FEMC064GBG-E540

AXO 5.1 153ball eMMC (3D TLC/3D pSLC)
Part Description

FEMC064GBG-E540 64GB eMMC 5.1 3D TLC

Quantity 554 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerFlexxon
Manufacturing StatusActive
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package100-FBGAMemory FormatFLASHTechnology3D TLC
Memory Size512 GbitGradeIndustrialClock Frequency200 MHz
VoltageVCCQ: 1.8V/3.3V VCC: 3.3VMemory TypeNon-VolatileOperating Temperature-25°C - 85°C
Packaging100-FBGAMounting MethodSurface MountMemory InterfaceeMMC 5.1
Memory Organization64G x 8Moisture Sensitivity LevelN/ARoHS ComplianceCompliant
REACH ComplianceREACH UnknownQualificationN/AECCNEAR99
HTS Code8542.32.00.71

Overview of FEMC064GBG-E540 – Industrial-Grade 64GB eMMC 5.1 Embedded Flash Storage

The FEMC064GBG-E540 is a high-capacity 64GB embedded MultiMediaCard (eMMC 5.1) flash storage solution from Flexxon's AXO series. Built on advanced 3D TLC NAND technology and configured as 64G × 8 organization, this industrial-grade memory device delivers reliable, non-volatile storage in a compact 100-ball FBGA surface-mount package. Operating at 200 MHz clock frequency with eMMC 5.1 interface compliance, the FEMC064GBG-E540 provides the performance and integration needed for embedded systems requiring dependable on-board storage.

Engineered for industrial applications, this flash memory module operates across a -25°C to 85°C temperature range and supports dual voltage operation (VCC: 3.3V, VCCQ: 1.8V/3.3V), making it suitable for a wide range of embedded computing platforms, edge devices, IoT gateways, and industrial control systems where space, reliability, and performance are critical design considerations.

Key Features

  • High-Capacity 3D TLC Flash Storage
    512 Gbit (64GB) of non-volatile flash memory utilizing 3D TLC technology delivers substantial storage capacity for data logging, firmware, operating systems, and application code in space-constrained embedded designs.
  • eMMC 5.1 Interface
    Industry-standard eMMC 5.1 interface operating at 200 MHz clock frequency ensures broad compatibility with modern processors and SoCs while simplifying board design and reducing integration complexity.
  • 64G × 8 Memory Organization
    Organized as 64 gigabits by 8-bit configuration, providing flexible data access patterns optimized for embedded system architectures.
  • Dual Voltage Support
    Flexible power supply options with VCC at 3.3V and VCCQ supporting both 1.8V and 3.3V enable compatibility with a wide range of host platforms and reduce design constraints.
  • Industrial Temperature Range
    Qualified for -25°C to 85°C operation, ensuring reliable performance in harsh environments, factory automation, outdoor installations, and industrial control applications where commercial-grade components may be insufficient.
  • Compact Surface-Mount Package
    100-ball FBGA package provides a small footprint for space-constrained PCB designs while maintaining robust mechanical and electrical connections suitable for production manufacturing.
  • RoHS Compliant
    Meets RoHS environmental compliance standards, supporting sustainable design practices and regulatory requirements for global markets.

Typical Applications

  • Industrial Control Systems
    Provides reliable storage for programmable logic controllers (PLCs), human-machine interfaces (HMIs), and process control equipment requiring persistent data storage in demanding industrial environments.
  • Edge Computing and IoT Gateways
    Serves as primary storage for embedded Linux or RTOS-based edge devices and IoT gateway platforms that aggregate sensor data, perform local analytics, and require robust non-volatile storage.
  • Medical Instrumentation
    Stores firmware, configuration data, and patient records in diagnostic equipment and medical devices operating within industrial temperature specifications.
  • Network and Telecommunications Equipment
    Functions as boot storage and configuration repository for routers, switches, base stations, and network infrastructure equipment requiring industrial-grade reliability.
  • Transportation and Fleet Management
    Supports onboard computing systems in fleet telematics, journey recorders, and vehicle monitoring platforms where extended temperature operation and vibration resistance are essential.

Unique Advantages

  • Simplified System Integration
    The eMMC 5.1 standard interface eliminates the need for external controller circuits and complex firmware development, reducing bill-of-materials costs and accelerating time-to-market for embedded designs.
  • Industrial-Grade Reliability
    Extended temperature qualification and robust 3D TLC architecture provide the durability required for continuous operation in factory floors, outdoor enclosures, and other demanding deployment scenarios.
  • Voltage Flexibility
    Dual VCCQ voltage support (1.8V/3.3V) maximizes compatibility across diverse processor platforms and enables designers to optimize power consumption based on system requirements without changing storage components.
  • High-Density Storage in Minimal Footprint
    64GB capacity in a compact 100-ball FBGA package delivers exceptional storage density, enabling feature-rich applications and extended data logging capabilities even in space-limited enclosures.
  • Proven 3D TLC Technology
    Three-dimensional NAND architecture provides improved endurance and reliability compared to planar alternatives while maintaining cost-effectiveness for industrial storage applications.
  • Environmental Compliance
    RoHS-compliant manufacturing ensures regulatory compliance for global distribution and aligns with corporate sustainability initiatives without compromising performance or reliability.

Why Choose the FEMC064GBG-E540?

The FEMC064GBG-E540 combines proven eMMC 5.1 interface technology with industrial-grade reliability and substantial 64GB storage capacity, making it an ideal choice for embedded system designers who require dependable non-volatile storage without the complexity of managed NAND solutions. The industrial temperature qualification, dual voltage support, and compact FBGA packaging address the real-world constraints of cost-sensitive industrial, medical, and IoT applications where space is limited but reliability cannot be compromised.

As part of Flexxon's AXO series, the FEMC064GBG-E540 benefits from a scalable family architecture spanning 16GB to 512GB capacities, enabling design reuse and platform standardization across product lines. Whether you're developing next-generation industrial equipment, building edge computing solutions, or designing embedded systems for challenging environments, the FEMC064GBG-E540 delivers the storage performance, integration simplicity, and ruggedness your application demands.

Ready to integrate reliable industrial-grade flash storage into your next embedded design? Request a quote today to discuss your specific requirements, obtain pricing for volume production, and learn how the FEMC064GBG-E540 can simplify your storage architecture while meeting the demanding environmental and reliability standards of industrial applications.

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    Date Founded: 2007


    Headquarters: Singapore


    Employees: 51-200


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