FEMC064GBA-E540

AXO 5.1 153ball eMMC (3D TLC/3D pSLC)
Part Description

FEMC064GBA-E540 64GB eMMC 5.1 3D TLC

Quantity 535 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerFlexxon
Manufacturing StatusActive
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package153-FBGAMemory FormatFLASHTechnology3D TLC
Memory Size512 GbitGradeAutomotive grade 3Clock Frequency200 MHz
VoltageVCCQ: 1.8V/3.3V VCC: 3.3VMemory TypeNon-VolatileOperating Temperature-40°C - 85°C
Packaging153-FBGAMounting MethodSurface MountMemory InterfaceeMMC 5.1
Memory Organization64G x 8Moisture Sensitivity LevelN/ARoHS ComplianceCompliant
REACH ComplianceREACH UnknownQualificationAEC-Q100 Grade 3ECCNEAR99
HTS Code8542.32.00.71

Overview of FEMC064GBA-E540 – 64GB Automotive-Grade eMMC 5.1 Flash Memory

The FEMC064GBA-E540 is a 64GB embedded MultiMediaCard (eMMC 5.1) flash memory module from Flexxon's AXO series, designed to deliver reliable, high-performance non-volatile storage for demanding embedded applications. Built on 3D TLC NAND technology and organized as 64G × 8, this surface-mount memory solution operates at up to 200 MHz and supports dual voltage I/O (1.8V/3.3V) for flexible integration into a wide range of system architectures.

Qualified to AEC-Q100 Grade 3 standards and rated for automotive-grade operation from -40°C to 85°C, the FEMC064GBA-E540 is engineered for applications that require robust storage performance in extended temperature environments, including automotive infotainment, industrial controllers, medical devices, and IoT gateways. Its 153-ball FBGA package and eMMC 5.1 standard interface ensure straightforward PCB integration and compatibility with modern embedded processors.

Key Features

  • 64GB Storage Capacity (512 Gbit)
    Provides ample non-volatile memory for operating systems, application code, user data, and multimedia content in a compact embedded form factor.
  • eMMC 5.1 Interface
    Industry-standard interface operating at 200 MHz clock frequency enables high-speed data transfers and seamless compatibility with modern ARM, RISC-V, and x86 embedded processors.
  • 3D TLC NAND Technology
    Advanced three-dimensional triple-level cell flash architecture delivers a balanced combination of storage density, endurance, and cost-effectiveness for embedded applications.
  • Dual Voltage I/O Support
    VCCQ supports both 1.8V and 3.3V operation with VCC at 3.3V, offering design flexibility and compatibility with a broad range of host system voltage levels.
  • AEC-Q100 Grade 3 Qualified
    Meets automotive-grade reliability standards for extended temperature operation (-40°C to 85°C), ensuring dependable performance in harsh environmental conditions.
  • 153-Ball FBGA Package
    Compact surface-mount package optimizes board space utilization while providing robust electrical connectivity and thermal performance for embedded designs.
  • RoHS Compliant
    Fully compliant with environmental regulations, supporting green manufacturing and global market requirements.

Typical Applications

  • Automotive Infotainment Systems
    Stores navigation maps, multimedia content, operating systems, and application data in instrument clusters, head units, and rear-seat entertainment systems operating across wide temperature ranges.
  • Industrial Control and Automation
    Provides reliable embedded storage for programmable logic controllers (PLCs), human-machine interfaces (HMIs), and edge computing platforms in factory automation and process control environments.
  • Medical Devices
    Delivers dependable non-volatile memory for patient monitoring systems, diagnostic equipment, and portable medical instruments requiring robust data retention and extended temperature operation.
  • IoT Gateways and Edge Computing
    Supports firmware, configuration data, and local data logging in connected devices, smart city infrastructure, and industrial IoT nodes that demand reliable storage in challenging environmental conditions.
  • Transportation and Telematics
    Enables data storage for fleet management systems, vehicle tracking devices, and transportation control systems requiring automotive-grade reliability and temperature tolerance.

Unique Advantages

  • Automotive-Grade Reliability:
    AEC-Q100 Grade 3 qualification and extended temperature rating (-40°C to 85°C) ensure consistent performance in demanding automotive and industrial environments where consumer-grade storage may fail.
  • Design Simplicity:
    Standard eMMC 5.1 interface eliminates the need for external controllers or complex firmware development, accelerating time-to-market and reducing system-level design complexity.
  • Flexible Voltage Compatibility:
    Dual-voltage VCCQ support (1.8V/3.3V) simplifies integration with diverse host processors and power architectures, reducing the need for level shifters or additional voltage regulation circuitry.
  • Compact Footprint:
    153-ball FBGA surface-mount package minimizes PCB real estate requirements, enabling higher storage density in space-constrained embedded designs.
  • Wide Temperature Operation:
    -40°C to 85°C operating range supports deployment in outdoor, automotive, and industrial applications exposed to temperature extremes without requiring additional thermal management.
  • Environmental Compliance:
    RoHS-compliant construction meets global environmental standards and simplifies regulatory compliance for products sold in international markets.

Why Choose FEMC064GBA-E540?

The FEMC064GBA-E540 combines the proven reliability of automotive-grade qualification with the storage capacity and performance required for modern embedded applications. Its AEC-Q100 Grade 3 certification, extended temperature range, and dual-voltage I/O support make it an ideal choice for designs targeting automotive, industrial, medical, and IoT markets where environmental stress, long operational lifetimes, and data integrity are critical requirements.

By leveraging Flexxon's AXO series and the industry-standard eMMC 5.1 interface, the FEMC064GBA-E540 offers engineers a reliable, easy-to-integrate storage solution backed by comprehensive specifications and environmental compliance. Whether you're designing next-generation automotive infotainment, ruggedized industrial controllers, or connected edge devices, this memory module delivers the performance, durability, and design flexibility your application demands.

Ready to integrate reliable, automotive-grade embedded storage into your next design? Request a quote today to learn more about pricing, availability, and technical support for the FEMC064GBA-E540.

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    Date Founded: 2007


    Headquarters: Singapore


    Employees: 51-200


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