IS21TF64G-JQLI-TR
| Part Description |
IC FLASH 512GBIT EMMC 100LFBGA |
|---|---|
| Quantity | 254 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 24 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 100-LFBGA (14x18) | Memory Format | FLASH | Technology | FLASH - NAND (TLC) | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | 200 MHz | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 100-LBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | eMMC_5.1 | Memory Organization | 64G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of IS21TF64G-JQLI-TR – IC FLASH 512GBIT EMMC 100LFBGA
The IS21TF64G-JQLI-TR is a 512 Gbit non-volatile flash memory device implemented as NAND (TLC) in an eMMC form factor. It provides a 64G x 8 memory organization with an eMMC_5.1 interface for embedded storage applications that require high-density onboard flash.
Designed for integration where compact package size, standard eMMC interface, and a wide supply and temperature range are required, this device targets embedded storage and system memory expansion in space-constrained electronics.
Key Features
- Memory Core 512 Gbit NAND flash (TLC) with 64G × 8 organization to deliver high-density non-volatile storage.
- Interface eMMC_5.1 memory interface for standard embedded memory connectivity and system integration.
- Performance Supports a clock frequency up to 200 MHz for eMMC timing and data transfer operations.
- Voltage Operates from 2.7 V to 3.6 V supply, accommodating common embedded system power rails.
- Package Supplied in a 100-LFBGA package (14 × 18 mm) for compact board-level integration.
- Operating Temperature Specified for −40°C to 85°C ambient (TA), supporting a wide range of thermal environments.
Typical Applications
- Embedded Storage Onboard non-volatile storage for systems requiring high-density NAND flash with an eMMC_5.1 interface.
- Consumer Electronics Compact-package memory integration where board space is limited and high-capacity storage is needed.
- Industrial Systems Applications that require operation across a wide temperature range and standard eMMC connectivity.
Unique Advantages
- High-density NAND in a compact package: 512 Gbit capacity in a 100-LFBGA (14×18 mm) minimizes PCB area for high-capacity designs.
- Standard eMMC_5.1 interface: Simplifies system integration by using a common embedded memory protocol.
- Wide operating voltage range: 2.7 V to 3.6 V compatibility with common system power rails reduces power-supply design constraints.
- Broad temperature support: −40°C to 85°C rating supports deployment in varied thermal environments.
- Deterministic memory organization: 64G × 8 organization enables predictable addressing and capacity planning in system design.
Why Choose IS21TF64G-JQLI-TR?
The IS21TF64G-JQLI-TR positions itself as a high-density, board-level eMMC flash solution that balances capacity, standard interface compatibility, and compact packaging. Its NAND (TLC) architecture and eMMC_5.1 interface make it suited for embedded systems that require significant non-volatile storage while maintaining a small footprint.
This device is appropriate for designers and procurement teams looking for a proven eMMC flash component with a defined operating voltage range and wide ambient temperature support, offering reliable integration into space-constrained electronics platforms.
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