FEMC064GBA-T740

The FEMC064GBA-T740 from Flexxon is a 64GB embedded MultiMediaCard (eMMC) 5.1 storage solution built on advanced 3D TLC NAND technology. Designed for demanding automotive and industrial applications, this automotive-grade embedded flash memory delivers reliable, high-performance non-volatile storage in a compact 153-ball FBGA surface-mount package. With AEC-Q100 Grade 3 qualification and an operating temperature range of -40°C to 85°C, the FEMC064GBA-T740 is engineered to meet the rigorous requirements of automotive electronics, industrial control systems, and embedded computing platforms.

Part of the XTRA VIII Series, this eMMC 5.1 device provides 512 Gbit (64GB) of organized memory in a 64G × 8 configuration, operating at 200 MHz clock frequency with flexible voltage supply options. The combination of automotive qualification, proven 3D TLC flash technology, and the standardized eMMC 5.1 interface makes this an ideal storage solution for applications requiring reliable data retention, fast read/write performance, and long-term availability.

Key Features

• High-Capacity 3D TLC Flash Memory
  64GB (512 Gbit) storage capacity utilizing advanced 3D TLC NAND technology, organized as 64G × 8, providing substantial embedded storage for data logging, firmware, multimedia content, and application code in space-constrained designs.
• eMMC 5.1 Standard Interface
  Compliant with the eMMC 5.1 specification, offering a proven, industry-standard interface that simplifies integration with host processors and SoCs. Operates at 200 MHz clock frequency for efficient data transfer rates.
• Automotive-Grade Reliability (AEC-Q100 Grade 3)
  Qualified to AEC-Q100 Grade 3 standards, ensuring robust performance and reliability for automotive applications. Extended operating temperature range of -40°C to 85°C supports deployment in demanding automotive and industrial environments.
• Flexible Voltage Supply
  Dual voltage operation with VCC at 3.3V and VCCQ supporting both 1.8V and 3.3V, enabling compatibility with a wide range of host system architectures and reducing design complexity.
• Compact 153-Ball FBGA Package
  Surface-mount 153-FBGA package delivers high-density storage in a space-efficient form factor, ideal for automotive modules, industrial controllers, and embedded systems where board space is at a premium.
• RoHS Compliant
  Fully compliant with RoHS environmental standards, meeting global regulatory requirements for hazardous substance restrictions in electronic components.

Typical Applications

• Automotive Infotainment Systems
  Provides reliable storage for navigation maps, multimedia content, user settings, and application data in automotive head units and display systems operating across wide temperature ranges.
• Advanced Driver Assistance Systems (ADAS)
  Stores calibration data, firmware, and operational logs for camera systems, sensor fusion modules, and other ADAS components requiring automotive-qualified non-volatile memory.
• Industrial Control and Automation
  Enables data logging, configuration storage, and firmware updates in programmable logic controllers (PLCs), human-machine interfaces (HMIs), and industrial gateways exposed to harsh environmental conditions.
• Embedded Computing Platforms
  Serves as boot storage and application memory for embedded Linux, Android, or RTOS-based systems in industrial IoT devices, edge computing appliances, and ruggedized computing modules.
• Transportation and Telematics
  Supports fleet management systems, vehicle tracking devices, and digital tachographs requiring reliable, automotive-grade storage for trip data, diagnostic information, and communication logs.

Unique Advantages

• Automotive Qualification Reduces Risk: AEC-Q100 Grade 3 qualification provides documented reliability testing and quality assurance specifically for automotive applications, reducing qualification time and design risk for automotive OEMs and Tier 1 suppliers.
• 3D TLC Technology Balances Cost and Performance: Advanced 3D TLC NAND architecture delivers high storage density and competitive cost per gigabyte while maintaining the endurance and reliability required for automotive and industrial use cases.
• Standard eMMC 5.1 Interface Simplifies Migration: Industry-standard eMMC 5.1 interface ensures compatibility with existing host controller designs and enables straightforward capacity scaling or vendor diversification without hardware redesign.
• Extended Temperature Range Ensures Reliability: -40°C to 85°C operating temperature range covers the thermal demands of under-hood automotive modules, outdoor industrial equipment, and other applications exposed to environmental extremes.
• Compact Form Factor Maximizes Design Flexibility: 153-ball FBGA package minimizes PCB footprint, enabling higher integration density in space-constrained automotive modules and embedded systems while maintaining robust electrical and mechanical characteristics.
• Dual Voltage Support Enhances Compatibility: Support for both 1.8V and 3.3V I/O signaling (VCCQ) provides design flexibility to match various host processor requirements without additional level-shifting circuitry.

Why Choose FEMC064GBA-T740?

The FEMC064GBA-T740 combines automotive-grade qualification, proven 3D TLC flash technology, and the industry-standard eMMC 5.1 interface to deliver a reliable, high-capacity embedded storage solution for demanding applications. Its AEC-Q100 Grade 3 qualification and extended temperature range make it particularly well-suited for automotive electronics and industrial systems where reliability cannot be compromised. The 64GB capacity provides ample storage for modern automotive infotainment, ADAS applications, and industrial data logging while the compact 153-ball FBGA package enables space-efficient designs.

Whether you're developing next-generation automotive systems, industrial control equipment, or ruggedized embedded platforms, the FEMC064GBA-T740 offers the combination of capacity, reliability, and automotive qualification needed for production deployment. Backed by Flexxon's expertise in automotive and industrial flash storage, this eMMC device provides the long-term availability and quality assurance that design engineers and procurement teams require for multi-year production programs.

Ready to integrate automotive-grade embedded storage into your design? Request a quote for the FEMC064GBA-T740 today to discuss your capacity requirements, technical specifications, and volume pricing. Our team is available to provide technical support, samples, and application guidance to help you evaluate this eMMC solution for your specific application needs.