Compliant | ||
| REACH Compliance | REACH Unknown | Qualification | AEC-Q100 Grade 3 | ECCN | EAR99 | ||
| HTS Code | 8542.32.00.71 |
Overview of FEMC128GBA-E530 – 128GB eMMC 5.1 Embedded Flash Storage with 3D TLC Technology
The FEMC128GBA-E530 is a high-capacity 128GB embedded MultiMediaCard (eMMC) 5.1 storage solution from Flexxon's AXO Series. Built on advanced 3D TLC NAND flash technology and compliant with JEDEC eMMC 5.1 standards, this device integrates an embedded flash controller with high-density non-volatile memory in a compact 100-ball FBGA package. Designed for industrial and automotive applications requiring reliable, high-performance storage, the FEMC128GBA-E530 delivers robust data retention and fast access speeds in demanding environments.
With AEC-Q100 Grade 3 automotive qualification and an operating temperature range of -25°C to 85°C, this eMMC module provides the reliability and performance needed for embedded systems in automotive, industrial control, and ruggedized computing applications. The device supports a 200 MHz clock frequency and offers flexible voltage supply options (VCC: 3.3V, VCCQ: 1.8V/3.3V) for seamless integration into diverse system architectures.
Key Features
- High-Capacity 3D TLC NAND Storage
128GB (1.024 Tbit) of non-volatile flash memory organized as 128G × 8, providing ample storage capacity for data logging, firmware, operating systems, and application data in embedded systems. - eMMC 5.1 Interface Compliance
Fully compliant with JEDEC eMMC 5.1 standards, ensuring broad compatibility with modern processors and system-on-chip (SoC) platforms while delivering optimized performance and reliability through an embedded flash controller. - 200 MHz Clock Frequency
Supports high-speed operation at 200 MHz, enabling fast data throughput for demanding applications requiring rapid read/write operations and quick system boot times. - AEC-Q100 Grade 3 Automotive Qualification
Meets stringent AEC-Q100 Grade 3 automotive qualification standards, ensuring reliable operation in automotive electronic systems with enhanced durability and quality assurance for mission-critical applications. - Extended Operating Temperature Range
Operates across -25°C to 85°C, making it suitable for industrial and automotive environments subject to temperature variations and harsh operating conditions. - Flexible Voltage Supply Options
Supports dual voltage operation with VCC at 3.3V and VCCQ at either 1.8V or 3.3V, providing design flexibility and compatibility with various system power architectures. - Compact 100-Ball FBGA Package
Surface-mount 100-ball Fine-pitch Ball Grid Array (FBGA) package optimizes board space utilization while providing robust electrical connectivity and thermal performance for high-density designs. - RoHS Compliant
Fully compliant with RoHS environmental standards, meeting regulatory requirements for lead-free manufacturing and supporting environmentally responsible product development.
Typical Applications
- Automotive Infotainment and Telematics
Provides reliable storage for navigation data, multimedia content, map updates, and vehicle telemetry in automotive dashboard systems and connected car platforms operating in temperature-variable environments. - Industrial Control and Automation
Serves as embedded storage for programmable logic controllers (PLCs), human-machine interfaces (HMIs), and industrial PCs requiring robust data retention for configuration files, logs, and firmware in factory automation systems. - Edge Computing and IoT Gateways
Enables high-capacity local storage for edge computing devices, IoT gateways, and data collection systems that require fast, reliable non-volatile memory for buffering sensor data and running embedded operating systems. - Medical and Healthcare Devices
Supports data storage requirements in portable medical equipment, diagnostic devices, and patient monitoring systems where reliability, data integrity, and extended temperature operation are essential. - Transportation and Fleet Management
Provides dependable storage for fleet tracking devices, electronic logging systems, and transportation management units requiring automotive-grade reliability and extended temperature tolerance.
Unique Advantages
- Automotive-Grade Reliability: AEC-Q100 Grade 3 qualification ensures the FEMC128GBA-E530 meets rigorous automotive industry standards for quality and reliability, reducing field failure risks in critical applications.
- Simplified Integration: The JEDEC eMMC 5.1-compliant interface with embedded controller eliminates the need for external NAND management, reducing design complexity, board space, and bill-of-materials costs while accelerating time-to-market.
- Enhanced Data Retention: 3D TLC NAND technology with integrated wear-leveling and error correction algorithms built into the embedded controller ensures long-term data integrity and extended product lifespan in write-intensive applications.
- Proven Industrial Pedigree: The AXO Series from Flexxon is specifically engineered for industrial and automotive applications, offering consistent performance characteristics across the -25°C to 85°C operating temperature range.
- Design Flexibility: Dual VCCQ voltage support (1.8V/3.3V) allows seamless integration with both legacy and modern system designs, providing migration paths and compatibility across multiple product generations.
- High-Density Storage in Compact Form: The 100-ball FBGA package delivers 128GB of storage capacity in a small footprint, enabling space-constrained designs without sacrificing storage performance or capacity.
Why Choose the FEMC128GBA-E530?
The FEMC128GBA-E530 delivers automotive-grade reliability and high-capacity storage in a proven eMMC 5.1 platform, making it an ideal choice for engineers developing industrial, automotive, and embedded computing systems. With AEC-Q100 Grade 3 qualification, extended temperature operation, and 3D TLC NAND technology managed by an integrated controller, this device provides the performance, reliability, and design simplicity required for demanding applications.
Whether you're designing next-generation automotive infotainment systems, industrial automation controllers, or ruggedized edge computing platforms, the FEMC128GBA-E530 offers the storage capacity, environmental robustness, and standards compliance needed to ensure long-term product success. Backed by Flexxon's expertise in industrial memory solutions and comprehensive datasheet documentation, this eMMC module provides a dependable foundation for your embedded storage requirements.
Get Started Today
Ready to integrate the FEMC128GBA-E530 into your next design? Request a quote today to receive pricing and availability information for your project requirements. Our team is ready to assist with technical specifications, design resources, and volume pricing to support your development timeline.

Date Founded: 2007
Headquarters: Singapore
Employees: 51-200
Revenue: NA
Certifications and Memberships: ISO9001:2015