FEMC128GBE-T740

XTRA VII 5.1 153ball eMMC (3D TLC/3D pSLC)
Part Description

FEMC128GBE-T740 128GB eMMC 5.1 3D TLC

Quantity 1,996 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerFlexxon
Manufacturing StatusActive
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package153-FBGAMemory FormatFLASHTechnology3D TLC
Memory Size1.024 TbitGradeIndustrialClock Frequency200 MHz
VoltageVCCQ: 1.8V/3.3V VCC: 3.3VMemory TypeNon-VolatileOperating Temperature-25°C - 85°C
Packaging153-FBGAMounting MethodSurface MountMemory InterfaceeMMC 5.1
Memory Organization128G x 8Moisture Sensitivity Level3RoHS ComplianceCompliant
REACH ComplianceREACH UnknownQualificationN/AECCNEAR99
HTS Code8542.32.00.71

Overview of FEMC128GBE-T740 – 128GB eMMC 5.1 Industrial Embedded Flash Memory

The FEMC128GBE-T740 is a high-capacity 128GB embedded MultiMediaCard (eMMC) 5.1 solution from Flexxon's XTRA VII Series, designed specifically for industrial embedded applications requiring reliable non-volatile storage. Built on advanced 3D TLC NAND flash technology, this surface-mount memory device delivers 1.024 Tbit of storage capacity in a compact 153-ball FBGA package, making it ideal for space-constrained designs.

Engineered to operate across the industrial temperature range of -25°C to 85°C, the FEMC128GBE-T740 provides robust, high-performance storage for applications in harsh environments. With support for dual voltage operation (1.8V/3.3V on VCCQ, 3.3V on VCC) and a 200 MHz clock frequency, this eMMC solution balances performance with power efficiency while maintaining full RoHS compliance for environmentally responsible designs.

Key Features

  • High-Capacity 3D TLC NAND Storage
    128GB (1.024 Tbit) of embedded flash memory utilizing 3D TLC technology, offering substantial storage density for data-intensive embedded applications including system firmware, operating systems, application code, and user data.
  • eMMC 5.1 Standard Interface
    Industry-standard eMMC 5.1 interface ensures broad compatibility with modern processors and SoCs while simplifying design integration. The 128G × 8 memory organization provides efficient data access and management.
  • Industrial Temperature Range
    Qualified for operation from -25°C to 85°C, enabling deployment in industrial automation, transportation systems, outdoor equipment, and other applications exposed to extended temperature variations.
  • Flexible Dual Voltage Operation
    Supports both 1.8V and 3.3V signaling on VCCQ with 3.3V core supply (VCC), allowing designers to match the memory interface to their system's I/O voltage levels and optimize power consumption.
  • Compact Surface-Mount Package
    153-ball FBGA package delivers high storage capacity in a compact footprint suitable for space-constrained embedded designs while maintaining reliable solder connections for automated assembly.
  • 200 MHz Operating Frequency
    High-speed clock operation enables fast sequential read and write performance for responsive system boot times, application loading, and data logging operations.

Typical Applications

  • Industrial Automation and Control Systems
    Provides reliable embedded storage for programmable logic controllers (PLCs), human-machine interfaces (HMIs), and industrial PCs requiring data logging, firmware storage, and configuration management in factory environments.
  • Transportation and Fleet Management
    Serves as dependable storage for vehicle infotainment systems, telematics devices, fleet tracking equipment, and transportation monitoring systems operating across wide temperature ranges.
  • Smart Building and IoT Gateways
    Enables local data storage, edge computing capabilities, and firmware management for connected building automation systems, environmental monitoring devices, and IoT gateway applications.
  • Medical and Healthcare Equipment
    Supports embedded storage requirements for medical imaging devices, patient monitoring systems, and diagnostic equipment requiring reliable non-volatile memory for data retention and system operation.
  • Network and Communication Infrastructure
    Provides boot storage, configuration management, and data logging capabilities for routers, switches, base stations, and other network infrastructure equipment demanding industrial-grade reliability.

Unique Advantages

  • Industrial-Grade Reliability: The industrial temperature qualification and proven 3D TLC NAND technology ensure consistent operation in demanding environments where consumer-grade storage would fail, reducing warranty claims and field failures.
  • Simplified BOM and Design: The integrated eMMC 5.1 interface eliminates the need for external NAND controllers and firmware development, significantly reducing design complexity, development time, and overall system cost compared to raw NAND solutions.
  • Future-Proof Storage Capacity: With 128GB of storage, the FEMC128GBE-T740 provides ample headroom for growing firmware sizes, expanded feature sets, increased data logging requirements, and extended product lifecycles without redesign.
  • Voltage Flexibility for Power Optimization: Dual voltage support on VCCQ allows designers to match I/O voltage levels with the host processor, enabling power optimization and seamless integration with both legacy 3.3V and modern 1.8V I/O systems.
  • Compact Form Factor for Space-Constrained Designs: The 153-ball FBGA package maximizes storage density while minimizing PCB footprint, enabling high-capacity storage in handheld devices, compact industrial equipment, and miniaturized embedded systems.
  • Environmental Compliance: Full RoHS compliance ensures the product meets global environmental regulations, simplifying qualification for international markets and supporting corporate sustainability initiatives.

Why Choose the FEMC128GBE-T740?

The FEMC128GBE-T740 represents a compelling choice for industrial embedded system designers who require the proven reliability of eMMC 5.1 storage combined with the capacity and environmental robustness demanded by modern applications. As part of Flexxon's XTRA VII Series, this 128GB solution balances high storage density with industrial-grade temperature qualification, making it particularly well-suited for applications that must operate reliably across harsh environmental conditions while maintaining consistent performance.

For engineering teams developing industrial equipment, transportation systems, medical devices, or infrastructure products, the FEMC128GBE-T740 offers a mature, well-documented storage solution that reduces time-to-market through simplified integration while providing the long-term reliability and capacity headroom necessary for extended product lifecycles. The combination of industry-standard eMMC 5.1 interface, flexible voltage operation, and RoHS compliance makes this device an excellent foundation for designs targeting global markets with diverse regulatory and operational requirements.

Ready to integrate reliable industrial-grade storage into your next embedded design? Contact our technical sales team today to request detailed specifications, pricing information, or sample quantities of the FEMC128GBE-T740. Our engineering support staff can help you evaluate this solution for your specific application requirements and ensure successful integration into your system architecture.

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