IS21TF64G-JQLI-TR

IC FLASH 512GBIT EMMC 100LFBGA
Part Description

IC FLASH 512GBIT EMMC 100LFBGA

Quantity 254 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusActive
Manufacturer Standard Lead Time24 Weeks
Datasheet

Specifications & Environmental

Device Package100-LFBGA (14x18)Memory FormatFLASHTechnologyFLASH - NAND (TLC)
Memory Size512 GbitAccess TimeN/AGradeIndustrial
Clock Frequency200 MHzVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging100-LBGA
Mounting MethodNon-VolatileMemory InterfaceeMMC_5.1Memory Organization64G x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of IS21TF64G-JQLI-TR – IC FLASH 512GBIT EMMC 100LFBGA

The IS21TF64G-JQLI-TR is a 512 Gbit non-volatile flash memory device implemented as NAND (TLC) in an eMMC form factor. It provides a 64G x 8 memory organization with an eMMC_5.1 interface for embedded storage applications that require high-density onboard flash.

Designed for integration where compact package size, standard eMMC interface, and a wide supply and temperature range are required, this device targets embedded storage and system memory expansion in space-constrained electronics.

Key Features

  • Memory Core 512 Gbit NAND flash (TLC) with 64G × 8 organization to deliver high-density non-volatile storage.
  • Interface eMMC_5.1 memory interface for standard embedded memory connectivity and system integration.
  • Performance Supports a clock frequency up to 200 MHz for eMMC timing and data transfer operations.
  • Voltage Operates from 2.7 V to 3.6 V supply, accommodating common embedded system power rails.
  • Package Supplied in a 100-LFBGA package (14 × 18 mm) for compact board-level integration.
  • Operating Temperature Specified for −40°C to 85°C ambient (TA), supporting a wide range of thermal environments.

Typical Applications

  • Embedded Storage Onboard non-volatile storage for systems requiring high-density NAND flash with an eMMC_5.1 interface.
  • Consumer Electronics Compact-package memory integration where board space is limited and high-capacity storage is needed.
  • Industrial Systems Applications that require operation across a wide temperature range and standard eMMC connectivity.

Unique Advantages

  • High-density NAND in a compact package: 512 Gbit capacity in a 100-LFBGA (14×18 mm) minimizes PCB area for high-capacity designs.
  • Standard eMMC_5.1 interface: Simplifies system integration by using a common embedded memory protocol.
  • Wide operating voltage range: 2.7 V to 3.6 V compatibility with common system power rails reduces power-supply design constraints.
  • Broad temperature support: −40°C to 85°C rating supports deployment in varied thermal environments.
  • Deterministic memory organization: 64G × 8 organization enables predictable addressing and capacity planning in system design.

Why Choose IS21TF64G-JQLI-TR?

The IS21TF64G-JQLI-TR positions itself as a high-density, board-level eMMC flash solution that balances capacity, standard interface compatibility, and compact packaging. Its NAND (TLC) architecture and eMMC_5.1 interface make it suited for embedded systems that require significant non-volatile storage while maintaining a small footprint.

This device is appropriate for designers and procurement teams looking for a proven eMMC flash component with a defined operating voltage range and wide ambient temperature support, offering reliable integration into space-constrained electronics platforms.

Request a quote or submit an inquiry to obtain pricing, availability, and ordering information for the IS21TF64G-JQLI-TR.

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