FEMC064GBB-T740

The FEMC064GBB-T740 is a 64GB embedded MultiMediaCard (eMMC) 5.1 flash memory module from Flexxon's XTRA VIII series. Built with advanced 3D TLC NAND technology, this non-volatile storage solution delivers reliable, high-capacity data retention in a compact 153-ball FBGA package. Engineered for demanding automotive and industrial applications, the FEMC064GBB-T740 combines robust performance with AEC-Q100 Grade 2 qualification, making it an ideal choice for systems requiring long-term data storage across extended temperature ranges.

Operating at clock frequencies up to 200 MHz with a flexible dual-voltage interface (1.8V/3.3V VCCQ, 3.3V VCC), this eMMC module provides efficient, space-saving embedded storage for embedded computing platforms, automotive infotainment systems, industrial controllers, and IoT devices where reliability and temperature resilience are critical design requirements.

Key Features

• High-Capacity 3D TLC Flash Storage
  64GB (512 Gbit) of non-volatile flash memory organized as 64G × 8, providing ample storage for operating systems, applications, firmware, data logging, and multimedia content in embedded systems.
• eMMC 5.1 Interface
  Standards-compliant eMMC 5.1 interface delivering reliable communication at up to 200 MHz clock frequency, ensuring compatibility with a wide range of host processors and system-on-chip platforms.
• Automotive-Grade Qualification
  AEC-Q100 Grade 2 qualified for automotive applications, meeting stringent reliability and quality standards required for in-vehicle electronic systems operating in harsh environments.
• Extended Temperature Range
  Operates reliably across -40°C to 105°C, accommodating demanding automotive, industrial, and outdoor deployment scenarios where temperature extremes are common.
• Dual Voltage Support
  Flexible power supply options with VCCQ supporting both 1.8V and 3.3V signaling levels alongside 3.3V VCC, enabling seamless integration with various host system voltage domains and reducing design complexity.
• Compact Surface-Mount Package
  153-ball FBGA (Fine-Pitch Ball Grid Array) surface-mount package optimizes board space utilization while providing robust electrical connections for high-reliability applications.
• RoHS Compliant
  Fully compliant with RoHS environmental standards, supporting eco-conscious design practices and global regulatory requirements.

Typical Applications

• Automotive Infotainment and Telematics
  Provides high-capacity storage for navigation maps, multimedia files, user interfaces, and vehicle data logging in dashboard systems, head units, and advanced driver-assistance systems (ADAS).
• Industrial Control and Automation
  Stores control firmware, configuration data, operational logs, and HMI (human-machine interface) assets in programmable logic controllers (PLCs), industrial PCs, and factory automation equipment operating in wide temperature environments.
• IoT Gateways and Edge Computing
  Enables local data buffering, edge analytics storage, and firmware management in IoT gateway devices, smart city infrastructure, and edge computing nodes requiring reliable non-volatile memory.
• Medical and Healthcare Devices
  Supports data storage requirements in portable diagnostic equipment, patient monitoring systems, and medical imaging devices where extended temperature tolerance and reliability are essential.
• Commercial and Military Electronics
  Delivers robust embedded storage for ruggedized computing platforms, avionics, communication equipment, and defense applications demanding high reliability across challenging operating conditions.

Unique Advantages

• Automotive-Qualified Reliability: AEC-Q100 Grade 2 certification ensures the FEMC064GBB-T740 meets rigorous automotive quality standards, reducing risk in safety-critical and mission-critical vehicle applications.
• Wide Operating Temperature Tolerance: The -40°C to 105°C range accommodates extreme environmental conditions without requiring active thermal management, simplifying system design and improving long-term reliability.
• Simplified Integration: Standards-based eMMC 5.1 interface and dual-voltage support enable straightforward integration with popular embedded processors and microcontrollers, accelerating time-to-market and reducing development costs.
• Space-Efficient Design: The compact 153-FBGA surface-mount package minimizes PCB footprint while providing high-density interconnect, ideal for size-constrained automotive and portable device designs.
• Proven 3D TLC Technology: Advanced 3D TLC NAND architecture delivers high storage density and cost-effective capacity, balancing performance and endurance for data-intensive embedded applications.
• Flexible Power Architecture: Multi-voltage support (1.8V/3.3V VCCQ) provides design flexibility to match host system requirements, reducing the need for additional voltage translation circuitry and lowering bill-of-materials costs.

Why Choose FEMC064GBB-T740?

The FEMC064GBB-T740 combines automotive-grade reliability, generous storage capacity, and temperature resilience in a proven eMMC 5.1 form factor. For designers developing automotive infotainment systems, industrial controllers, or rugged IoT devices, this module delivers the dependable non-volatile storage foundation required for modern embedded applications. Its AEC-Q100 Grade 2 qualification and extended temperature range make it particularly well-suited for vehicular and outdoor deployments where environmental stress and long-term reliability are paramount.

As part of Flexxon's XTRA VIII series, the FEMC064GBB-T740 benefits from a scalable product family spanning 8GB to 128GB capacities, enabling platform consistency across product lines and simplifying qualification efforts. The combination of standardized interface, robust qualification, and flexible voltage support reduces integration risk and accelerates development cycles, making this eMMC module a practical choice for engineers seeking reliable embedded storage without compromise.

Ready to integrate the FEMC064GBB-T740 into your next design? Request a quote today to discuss volume pricing, technical support, and availability. Our team is available to answer your questions and help you specify the right embedded storage solution for your application requirements.