FEMC064GBG-T34N

The FEMC064GBG-T34N is a 64GB embedded MultiMediaCard (eMMC) solution from Flexxon's XTRA V Series, engineered for industrial applications requiring reliable, high-capacity non-volatile storage. Built on 3D TLC NAND technology and compliant with eMMC 5.1 and 4.x standards, this 153-ball FBGA device delivers 512 Gbit of storage capacity with a versatile dual-voltage I/O interface. Designed to operate across industrial temperature ranges from -25°C to 85°C, the FEMC064GBG-T34N provides embedded systems designers with a compact, surface-mount memory solution that combines substantial storage density with proven eMMC standardization.

Targeted at industrial computing, IoT gateways, medical devices, and commercial electronics, this eMMC module offers simplified integration through its standardized interface and eliminates the complexity of managing raw NAND flash. With built-in wear leveling, bad block management, and error correction handled internally, the FEMC064GBG-T34N enables faster time-to-market while delivering consistent performance at 200 MHz clock frequency.

Key Features

• High-Density 3D TLC NAND Storage
  512 Gbit (64GB) capacity organized as 64G × 8, providing ample storage for operating systems, applications, data logging, and multimedia content in embedded systems.
• eMMC 5.1 / 4.x Compatibility
  Standards-compliant embedded MultiMediaCard interface ensures broad compatibility with modern SoCs and processors while supporting legacy 4.x systems for design flexibility.
• 200 MHz Operating Frequency
  Enables high-speed data transfers to support demanding embedded applications requiring rapid boot times and responsive file access.
• Dual-Voltage I/O Support
  VCCQ operates at either 1.8V or 3.3V with VCC at 3.3V, allowing integration into diverse system architectures with different logic-level requirements.
• Industrial Temperature Range
  Rated for -25°C to 85°C operation, ensuring reliable performance in industrial control systems, outdoor equipment, and commercial environments with extended thermal requirements.
• Compact 153-FBGA Package
  Surface-mount 153-ball Fine-pitch Ball Grid Array package provides a small footprint for space-constrained embedded designs while maintaining robust mechanical and electrical connections.
• RoHS Compliant
  Meets environmental compliance standards for modern electronic products, supporting green manufacturing initiatives and global market requirements.

Typical Applications

• Industrial Control and Automation
  Provides reliable storage for HMI systems, PLCs, and industrial PCs requiring persistent data retention, configuration storage, and local data logging in factory automation environments.
• IoT Gateways and Edge Computing
  Serves as the primary storage medium for edge devices and IoT gateways running embedded Linux or real-time operating systems, storing firmware, applications, and buffered sensor data.
• Medical and Healthcare Devices
  Offers dependable non-volatile memory for medical instrumentation, diagnostic equipment, and patient monitoring systems where data integrity and consistent operation are essential.
• Digital Signage and Commercial Displays
  Stores multimedia content, operating systems, and playback software for commercial display systems, kiosks, and point-of-sale terminals in retail and hospitality environments.
• Communication Equipment
  Functions as embedded storage in routers, switches, and telecommunications infrastructure where reliable boot media and configuration storage are critical for network reliability.

Unique Advantages

• Managed NAND Solution
  Eliminates the need for external NAND controllers and firmware development by providing built-in wear leveling, bad block management, and ECC, dramatically reducing design complexity and development time.
• Standardized Integration
  eMMC standard interface ensures compatibility with a wide range of host controllers and reduces design risk compared to proprietary memory solutions, enabling easier platform migrations and second-sourcing options.
• Industrial-Grade Reliability
  Industrial temperature rating and robust 3D TLC architecture deliver dependable operation in challenging environments where consumer-grade storage may not meet longevity or thermal requirements.
• Voltage Flexibility
  Dual-voltage I/O support (1.8V/3.3V) allows designers to match the memory interface to their system's logic levels without additional level-shifting circuitry, simplifying board design and reducing BOM costs.
• Proven 3D NAND Technology
  3D TLC architecture provides improved endurance and reliability compared to planar NAND while maintaining cost-effectiveness for applications requiring substantial storage capacity in embedded form factors.
• Compact Embedded Form Factor
  153-ball FBGA package maximizes storage density per board area, making it ideal for size-constrained applications where traditional storage solutions would consume excessive PCB real estate.

Why Choose the FEMC064GBG-T34N?

The FEMC064GBG-T34N represents a balanced approach to embedded storage, combining 64GB of managed NAND flash with industrial-grade operating specifications and standardized eMMC connectivity. For engineers developing industrial, medical, or commercial embedded systems, this module eliminates the complexity of raw NAND management while providing the capacity and performance needed for modern embedded applications running Linux, Android, or real-time operating systems.

As part of Flexxon's XTRA V Series, this eMMC solution offers design teams a proven storage platform backed by comprehensive technical documentation and industrial-grade specifications. The combination of wide temperature range support, voltage flexibility, and standards-based integration makes the FEMC064GBG-T34N particularly valuable for products requiring long lifecycles, consistent supply, and reliable operation across diverse operating conditions.

Ready to integrate reliable industrial-grade embedded storage into your next design? Request a quote for the FEMC064GBG-T34N today or contact our technical sales team to discuss your specific application requirements, volume pricing, and availability.