FEMC064GBE-E530

AXO 5.1 100ball eMMC (3D TLC/3D pSLC)
Part Description

FEMC064GBE-E530 64GB eMMC 5.1 3D TLC

Quantity 630 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerFlexxon
Manufacturing StatusActive
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package100-FBGAMemory FormatFLASHTechnology3D TLC
Memory Size512 GbitGradeIndustrialClock Frequency200 MHz
VoltageVCCQ: 1.8V/3.3V VCC: 3.3VMemory TypeNon-VolatileOperating Temperature-25°C - 85°C
Packaging100-FBGAMounting MethodSurface MountMemory InterfaceeMMC 5.1
Memory Organization64G x 8Moisture Sensitivity Level3RoHS ComplianceCompliant
REACH ComplianceREACH UnknownQualificationN/AECCNEAR99
HTS Code8542.32.00.71

Overview of FEMC064GBE-E530 – 64GB Industrial eMMC 5.1 Embedded Flash Storage

The FEMC064GBE-E530 from Flexxon is a high-capacity 64GB embedded MultiMediaCard (eMMC) 5.1 flash storage solution designed for demanding industrial applications. Built on 3D TLC NAND technology and housed in a compact 100-ball FBGA package, this industrial-grade memory module combines a fully integrated flash controller with 512 Gbit (64GB) of non-volatile storage in a single, standardized package that complies with JEDEC eMMC 5.1 specifications.

Engineered for reliability in harsh environments, the FEMC064GBE-E530 operates across an industrial temperature range of -25°C to 85°C, making it ideal for embedded systems, industrial automation, networking equipment, and other applications requiring robust, high-performance flash storage with predictable behavior in challenging conditions.

Key Features

  • High-Capacity Storage
    64GB (512 Gbit) of embedded flash memory organized as 64G × 8, providing ample storage for operating systems, applications, data logging, and multimedia content in space-constrained embedded designs.
  • eMMC 5.1 Interface
    JEDEC-compliant eMMC 5.1 standard interface operating at 200 MHz clock frequency, delivering reliable performance and industry-standard compatibility for straightforward integration into existing embedded system architectures.
  • 3D TLC NAND Technology
    Advanced 3D TLC (Triple-Level Cell) flash technology provides a balance of capacity, performance, and cost-effectiveness for industrial embedded applications requiring substantial storage capabilities.
  • Industrial Temperature Range
    Qualified for operation from -25°C to 85°C, ensuring reliable performance in industrial environments, outdoor installations, transportation systems, and other applications subject to temperature extremes.
  • Flexible Voltage Supply
    Supports dual voltage operation with VCC at 3.3V and VCCQ configurable for either 1.8V or 3.3V signaling, providing design flexibility for integration with various host processors and system architectures.
  • Compact Surface-Mount Package
    100-ball FBGA package delivers high storage capacity in a small footprint, enabling space-efficient designs for embedded systems where board real estate is at a premium.
  • RoHS Compliant
    Meets RoHS environmental compliance standards, supporting environmentally responsible product development and global regulatory requirements.

Typical Applications

  • Industrial Automation and Control
    Provides reliable storage for programmable logic controllers (PLCs), human-machine interfaces (HMIs), and industrial PCs requiring robust embedded flash memory for operating systems, application code, and data logging in factory floor environments.
  • Networking and Communications Equipment
    Ideal for routers, switches, gateways, and network appliances that require dependable embedded storage for firmware, configuration data, and system logs in network infrastructure deployments.
  • Embedded Computing Platforms
    Serves as primary storage for single-board computers, embedded modules, and system-on-module designs across industrial, medical, and commercial applications where integrated, standardized flash storage simplifies system architecture.
  • Transportation and Telematics
    Suitable for in-vehicle systems, fleet management devices, and transportation infrastructure equipment requiring industrial-temperature-rated storage for navigation data, event recording, and system software.
  • Digital Signage and Kiosks
    Supports multimedia content storage and operating system requirements for digital signage players, interactive kiosks, and point-of-sale terminals in commercial and industrial environments.

Unique Advantages

  • Integrated Controller Simplifies Design:
    Fully integrated flash controller and NAND flash in a single package eliminates the complexity of raw NAND management, reducing development time, bill of materials costs, and design risk while providing wear leveling, error correction, and bad block management transparently.
  • JEDEC eMMC 5.1 Standard Compliance:
    Industry-standard interface ensures broad compatibility with host processors and operating systems, enabling straightforward migration between suppliers and simplifying qualification for designs targeting multiple platforms.
  • Industrial-Grade Reliability:
    Extended temperature qualification from -25°C to 85°C combined with industrial-grade NAND selection provides the robustness required for deployment in demanding environments where commercial-grade components may not be suitable.
  • Surface-Mount Form Factor:
    Standard 100-ball FBGA surface-mount package supports automated assembly processes, reduces manufacturing complexity, and enables high-volume production with standard SMT equipment and processes.
  • Scalable Storage Capacity:
    Part of Flexxon's AXO 5.1 series offering capacities from 16GB to 512GB, providing a migration path for designs requiring different storage densities while maintaining consistent interface, footprint, and qualification characteristics.
  • Dual Voltage I/O Support:
    Configurable VCCQ voltage (1.8V or 3.3V) allows integration with a wide range of host processors and system architectures, providing design flexibility without requiring additional level-shifting circuitry.

Why Choose FEMC064GBE-E530?

The FEMC064GBE-E530 delivers the combination of capacity, integration, and industrial-grade reliability that embedded system designers require for modern applications. With 64GB of storage, JEDEC eMMC 5.1 compliance, and an industrial temperature range, this embedded flash solution addresses the core requirements of industrial, networking, and embedded computing applications where performance, reliability, and standards compliance are essential.

Whether you're developing industrial control systems, networking infrastructure, embedded computing platforms, or transportation equipment, the FEMC064GBE-E530 provides a proven, integrated storage solution backed by Flexxon's expertise in industrial-grade flash memory. Its standardized interface, compact footprint, and robust environmental qualifications make it an excellent choice for designs targeting long product lifecycles and deployment in challenging operating conditions.

Ready to integrate reliable industrial-grade embedded flash storage into your next design? Contact our sales team today to request detailed specifications, pricing information, or a quote for the FEMC064GBE-E530. Our technical specialists are available to discuss your specific storage requirements and help you select the optimal eMMC solution for your application.

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