FEMC064G-M11

The FEMC064G-M11 from Flexxon is a high-capacity embedded multimedia card (eMMC) solution delivering 64GB of non-volatile storage in a compact 153-ball FBGA package. Built on eMMC 5.1 specification and 3D TLC NAND flash technology, this embedded storage device integrates a sophisticated flash controller with NAND memory, providing a complete storage subsystem that simplifies design and accelerates time-to-market for embedded systems.

Designed for commercial applications requiring reliable, high-density storage, the FEMC064G-M11 operates across an extended temperature range of -25°C to 85°C and supports flexible voltage configurations with VCCQ at 1.8V/3.3V and VCC at 3.3V. This makes it an ideal storage solution for industrial controls, IoT gateways, edge computing devices, digital signage, and consumer electronics where robust, integrated flash storage is essential.

Key Features

• High-Density 3D TLC Storage
  512 Gbit (64GB) capacity organized as 64G × 8, leveraging advanced 3D TLC NAND technology to deliver cost-effective, high-density storage for data-intensive embedded applications.
• eMMC 5.1 Standard Interface
  Fully compliant with JEDEC eMMC 5.1 specification, providing a standardized, widely-supported interface that ensures compatibility and reduces integration complexity across diverse platforms.
• 200 MHz Clock Frequency
  High-speed operation at 200 MHz enables efficient data transfer rates, supporting demanding read/write workloads in multimedia and data logging applications.
• Integrated Flash Management
  Embedded flash controller handles wear leveling, bad block management, and ECC (error correction code), eliminating the need for external flash management software and reducing host processor overhead.
• Flexible Voltage Operation
  Dual-voltage VCCQ support (1.8V/3.3V) alongside 3.3V VCC provides design flexibility for integration into both legacy and modern low-power systems.
• Extended Commercial Temperature Range
  Operating temperature range from -25°C to 85°C ensures reliable performance in challenging industrial and outdoor environments where temperature variations are common.
• Compact Surface-Mount Package
  153-ball FBGA package provides a space-efficient footprint for size-constrained designs while maintaining robust electrical performance and thermal characteristics.
• RoHS Compliant
  Meets environmental compliance standards, supporting green manufacturing initiatives and regulatory requirements for global distribution.

Typical Applications

• Industrial Control Systems
  Provides reliable storage for program code, configuration data, and operational logs in PLCs, HMIs, and industrial automation equipment operating in demanding environments.
• IoT and Edge Computing Devices
  Supports local data buffering, firmware storage, and edge analytics in connected devices, gateways, and edge computing platforms requiring cost-effective, integrated storage.
• Digital Signage and Display Systems
  Delivers high-capacity storage for multimedia content, operating systems, and application software in digital signage players and commercial display controllers.
• Consumer Electronics
  Enables embedded storage in set-top boxes, smart home devices, portable media players, and other consumer products requiring reliable, high-density flash memory.
• Medical and Healthcare Devices
  Provides secure, reliable storage for patient data, diagnostic information, and device firmware in medical instruments and portable healthcare monitoring equipment.

Unique Advantages

• Simplified System Design
  Integrated controller eliminates the need for external flash management, reducing design complexity, BOM cost, and development time while improving system reliability.
• Industry-Standard Interface
  eMMC 5.1 compliance ensures broad ecosystem support, mature software stacks, and straightforward migration paths across processor platforms and operating systems.
• Optimized Cost-Performance Balance
  3D TLC NAND technology delivers an optimal balance of capacity, performance, and cost-effectiveness for applications where enterprise-grade endurance is not required but reliable storage is essential.
• Reduced Host Complexity
  Embedded wear leveling, bad block management, and error correction offload critical flash management tasks from the host processor, freeing CPU resources for application workloads.
• Design Flexibility
  Dual VCCQ voltage support and commercial temperature rating provide versatility for integration across diverse product categories, from consumer devices to industrial equipment.
• Proven ECON II Platform
  Part of Flexxon's ECON II series, a family of eMMC solutions spanning 4GB to 128GB, enabling consistent design practices and simplified qualification across multiple product variants.

Why Choose the FEMC064G-M11?

The FEMC064G-M11 delivers a robust, turnkey storage solution that combines high capacity, industry-standard interfacing, and integrated flash management in a compact, surface-mount package. By handling the complexities of NAND flash operation internally, this eMMC module enables embedded system designers to focus on core application functionality rather than low-level storage management, accelerating development cycles and improving overall system reliability.

Whether you're designing next-generation IoT gateways, upgrading industrial control platforms, or developing consumer electronics, the FEMC064G-M11 provides the storage capacity, performance, and environmental robustness needed for modern embedded systems. Its compliance with the eMMC 5.1 standard ensures long-term supportability and seamless integration with major processor families, making it a dependable choice for current designs and future product roadmaps.

Ready to integrate reliable, high-capacity storage into your next design? Request a quote for the FEMC064G-M11 today to discuss your specific application requirements, volume pricing, and technical support options. Our team is available to help you select the optimal storage solution from Flexxon's comprehensive ECON II series to meet your capacity, performance, and budget objectives.