IS21TF08G-JQLI-TR

IC FLASH 64GBIT EMMC 100LFBGA
Part Description

IC FLASH 64GBIT EMMC 100LFBGA

Quantity 412 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusActive
Manufacturer Standard Lead Time24 Weeks
Datasheet

Specifications & Environmental

Device Package100-LFBGA (14x18)Memory FormatFLASHTechnologyFLASH - NAND (TLC)
Memory Size64 GbitAccess TimeN/AGradeIndustrial
Clock Frequency200 MHzVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging100-LBGA
Mounting MethodNon-VolatileMemory InterfaceeMMC_5.1Memory Organization8G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of IS21TF08G-JQLI-TR – IC FLASH 64Gbit eMMC 100-LFBGA

The IS21TF08G-JQLI-TR is a 64 Gbit non-volatile NAND flash memory device implemented as an eMMC package. It uses TLC NAND technology with an eMMC 5.1 interface and is organized as 8G × 8 to provide block-addressable embedded storage.

Designed for embedded storage integration, the device offers a 200 MHz clock frequency, a 2.7 V–3.6 V supply range, and a 100-LFBGA (14 × 18 mm) package, targeting systems that require moderate-capacity flash in a compact BGA footprint and a robust operating temperature range of −40 °C to 85 °C.

Key Features

  • Memory Type & Technology  64 Gbit non-volatile NAND flash implemented with TLC technology for higher storage density in a single device.
  • Memory Organization  Organized as 8G × 8 to present an 8-bit memory bus and support the stated capacity and interface implementation.
  • Interface  eMMC 5.1 memory interface for standard embedded MMC connectivity and integration into host controllers that support eMMC.
  • Performance  200 MHz clock frequency specification to define device timing parameters for host integration.
  • Power Supply  Operates from a 2.7 V to 3.6 V supply range, supporting common system power rails for eMMC-based storage.
  • Package  Supplied in a 100-LFBGA (14 × 18 mm) package, providing a compact BGA footprint for space-constrained PCBs.
  • Operating Temperature  Rated for −40 °C to 85 °C ambient temperature, suitable for systems requiring extended temperature range operation.

Unique Advantages

  • Higher storage density: 64 Gbit capacity in a single eMMC device reduces the need for multiple flash components.
  • Standard eMMC interface: eMMC 5.1 simplifies host integration with defined MMC command sets and signal behavior.
  • Compact BGA package: 100-LFBGA (14 × 18 mm) minimizes PCB area for embedded applications.
  • Wide supply range: 2.7 V–3.6 V operation accommodates common system rails.
  • Extended temperature operation: −40 °C to 85 °C rating supports designs that operate across broad ambient conditions.
  • TLC NAND implementation: Enables higher raw bit density for cost-effective storage capacity.

Why Choose IS21TF08G-JQLI-TR?

The IS21TF08G-JQLI-TR positions itself as a compact, mid-capacity embedded storage solution that combines 64 Gbit TLC NAND flash with an eMMC 5.1 interface. Its 200 MHz clock parameter, 2.7 V–3.6 V supply compatibility, and 100-LFBGA package make it suitable for designs that require an integrated flash memory solution in a constrained form factor and an extended temperature range.

This device is appropriate for engineers seeking a standardized eMMC memory module from ISSI for use in embedded systems where specified capacity, package size, voltage range, and temperature rating are primary selection criteria.

Request a quote or submit an inquiry for IS21TF08G-JQLI-TR to obtain pricing, lead time, and availability information.

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