IS21TF08G-JQLI-TR
| Part Description |
IC FLASH 64GBIT EMMC 100LFBGA |
|---|---|
| Quantity | 412 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 24 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 100-LFBGA (14x18) | Memory Format | FLASH | Technology | FLASH - NAND (TLC) | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 64 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | 200 MHz | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 100-LBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | eMMC_5.1 | Memory Organization | 8G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of IS21TF08G-JQLI-TR – IC FLASH 64Gbit eMMC 100-LFBGA
The IS21TF08G-JQLI-TR is a 64 Gbit non-volatile NAND flash memory device implemented as an eMMC package. It uses TLC NAND technology with an eMMC 5.1 interface and is organized as 8G × 8 to provide block-addressable embedded storage.
Designed for embedded storage integration, the device offers a 200 MHz clock frequency, a 2.7 V–3.6 V supply range, and a 100-LFBGA (14 × 18 mm) package, targeting systems that require moderate-capacity flash in a compact BGA footprint and a robust operating temperature range of −40 °C to 85 °C.
Key Features
- Memory Type & Technology 64 Gbit non-volatile NAND flash implemented with TLC technology for higher storage density in a single device.
- Memory Organization Organized as 8G × 8 to present an 8-bit memory bus and support the stated capacity and interface implementation.
- Interface eMMC 5.1 memory interface for standard embedded MMC connectivity and integration into host controllers that support eMMC.
- Performance 200 MHz clock frequency specification to define device timing parameters for host integration.
- Power Supply Operates from a 2.7 V to 3.6 V supply range, supporting common system power rails for eMMC-based storage.
- Package Supplied in a 100-LFBGA (14 × 18 mm) package, providing a compact BGA footprint for space-constrained PCBs.
- Operating Temperature Rated for −40 °C to 85 °C ambient temperature, suitable for systems requiring extended temperature range operation.
Unique Advantages
- Higher storage density: 64 Gbit capacity in a single eMMC device reduces the need for multiple flash components.
- Standard eMMC interface: eMMC 5.1 simplifies host integration with defined MMC command sets and signal behavior.
- Compact BGA package: 100-LFBGA (14 × 18 mm) minimizes PCB area for embedded applications.
- Wide supply range: 2.7 V–3.6 V operation accommodates common system rails.
- Extended temperature operation: −40 °C to 85 °C rating supports designs that operate across broad ambient conditions.
- TLC NAND implementation: Enables higher raw bit density for cost-effective storage capacity.
Why Choose IS21TF08G-JQLI-TR?
The IS21TF08G-JQLI-TR positions itself as a compact, mid-capacity embedded storage solution that combines 64 Gbit TLC NAND flash with an eMMC 5.1 interface. Its 200 MHz clock parameter, 2.7 V–3.6 V supply compatibility, and 100-LFBGA package make it suitable for designs that require an integrated flash memory solution in a constrained form factor and an extended temperature range.
This device is appropriate for engineers seeking a standardized eMMC memory module from ISSI for use in embedded systems where specified capacity, package size, voltage range, and temperature rating are primary selection criteria.
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