IS22EF08G-JCLA2
| Part Description |
IC FLASH 64MBIT EMMC 153FBGA |
|---|---|
| Quantity | 1,010 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 52 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 153-VFBGA (11.5x13) | Memory Format | FLASH | Technology | FLASH - NAND (MLC) | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 64 Gbit | Access Time | N/A | Grade | Automotive | ||
| Clock Frequency | 200 MHz | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 105°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 153-VFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | eMMC_5.1 | Memory Organization | 8G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of IS22EF08G-JCLA2 – IC FLASH 64MBIT EMMC 153FBGA
The IS22EF08G-JCLA2 from ISSI is a non-volatile NAND flash memory device in an eMMC form factor. It implements MLC NAND technology with a 64 Gbit capacity organized as 8G × 8 and exposes an eMMC_5.1 interface for embedded storage integration.
Packaged in a 153-VFBGA (11.5 × 13 mm) footprint and operating over a 2.7 V to 3.6 V supply range and −40°C to 105°C ambient, the device targets compact systems that require high-density, board-mounted flash with standard eMMC connectivity.
Key Features
- Memory Technology NAND Flash (MLC) non-volatile memory delivering 64 Gbit capacity organized as 8G × 8.
- Interface eMMC_5.1 memory interface for host connection and system integration.
- Performance 200 MHz clock frequency.
- Power Operates from a 2.7 V to 3.6 V supply range.
- Package 153-VFBGA package (11.5 × 13 mm) for high-density board mounting.
- Environmental Operating ambient temperature range −40°C to 105°C (TA).
- Memory Format & Organization FLASH memory format with 8G × 8 organization.
Typical Applications
- Embedded Systems Provides integrated non-volatile storage where an eMMC_5.1 interface is required for firmware and data retention.
- Industrial Equipment Wide temperature range supports deployment in industrial environments requiring robust, board-mounted flash.
- Handheld and Portable Devices Compact 153-VFBGA package and high-density storage suited to space-constrained device designs.
- Multimedia and Consumer Devices High-capacity NAND storage for applications that need on-board content or user data storage with eMMC connectivity.
Unique Advantages
- High-density capacity: 64 Gbit in an 8G × 8 organization enables significant local storage without external memory components.
- Standard eMMC_5.1 interface: Simplifies integration with eMMC-compatible hosts and existing system controllers.
- Wide operating voltage: 2.7 V to 3.6 V supply range supports common system power rails.
- Extended temperature range: −40°C to 105°C ambient operation for applications with thermal variability.
- Compact VFBGA package: 153-pin, 11.5 × 13 mm footprint supports high-density PCB layouts.
- MLC NAND format: Provides non-volatile storage in a flash memory format suitable for embedded data and code storage.
Why Choose IC FLASH 64MBIT EMMC 153FBGA?
The IS22EF08G-JCLA2 combines high-capacity MLC NAND flash with an eMMC_5.1 interface in a compact 153-VFBGA package, offering a straightforward board-mounted storage option for embedded designs. Its 2.7 V–3.6 V supply range and −40°C to 105°C operating window make it suitable for a range of environmental conditions.
Manufactured by ISSI (Integrated Silicon Solution Inc), this device is appropriate for engineers specifying on-board eMMC storage where capacity, interface compatibility, and a compact package are primary selection criteria.
Request a quote or submit a product inquiry to obtain pricing, availability, and lead-time information for the IS22EF08G-JCLA2.
