FEMC064GBG-E540
| Part Description |
FEMC064GBG-E540 64GB eMMC 5.1 3D TLC |
|---|---|
| Quantity | 554 Available (as of May 5, 2026) |
Specifications & Environmental
| Device Package | 100-FBGA | Memory Format | FLASH | Technology | 3D TLC | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Gbit | Grade | Industrial | Clock Frequency | 200 MHz | ||
| Voltage | VCCQ: 1.8V/3.3V VCC: 3.3V | Memory Type | Non-Volatile | Operating Temperature | -25°C - 85°C | ||
| Packaging | 100-FBGA | Mounting Method | Surface Mount | Memory Interface | eMMC 5.1 | ||
| Memory Organization | 64G x 8 | Moisture Sensitivity Level | N/A | RoHS Compliance | Compliant | ||
| REACH Compliance | REACH Unknown | Qualification | N/A | ECCN | EAR99 | ||
| HTS Code | 8542.32.00.71 |
Overview of FEMC064GBG-E540 – Industrial-Grade 64GB eMMC 5.1 Embedded Flash Storage
The FEMC064GBG-E540 is a high-capacity 64GB embedded MultiMediaCard (eMMC 5.1) flash storage solution from Flexxon's AXO series. Built on advanced 3D TLC NAND technology and configured as 64G × 8 organization, this industrial-grade memory device delivers reliable, non-volatile storage in a compact 100-ball FBGA surface-mount package. Operating at 200 MHz clock frequency with eMMC 5.1 interface compliance, the FEMC064GBG-E540 provides the performance and integration needed for embedded systems requiring dependable on-board storage.
Engineered for industrial applications, this flash memory module operates across a -25°C to 85°C temperature range and supports dual voltage operation (VCC: 3.3V, VCCQ: 1.8V/3.3V), making it suitable for a wide range of embedded computing platforms, edge devices, IoT gateways, and industrial control systems where space, reliability, and performance are critical design considerations.
Key Features
- High-Capacity 3D TLC Flash Storage
512 Gbit (64GB) of non-volatile flash memory utilizing 3D TLC technology delivers substantial storage capacity for data logging, firmware, operating systems, and application code in space-constrained embedded designs. - eMMC 5.1 Interface
Industry-standard eMMC 5.1 interface operating at 200 MHz clock frequency ensures broad compatibility with modern processors and SoCs while simplifying board design and reducing integration complexity. - 64G × 8 Memory Organization
Organized as 64 gigabits by 8-bit configuration, providing flexible data access patterns optimized for embedded system architectures. - Dual Voltage Support
Flexible power supply options with VCC at 3.3V and VCCQ supporting both 1.8V and 3.3V enable compatibility with a wide range of host platforms and reduce design constraints. - Industrial Temperature Range
Qualified for -25°C to 85°C operation, ensuring reliable performance in harsh environments, factory automation, outdoor installations, and industrial control applications where commercial-grade components may be insufficient. - Compact Surface-Mount Package
100-ball FBGA package provides a small footprint for space-constrained PCB designs while maintaining robust mechanical and electrical connections suitable for production manufacturing. - RoHS Compliant
Meets RoHS environmental compliance standards, supporting sustainable design practices and regulatory requirements for global markets.
Typical Applications
- Industrial Control Systems
Provides reliable storage for programmable logic controllers (PLCs), human-machine interfaces (HMIs), and process control equipment requiring persistent data storage in demanding industrial environments. - Edge Computing and IoT Gateways
Serves as primary storage for embedded Linux or RTOS-based edge devices and IoT gateway platforms that aggregate sensor data, perform local analytics, and require robust non-volatile storage. - Medical Instrumentation
Stores firmware, configuration data, and patient records in diagnostic equipment and medical devices operating within industrial temperature specifications. - Network and Telecommunications Equipment
Functions as boot storage and configuration repository for routers, switches, base stations, and network infrastructure equipment requiring industrial-grade reliability. - Transportation and Fleet Management
Supports onboard computing systems in fleet telematics, journey recorders, and vehicle monitoring platforms where extended temperature operation and vibration resistance are essential.
Unique Advantages
- Simplified System Integration
The eMMC 5.1 standard interface eliminates the need for external controller circuits and complex firmware development, reducing bill-of-materials costs and accelerating time-to-market for embedded designs. - Industrial-Grade Reliability
Extended temperature qualification and robust 3D TLC architecture provide the durability required for continuous operation in factory floors, outdoor enclosures, and other demanding deployment scenarios. - Voltage Flexibility
Dual VCCQ voltage support (1.8V/3.3V) maximizes compatibility across diverse processor platforms and enables designers to optimize power consumption based on system requirements without changing storage components. - High-Density Storage in Minimal Footprint
64GB capacity in a compact 100-ball FBGA package delivers exceptional storage density, enabling feature-rich applications and extended data logging capabilities even in space-limited enclosures. - Proven 3D TLC Technology
Three-dimensional NAND architecture provides improved endurance and reliability compared to planar alternatives while maintaining cost-effectiveness for industrial storage applications. - Environmental Compliance
RoHS-compliant manufacturing ensures regulatory compliance for global distribution and aligns with corporate sustainability initiatives without compromising performance or reliability.
Why Choose the FEMC064GBG-E540?
The FEMC064GBG-E540 combines proven eMMC 5.1 interface technology with industrial-grade reliability and substantial 64GB storage capacity, making it an ideal choice for embedded system designers who require dependable non-volatile storage without the complexity of managed NAND solutions. The industrial temperature qualification, dual voltage support, and compact FBGA packaging address the real-world constraints of cost-sensitive industrial, medical, and IoT applications where space is limited but reliability cannot be compromised.
As part of Flexxon's AXO series, the FEMC064GBG-E540 benefits from a scalable family architecture spanning 16GB to 512GB capacities, enabling design reuse and platform standardization across product lines. Whether you're developing next-generation industrial equipment, building edge computing solutions, or designing embedded systems for challenging environments, the FEMC064GBG-E540 delivers the storage performance, integration simplicity, and ruggedness your application demands.
Ready to integrate reliable industrial-grade flash storage into your next embedded design? Request a quote today to discuss your specific requirements, obtain pricing for volume production, and learn how the FEMC064GBG-E540 can simplify your storage architecture while meeting the demanding environmental and reliability standards of industrial applications.

Date Founded: 2007
Headquarters: Singapore
Employees: 51-200
Revenue: NA
Certifications and Memberships: ISO9001:2015