IS21TF32G-JCLI-TR
| Part Description |
IC FLASH 256GBIT EMMC 153VFBGA |
|---|---|
| Quantity | 740 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 24 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 153-VFBGA (11.5x13) | Memory Format | FLASH | Technology | FLASH - NAND (TLC) | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | 200 MHz | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 153-VFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | eMMC_5.1 | Memory Organization | 32G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of IS21TF32G-JCLI-TR – IC FLASH 256GBIT EMMC 153VFBGA
The IS21TF32G-JCLI-TR is a 256 Gbit non-volatile NAND flash memory device in an eMMC form factor, using TLC NAND technology. It provides high-density embedded storage with an eMMC 5.1 interface and a 200 MHz clock frequency, packaged in a compact 153-VFBGA (11.5 × 13 mm) footprint.
Designed for systems that require high-capacity, board-mounted flash in a small package and a supply range of 2.7 V to 3.6 V, the device operates across an industrial temperature range of -40°C to 85°C and is manufactured by Integrated Silicon Solution Inc.
Key Features
- Memory Type & Technology Non-volatile FLASH using NAND (TLC) technology, providing 256 Gbit total capacity organized as 32G × 8.
- Memory Interface eMMC_5.1 interface for managed embedded flash connectivity and system integration.
- Performance Clock frequency specified at 200 MHz for the eMMC interface.
- Voltage Supply Operates from 2.7 V to 3.6 V to support standard embedded system power rails.
- Package 153-VFBGA package (11.5 × 13 mm) for compact board-level implementation.
- Operating Temperature Specified operating ambient temperature range of -40°C to 85°C (TA).
Typical Applications
- Embedded Storage High-density non-volatile storage for systems that require up to 256 Gbit of onboard flash.
- Compact Consumer Devices Board-mounted VFBGA package supports space-constrained consumer electronics requiring managed eMMC storage.
- Industrial Equipment Wide operating temperature range (-40°C to 85°C) enables use in industrial applications with thermal variation.
Unique Advantages
- High Capacity in a Small Footprint: 256 Gbit density in a 153-VFBGA (11.5 × 13 mm) package reduces board area for high-capacity designs.
- Managed eMMC Interface: eMMC_5.1 interface simplifies host integration compared with raw NAND, supporting standard embedded storage workflows.
- Industry-Grade Temperature Range: -40°C to 85°C operation addresses designs exposed to wide ambient temperatures.
- Flexible Power Supply Range: 2.7 V to 3.6 V operation fits common system power rails and simplifies power rail planning.
- TLC NAND Technology: TLC NAND provides high bit density to meet storage capacity requirements while optimizing board-level space.
Why Choose IC FLASH 256GBIT EMMC 153VFBGA?
The IS21TF32G-JCLI-TR combines high-density TLC NAND flash with an eMMC 5.1 managed interface to deliver compact, board-mounted storage suitable for embedded and industrial applications. Its 256 Gbit capacity, 200 MHz clock capability, and supply range of 2.7 V to 3.6 V make it appropriate for systems that demand significant non-volatile storage without large package footprints.
Backed by Integrated Silicon Solution Inc., this device is positioned for designs that prioritize capacity, integration simplicity, and operation across a broad temperature range, offering a reliable option for engineers specifying high-density eMMC storage.
Request a quote or submit an inquiry for the IS21TF32G-JCLI-TR to obtain pricing and availability information for your next design.
