FEMC128GBA-T740
| Part Description |
FEMC128GBA-T740 128GB eMMC 5.1 3D TLC |
|---|---|
| Quantity | 1,976 Available (as of May 5, 2026) |
Specifications & Environmental
| Device Package | 153-FBGA | Memory Format | FLASH | Technology | 3D TLC | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 1.024 Tbit | Grade | Automotive grade 3 | Clock Frequency | 200 MHz | ||
| Voltage | VCCQ: 1.8V/3.3V VCC: 3.3V | Memory Type | Non-Volatile | Operating Temperature | -40°C - 85°C | ||
| Packaging | 153-FBGA | Mounting Method | Surface Mount | Memory Interface | eMMC 5.1 | ||
| Memory Organization | 128G x 8 | Moisture Sensitivity Level | 3 | RoHS Compliance | Compliant | ||
| REACH Compliance | REACH Unknown | Qualification | AEC-Q100 Grade 3 | ECCN | EAR99 | ||
| HTS Code | 8542.32.00.71 |
Overview of FEMC128GBA-T740 – 128GB Automotive-Grade eMMC 5.1 Flash Memory
The FEMC128GBA-T740 is a 128GB embedded MultiMediaCard (eMMC) 5.1 flash memory module from Flexxon's XTRA VIII series, engineered for demanding automotive and industrial applications. Built on advanced 3D TLC NAND technology and packaged in a compact 153-ball FBGA, this non-volatile memory solution delivers robust storage performance with a 200 MHz clock frequency and dual voltage support (1.8V/3.3V VCCQ, 3.3V VCC). Qualified to AEC-Q100 Grade 3 standards, it operates reliably across an extended temperature range of -40°C to 85°C.
Designed for systems requiring high-capacity, reliable embedded storage, the FEMC128GBA-T740 combines industry-standard eMMC 5.1 interface compatibility with automotive-grade qualification. Its 1.024 Tbit (128GB × 8) memory organization and surface-mount form factor make it ideal for space-constrained designs in automotive infotainment, telematics, advanced driver-assistance systems, and ruggedized industrial equipment where consistent performance and long-term reliability are critical.
Key Features
- High-Capacity 3D TLC NAND Flash
128GB (1.024 Tbit) storage capacity utilizing advanced 3D TLC technology in a compact 153-ball FBGA package, providing ample non-volatile memory for data-intensive automotive and industrial applications. - eMMC 5.1 Interface
Industry-standard eMMC 5.1 interface operating at 200 MHz clock frequency ensures broad compatibility with modern host controllers and delivers efficient data throughput for multimedia, logging, and system storage requirements. - Automotive-Grade Qualification
AEC-Q100 Grade 3 qualified for automotive applications, guaranteeing reliable operation in harsh vehicular environments with extended temperature range support from -40°C to 85°C. - Flexible Voltage Support
Dual I/O voltage capability (VCCQ: 1.8V/3.3V) and 3.3V core supply (VCC) provide design flexibility and compatibility with a wide range of host system architectures. - 128G × 8 Memory Organization
Optimized memory structure facilitates efficient data management and access patterns for embedded system applications requiring high-density storage. - Surface Mount Technology
153-FBGA surface-mount package enables automated assembly, reduces board space requirements, and ensures mechanical reliability in vibration-prone automotive environments. - RoHS Compliant
Fully compliant with environmental regulations, supporting sustainable design practices and global market requirements.
Typical Applications
- Automotive Infotainment Systems
Provides high-capacity storage for multimedia content, navigation databases, user preferences, and software updates in in-vehicle entertainment and information systems. - Telematics and Fleet Management
Enables reliable data logging, GPS tracking information storage, and firmware management for connected vehicle telematics platforms operating in extended temperature environments. - Advanced Driver-Assistance Systems (ADAS)
Supports storage requirements for calibration data, system logs, and recording functions in safety-critical automotive applications requiring AEC-Q100 qualified components. - Industrial Control and Automation
Delivers robust embedded storage for programmable logic controllers, human-machine interfaces, and industrial computing platforms operating in harsh temperature and environmental conditions. - Ruggedized Computing Platforms
Provides dependable non-volatile storage for embedded systems deployed in outdoor, transportation, and industrial settings where extended temperature operation and long-term reliability are essential.
Unique Advantages
- Automotive-Qualified Reliability: AEC-Q100 Grade 3 certification ensures the FEMC128GBA-T740 meets stringent automotive industry standards for quality and reliability, reducing risk in safety-critical and long-lifecycle applications.
- Extended Temperature Operation: -40°C to 85°C operating range enables deployment in extreme environmental conditions common to automotive and industrial settings without performance degradation.
- Proven 3D TLC Technology: Advanced 3D TLC NAND architecture delivers the optimal balance of storage density, cost-effectiveness, and performance for high-capacity embedded storage requirements.
- Industry-Standard Interface: eMMC 5.1 compliance ensures seamless integration with existing host controller designs, accelerating time-to-market and reducing development complexity.
- Compact, Robust Packaging: The 153-ball FBGA format minimizes PCB footprint while providing excellent mechanical strength and thermal performance for space-constrained automotive and industrial designs.
- Dual Voltage Flexibility: Compatibility with both 1.8V and 3.3V I/O signaling simplifies integration across diverse system architectures and enables power optimization strategies.
Why Choose the FEMC128GBA-T740?
The FEMC128GBA-T740 from Flexxon's XTRA VIII series represents a purpose-built solution for engineers designing automotive and industrial systems that demand both high storage capacity and uncompromising reliability. Its AEC-Q100 Grade 3 qualification, extended temperature operation, and eMMC 5.1 interface combine to deliver a proven, standards-compliant storage solution that integrates seamlessly into modern embedded designs. The 128GB capacity addresses the growing storage requirements of data-intensive applications while the compact 153-FBGA package fits within the space constraints of contemporary automotive and industrial electronics.
For design teams developing next-generation infotainment systems, telematics platforms, ADAS components, or ruggedized industrial equipment, the FEMC128GBA-T740 offers the long-term reliability, environmental robustness, and technical support needed to succeed in challenging deployment environments. Backed by Flexxon's expertise in automotive-grade memory solutions and full RoHS compliance, this eMMC module provides a dependable foundation for applications where failure is not an option and product lifecycles span years of continuous operation.
Ready to integrate proven automotive-grade storage into your next design? Request a quote for the FEMC128GBA-T740 today to discuss your specific application requirements, volume pricing, and technical support options. Our team is prepared to help you evaluate how this 128GB eMMC 5.1 solution can meet your performance, reliability, and qualification needs.

Date Founded: 2007
Headquarters: Singapore
Employees: 51-200
Revenue: NA
Certifications and Memberships: ISO9001:2015