IS21TF64G-JCLI-TR
| Part Description |
IC FLASH 512GBIT EMMC 153VFBGA |
|---|---|
| Quantity | 617 Available (as of May 4, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 24 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 153-VFBGA (11.5x13) | Memory Format | FLASH | Technology | FLASH - NAND (TLC) | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | 200 MHz | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 153-VFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | eMMC_5.1 | Memory Organization | 64G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of IS21TF64G-JCLI-TR – IC FLASH 512GBIT EMMC 153VFBGA
The IS21TF64G-JCLI-TR is a 512Gbit non-volatile NAND flash memory device implemented with TLC technology and organized as 64G × 8. It provides integrated eMMC 5.1 interface support and is delivered in a 153‑ball VFBGA package (11.5 × 13 mm).
This device targets designs that require high-density embedded storage with a standard eMMC interface, offering a defined operating temperature range and common supply voltage window for system integration.
Key Features
- Memory Core 512 Gbit NAND flash using TLC technology with organization of 64G × 8.
- Interface eMMC 5.1 memory interface for host connectivity and standard eMMC protocol support.
- Clock Performance 200 MHz clock frequency to support device timing requirements.
- Power Operating supply voltage range of 2.7 V to 3.6 V for compatibility with common system rails.
- Package 153‑ball VFBGA package, supplied as 153‑VFBGA with dimensions 11.5 × 13 mm for compact board integration.
- Operating Temperature Specified ambient operating range from −40 °C to 85 °C (TA).
Typical Applications
- Embedded Storage Use as onboard non-volatile storage in systems that support an eMMC 5.1 host interface.
- Compact Systems High-density memory in space-constrained designs leveraging the 153‑VFBGA (11.5 × 13 mm) package.
- Industrial Ambient Environments Deployment in systems requiring operation across −40 °C to 85 °C ambient temperatures.
Unique Advantages
- High Storage Density: 512 Gbit capacity enables large data and firmware storage within a single device.
- Standard eMMC Interface: eMMC 5.1 simplifies host integration with standardized protocol support.
- Compact Package Footprint: 153‑VFBGA (11.5 × 13 mm) package offers a small board area for high-density designs.
- Wide Supply Range: 2.7 V to 3.6 V operation supports common system power rails.
- Extended Temperature Range: Specified for −40 °C to 85 °C ambient operation to address a broad set of environmental conditions.
Why Choose IC FLASH 512GBIT EMMC 153VFBGA?
The IS21TF64G-JCLI-TR combines a large 512 Gbit TLC NAND array with an eMMC 5.1 interface and a compact 153‑VFBGA package, making it suited to designs that need high-capacity, board-level embedded storage. Its defined supply voltage window and −40 °C to 85 °C operating range provide clear integration parameters for system design.
This device is appropriate for customers specifying high-density eMMC storage in a compact package and seeking straightforward electrical integration via the eMMC 5.1 interface and common voltage rails.
Request a quote or contact sales to discuss availability, lead times, and pricing for the IS21TF64G-JCLI-TR.
