FEMC064GBE-T740

The FEMC064GBE-T740 is a high-capacity 64GB embedded MultiMediaCard (eMMC) 5.1 flash memory solution from Flexxon's XTRA VII series. Built with advanced 3D TLC NAND technology in a compact 153-ball FBGA package, this industrial-grade memory module delivers reliable non-volatile storage for embedded systems requiring robust performance across extended temperature ranges. Designed for surface-mount integration, the FEMC064GBE-T740 offers flexible voltage operation and high-speed data transfer capabilities, making it ideal for industrial control systems, embedded computing platforms, and ruggedized IoT devices.

As part of the XTRA VII 5.1 153-ball eMMC family, this memory solution combines high storage density with industrial reliability, supporting demanding applications that require consistent data retention and performance in challenging operating environments from -25°C to 85°C.

Key Features

• High-Density Storage Capacity
  512 Gbit (64GB) of non-volatile flash memory organized as 64G × 8, providing ample storage for embedded operating systems, application code, data logging, and multimedia content in a single compact module.
• eMMC 5.1 Interface
  Industry-standard eMMC 5.1 interface with 200 MHz clock frequency enables high-speed sequential data transfers while maintaining broad compatibility with embedded processors and SoCs. The standardized interface simplifies design integration and reduces development time.
• Advanced 3D TLC NAND Technology
  Utilizes 3D Triple-Level Cell (TLC) NAND flash technology to deliver higher storage density and improved endurance compared to planar NAND architectures, optimizing cost-per-gigabyte while maintaining industrial reliability.
• Flexible Voltage Operation
  Supports dual I/O voltage levels (VCCQ: 1.8V/3.3V) and 3.3V core supply (VCC), enabling compatibility with a wide range of host processors and system power architectures without additional level-shifting circuitry.
• Industrial Temperature Range
  Qualified for operation across -25°C to 85°C, ensuring reliable performance in industrial automation, transportation systems, outdoor equipment, and other applications exposed to temperature extremes.
• Compact Surface-Mount Package
  153-ball FBGA package provides a small footprint for space-constrained designs while delivering robust mechanical attachment and excellent thermal performance for demanding embedded applications.
• RoHS Compliant
  Fully compliant with RoHS environmental standards, supporting sustainable design practices and meeting global regulatory requirements for hazardous substance restrictions.

Typical Applications

• Industrial Automation and Control Systems
  Provides reliable program storage, data logging, and configuration management for PLCs, industrial PCs, HMI panels, and process control equipment operating in factory environments with extended temperature exposure.
• Embedded Computing Platforms
  Serves as primary storage for single-board computers, edge computing devices, and embedded Linux/Android systems requiring bootable flash memory with high capacity and industrial-grade reliability.
• IoT Gateways and Edge Devices
  Offers sufficient storage capacity for firmware, application software, local data buffering, and edge analytics in Internet of Things infrastructure deployed in field environments with variable temperature conditions.
• Transportation and Fleet Management Systems
  Delivers rugged storage for vehicle telematics, fleet tracking devices, digital tachographs, and onboard diagnostics systems that must operate reliably across automotive temperature ranges and vibration profiles.
• Medical and Healthcare Equipment
  Provides non-volatile storage for embedded medical devices, patient monitoring systems, and diagnostic equipment requiring reliable data retention and industrial-grade environmental performance.

Unique Advantages

• Industrial-Grade Reliability:
  The -25°C to 85°C operating temperature range and industrial qualification make this eMMC module suitable for harsh environments where consumer-grade memory would fail, reducing field failures and warranty costs.
• Design Simplification:
  The eMMC 5.1 standard interface eliminates the need for external NAND controllers, wear leveling algorithms, and bad block management—all functionality is handled internally, significantly reducing design complexity and time-to-market.
• Flexible System Integration:
  Dual-voltage I/O support (1.8V/3.3V) enables direct interfacing with diverse processor families without additional voltage translation components, simplifying board design and reducing BOM costs.
• Scalable Platform:
  As part of the XTRA VII series spanning 8GB to 256GB capacities, the FEMC064GBE-T740 allows designers to select optimal storage density for specific applications while maintaining pin compatibility and design reuse across product variants.
• Proven 3D NAND Technology:
  3D TLC architecture delivers improved endurance and reliability compared to planar NAND while offering cost-effective storage density, balancing performance requirements with budget constraints in volume production.
• Compact Footprint:
  The 153-ball FBGA package minimizes board space requirements, enabling higher component density and smaller form factors critical for portable, embedded, and space-constrained industrial designs.

Why Choose the FEMC064GBE-T740?

The FEMC064GBE-T740 represents an optimal balance of storage capacity, industrial reliability, and design convenience for embedded systems requiring robust non-volatile memory. Its combination of 64GB capacity, eMMC 5.1 interface, and extended temperature qualification addresses the core requirements of industrial and embedded applications where consumer-grade solutions fall short. The standardized interface and integrated controller reduce development risk and accelerate time-to-market, while the industrial temperature range and RoHS compliance ensure long-term deployability across diverse operating environments and global markets.

For engineering teams developing industrial control systems, embedded computing platforms, or ruggedized IoT devices, the FEMC064GBE-T740 delivers a field-proven memory solution backed by Flexxon's expertise in industrial-grade flash storage. Its membership in the scalable XTRA VII family provides flexibility for future product variants while maintaining design compatibility, supporting both current projects and long-term product roadmaps with a single, reliable memory platform.

Ready to integrate reliable industrial-grade eMMC storage into your next embedded design? Contact our technical sales team today to request a quote for the FEMC064GBE-T740, discuss volume pricing, or receive application-specific guidance for your project requirements.