FEMC064GCA-E540
| Part Description |
FEMC064GCA-E540 64GB eMMC 5.1 3D pSLC |
|---|---|
| Quantity | 1,831 Available (as of May 5, 2026) |
Specifications & Environmental
| Device Package | 153-FBGA | Memory Format | FLASH | Technology | 3D pSLC | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Gbit | Grade | Automotive grade 3 | Clock Frequency | 200 MHz | ||
| Voltage | VCCQ: 1.8V/3.3V VCC: 3.3V | Memory Type | Non-Volatile | Operating Temperature | -25°C - 85°C | ||
| Packaging | 153-FBGA | Mounting Method | Surface Mount | Memory Interface | eMMC 5.1 | ||
| Memory Organization | 64G x 8 | Moisture Sensitivity Level | 3 | RoHS Compliance | Compliant | ||
| REACH Compliance | REACH Unknown | Qualification | AEC-Q100 Grade 3 | ECCN | EAR99 | ||
| HTS Code | 8542.32.00.71 |
Overview of FEMC064GCA-E540 – 64GB eMMC 5.1 Embedded Flash Storage with 3D pSLC Technology
The FEMC064GCA-E540 is a high-performance 64GB embedded MultiMediaCard (eMMC 5.1) flash storage solution from Flexxon's AXO series. Built with advanced 3D pseudo-Single Level Cell (pSLC) technology, this automotive-grade memory device delivers exceptional endurance, reliability, and data retention in a compact 153-ball FBGA surface-mount package. Qualified to AEC-Q100 Grade 3 standards, the FEMC064GCA-E540 is designed for demanding industrial, automotive, and commercial applications requiring robust non-volatile storage with long operational lifespans.
Operating at clock frequencies up to 200 MHz with flexible voltage support (VCC: 3.3V, VCCQ: 1.8V/3.3V), this eMMC solution provides an ideal balance of capacity, performance, and thermal tolerance across a -25°C to 85°C temperature range. The standardized eMMC 5.1 interface simplifies integration while reducing design complexity and time-to-market for embedded system developers.
Key Features
- High-Capacity Embedded Storage
64GB (512 Gbit) capacity organized as 64G × 8, providing ample space for operating systems, applications, data logging, and multimedia content in space-constrained embedded designs. - 3D pSLC Technology
Pseudo-Single Level Cell architecture delivers significantly higher endurance and reliability compared to standard TLC or MLC NAND, extending product lifetime and reducing maintenance requirements in write-intensive applications. - eMMC 5.1 Interface
Industry-standard eMMC 5.1 protocol with 200 MHz clock frequency ensures broad compatibility with modern processors and SoCs while simplifying board design and reducing BOM cost compared to discrete flash solutions. - Automotive Grade 3 Qualification
AEC-Q100 Grade 3 qualified for operation from -25°C to 85°C, meeting stringent automotive reliability standards for in-cabin, infotainment, telematics, and dashboard applications. - Flexible Voltage Support
Dual voltage operation with VCC at 3.3V and selectable VCCQ at 1.8V or 3.3V provides design flexibility and compatibility with diverse system architectures and power management strategies. - Compact Surface-Mount Package
153-ball FBGA package offers a small footprint for space-critical designs while maintaining robust mechanical and thermal performance for automated assembly processes. - RoHS Compliant
Fully compliant with environmental regulations, ensuring suitability for global markets and environmentally conscious product development.
Typical Applications
- Automotive Infotainment and Telematics
Ideal for storing navigation maps, multimedia content, firmware, and trip data in dashboard systems, head units, and connected vehicle applications requiring automotive-grade reliability. - Industrial Control and Automation
Provides reliable data storage for PLCs, HMIs, edge computing devices, and industrial IoT gateways where high write endurance and extended temperature operation are critical. - Medical and Healthcare Devices
Suitable for medical imaging equipment, patient monitoring systems, and diagnostic instruments requiring long-term data retention and consistent performance. - Point-of-Sale and Kiosk Systems
Enables secure transaction logging, application hosting, and multimedia content storage in retail terminals, payment systems, and interactive kiosks with high duty cycles. - Communications and Networking Equipment
Supports firmware storage, configuration data, and log management in routers, switches, gateways, and base stations requiring dependable non-volatile memory.
Unique Advantages
- Extended Endurance with pSLC Technology: The 3D pSLC architecture delivers dramatically higher write/erase cycles compared to TLC-based solutions, reducing the risk of premature wear-out and extending product service life in write-intensive environments.
- Automotive-Grade Reliability: AEC-Q100 Grade 3 qualification ensures proven performance through rigorous automotive stress testing, providing confidence for mission-critical applications in automotive and similarly demanding industrial sectors.
- Simplified Integration: The industry-standard eMMC 5.1 interface eliminates the need for external controllers and complex firmware development, reducing design complexity, development time, and overall system cost.
- Wide Operating Temperature Range: -25°C to 85°C operation ensures reliable performance across diverse environmental conditions, from cold-start automotive scenarios to thermally challenging industrial enclosures.
- Flexible Power Design: Dual VCCQ voltage support (1.8V/3.3V) enables compatibility with both legacy and modern low-voltage system architectures, simplifying migration paths and multi-platform designs.
- Compact and Robust Form Factor: The 153-ball FBGA package maximizes storage density while maintaining excellent thermal and mechanical characteristics for harsh operating environments and high-reliability applications.
Why Choose the FEMC064GCA-E540?
The FEMC064GCA-E540 represents Flexxon's commitment to delivering industrial-grade embedded storage that meets the rigorous demands of automotive, industrial, and commercial applications. By combining 3D pSLC technology with automotive qualification and a proven eMMC 5.1 interface, this solution offers engineers a reliable, long-life storage platform that reduces design risk and accelerates time-to-market. The 64GB capacity strikes an optimal balance for applications requiring substantial storage without the cost and complexity of higher-density alternatives.
For system designers prioritizing data integrity, write endurance, and extended operational lifetimes, the FEMC064GCA-E540 delivers measurable advantages over consumer-grade storage solutions. Its automotive qualification, wide temperature range, and robust pSLC architecture make it an ideal choice for products expected to perform reliably over years of continuous operation in challenging environments. Whether you're developing next-generation automotive systems, industrial controllers, or critical infrastructure equipment, the FEMC064GCA-E540 provides the storage foundation your design demands.
Ready to enhance your embedded design with reliable, automotive-grade storage? Request a quote today to discuss volume pricing, technical specifications, and how the FEMC064GCA-E540 can meet your specific application requirements. Our team is ready to support your project from evaluation through production.

Date Founded: 2007
Headquarters: Singapore
Employees: 51-200
Revenue: NA
Certifications and Memberships: ISO9001:2015