FEMC064GCB-E540
| Part Description |
FEMC064GCB-E540 64GB eMMC 5.1 3D pSLC |
|---|---|
| Quantity | 894 Available (as of May 5, 2026) |
Specifications & Environmental
| Device Package | 153-FBGA | Memory Format | FLASH | Technology | 3D pSLC | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Gbit | Grade | Automotive grade 2 | Clock Frequency | 200 MHz | ||
| Voltage | VCCQ: 1.8V/3.3V VCC: 3.3V | Memory Type | Non-Volatile | Operating Temperature | -25°C - 85°C | ||
| Packaging | 153-FBGA | Mounting Method | Surface Mount | Memory Interface | eMMC 5.1 | ||
| Memory Organization | 64G x 8 | Moisture Sensitivity Level | 3 | RoHS Compliance | Compliant | ||
| REACH Compliance | REACH Unknown | Qualification | AEC-Q100 Grade 2 | ECCN | EAR99 | ||
| HTS Code | 8542.32.00.71 |
Overview of FEMC064GCB-E540 – 64GB Automotive-Grade eMMC 5.1 Storage with 3D pSLC Technology
The FEMC064GCB-E540 is a 64GB embedded MultiMediaCard (eMMC 5.1) storage solution from Flexxon's AXO series, engineered with advanced 3D pseudo-SLC (pSLC) NAND flash technology. Organized as 64G × 8 and operating at 200 MHz, this non-volatile flash memory delivers robust, high-performance storage for mission-critical embedded applications. Qualified to AEC-Q100 Grade 2 standards, the FEMC064GCB-E540 is built for automotive and industrial systems that demand exceptional endurance, data integrity, and reliable operation across extended temperature ranges.
Designed for automotive infotainment, telematics, advanced driver-assistance systems (ADAS), industrial controllers, and ruggedized IoT devices, this automotive-grade eMMC combines the high write-cycle endurance of pSLC technology with the capacity and cost-efficiency of modern 3D NAND architecture. The eMMC 5.1 interface ensures broad compatibility with existing embedded platforms, while the 153-ball FBGA surface-mount package enables space-efficient board integration.
Key Features
- 64GB Storage Capacity (512 Gbit)
Provides ample space for operating systems, firmware, application code, multimedia assets, and data logging in automotive and industrial embedded systems. - 3D pSLC NAND Technology
Leverages pseudo-SLC programming of 3D TLC cells to deliver SLC-like endurance and reliability, significantly extending write-cycle life and reducing bit error rates compared to standard TLC flash. - eMMC 5.1 Interface at 200 MHz
Offers high-speed data transfer and backward compatibility with standard eMMC host controllers, simplifying system integration and enabling faster boot times and application responsiveness. - Dual Voltage I/O Support (VCCQ: 1.8V/3.3V)
Flexible I/O voltage operation (1.8V or 3.3V) accommodates a wide range of host platforms and reduces the need for external level shifters, streamlining board design. - AEC-Q100 Grade 2 Qualified
Meets automotive industry standards for reliability and quality, validated for operation from -25°C to 85°C, making it suitable for in-cabin automotive electronics and industrial control applications. - 153-Ball FBGA Surface Mount Package
Compact, surface-mount form factor minimizes board space and supports automated assembly processes for high-volume manufacturing. - RoHS Compliant
Fully compliant with environmental regulations, ensuring suitability for global markets and environmentally conscious designs.
Typical Applications
- Automotive Infotainment Systems
Stores operating systems, maps, multimedia libraries, and user data for in-vehicle entertainment, navigation, and connectivity platforms requiring automotive-grade reliability. - Telematics and Fleet Management
Provides durable, high-endurance storage for logging vehicle diagnostics, GPS data, and communication logs in connected vehicle and fleet tracking solutions. - Advanced Driver-Assistance Systems (ADAS)
Supports firmware, calibration data, and event logging for camera, radar, and sensor fusion systems where data integrity and reliability are critical. - Industrial Controllers and HMI
Enables robust storage for PLC firmware, configuration data, and human-machine interface (HMI) applications in harsh industrial environments with extended temperature exposure. - Ruggedized IoT and Edge Computing
Delivers reliable, high-endurance storage for edge gateways, smart city infrastructure, and outdoor IoT devices operating in challenging thermal and environmental conditions.
Unique Advantages
- Superior Endurance with 3D pSLC Technology:
By operating 3D TLC NAND in pseudo-SLC mode, the FEMC064GCB-E540 achieves dramatically higher program/erase cycle endurance than standard TLC, extending product lifetime and reducing warranty costs in write-intensive applications. - Automotive-Grade Reliability:
AEC-Q100 Grade 2 qualification ensures rigorous testing and validation for automotive applications, providing confidence in long-term reliability, data retention, and performance consistency across temperature extremes. - Broad Voltage Compatibility:
Dual I/O voltage support (1.8V and 3.3V) simplifies integration with diverse embedded processors and reduces BOM costs by eliminating external voltage translation components. - Standards-Based eMMC 5.1 Interface:
Industry-standard eMMC 5.1 protocol ensures seamless compatibility with a wide range of SoCs and microprocessors, accelerating time-to-market and leveraging existing software stacks and drivers. - Compact, Manufacturing-Friendly Package:
The 153-ball FBGA surface-mount design optimizes board real estate and supports high-speed automated assembly, ideal for space-constrained automotive and industrial designs. - Environmentally Compliant:
RoHS compliance supports global regulatory requirements and corporate sustainability goals, ensuring the product is suitable for worldwide distribution and environmentally responsible manufacturing.
Why Choose the FEMC064GCB-E540?
The FEMC064GCB-E540 combines the endurance and reliability of pseudo-SLC NAND technology with the capacity and interface flexibility required for modern automotive and industrial embedded systems. Its AEC-Q100 Grade 2 qualification, extended temperature range, and dual voltage I/O support make it an ideal choice for engineers designing robust, long-lifecycle products in demanding environments. Whether you're developing next-generation infotainment platforms, ADAS modules, industrial automation equipment, or ruggedized IoT gateways, this 64GB eMMC 5.1 module delivers the performance, durability, and standards compliance you need.
Backed by Flexxon's commitment to quality and reliability, the FEMC064GCB-E540 offers a proven storage solution that reduces risk, simplifies integration, and supports the longevity of your embedded designs in automotive, industrial, and mission-critical applications.
Request a Quote
Ready to integrate the FEMC064GCB-E540 into your next automotive or industrial design? Contact our sales team today to request a quote, discuss volume pricing, or receive technical support tailored to your application requirements.

Date Founded: 2007
Headquarters: Singapore
Employees: 51-200
Revenue: NA
Certifications and Memberships: ISO9001:2015