IS21TF32G-JQLI

IC FLASH 256GBIT EMMC 100LFBGA
Part Description

IC FLASH 256GBIT EMMC 100LFBGA

Quantity 1,943 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusActive
Manufacturer Standard Lead Time24 Weeks
Datasheet

Specifications & Environmental

Device Package100-LFBGA (14x18)Memory FormatFLASHTechnologyFLASH - NAND (TLC)
Memory Size256 GbitAccess TimeN/AGradeIndustrial
Clock Frequency200 MHzVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging100-LBGA
Mounting MethodNon-VolatileMemory InterfaceeMMC_5.1Memory Organization32G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of IS21TF32G-JQLI - 256Gbit eMMC 5.1 NAND Flash Memory

The IS21TF32G-JQLI is a 256-gigabit embedded MultiMediaCard (eMMC) 5.1 flash memory device from ISSI, utilizing triple-level cell (TLC) NAND technology. Organized as 32G x 8, this high-density non-volatile memory solution provides reliable data storage for embedded applications requiring substantial capacity in a compact footprint. With a 200MHz clock frequency and eMMC 5.1 interface, the IS21TF32G-JQLI delivers the performance and standardization needed for modern embedded systems.

Designed for industrial-grade reliability, this memory device operates across an extended temperature range of -40°C to 85°C, making it suitable for demanding environments where consistent data retention and access are critical. The 100-LFBGA package measures just 14x18mm, enabling space-efficient designs in applications where board real estate is at a premium.

Key Features

  • High-Density Storage: 256-gigabit capacity (32GB) provides ample space for operating systems, application code, and user data in embedded designs.
  • TLC NAND Technology: Triple-level cell architecture balances density and cost-effectiveness while maintaining reliable performance for embedded applications.
  • eMMC 5.1 Interface: Industry-standard interface simplifies integration with host controllers and provides up to 200MHz clock operation for efficient data throughput.
  • Extended Temperature Range: -40°C to 85°C operating range ensures reliable operation in industrial environments, outdoor equipment, and automotive applications.
  • Compact Package: 100-pin LFBGA package in 14x18mm footprint minimizes PCB space requirements while providing robust mechanical stability.
  • Flexible Voltage Operation: 2.7V to 3.6V supply voltage range accommodates various system power designs and enables compatibility with common power rails.

Typical Applications

  • Industrial Control Systems: This eMMC provides reliable program and data storage for PLCs, industrial PCs, and HMI terminals where the extended temperature range ensures consistent operation in factory floor environments.
  • Automotive Infotainment: The 256Gbit capacity supports multimedia content, navigation maps, and application data in automotive head units and cluster displays, with temperature tolerance suitable for in-cabin electronics.
  • Medical Devices: Embedded systems in diagnostic equipment and patient monitoring devices benefit from the reliable non-volatile storage for firmware, configuration data, and temporary patient information.
  • Network Equipment: Routers, switches, and edge computing devices utilize this eMMC for boot code, operating system storage, and configuration management in telecommunications infrastructure.
  • Set-Top Boxes and Streaming Devices: The high-density storage accommodates operating systems, applications, and cached content in consumer electronics that require substantial on-board memory.

Unique Advantages

  • Simplified BOM: Integrated controller and NAND in a single package eliminates the need for external flash controllers, reducing component count and design complexity.
  • Proven eMMC Standard: eMMC 5.1 compliance ensures broad compatibility with existing host controllers and software stacks, accelerating time to market.
  • Industrial Temperature Reliability: The -40°C to 85°C range extends product applicability beyond commercial-grade designs into industrial and automotive environments.
  • Optimized Footprint: The 14x18mm LFBGA package delivers high density in minimal space, enabling compact product designs and multi-layer board layouts.
  • Flexible Power Design: Wide 2.7V to 3.6V operating range simplifies power supply design and enables operation from standard 3.3V rails common in embedded systems.
  • Active Lifecycle Status: Current production status ensures long-term availability for designs with multi-year product lifecycles.

Why Choose IS21TF32G-JQLI?

The IS21TF32G-JQLI addresses the needs of embedded system designers who require substantial non-volatile storage in a compact, standardized package. Its eMMC 5.1 interface provides plug-and-play compatibility with a wide range of processors and controllers, while the 256-gigabit capacity meets the demands of modern embedded applications running complex operating systems and data-intensive software. The extended temperature specification makes this device particularly valuable in industrial automation, transportation, and outdoor equipment where commercial-grade components may not provide adequate reliability margins.

For designs prioritizing space efficiency, supply chain stability, and long-term availability, the IS21TF32G-JQLI from ISSI offers a balanced solution combining industry-standard interface compatibility, proven NAND flash technology, and the environmental robustness required for professional embedded applications.

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Contact our sales team for pricing, availability, and technical support for the IS21TF32G-JQLI. Our application engineers can assist with integration guidance, system-level design considerations, and volume pricing for production requirements.

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