IS25WX128-JHLA3-TR

IC FLASH 128MBIT SPI/OCT 24TFBGA
Part Description

IC FLASH 128MBIT SPI/OCT 24TFBGA

Quantity 29 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package24-TFBGA (6x8)Memory FormatFLASHTechnologyFLASH
Memory Size128 MbitAccess TimeN/AGradeAutomotive
Clock Frequency200 MHzVoltage1.7V ~ 2VMemory TypeNon-Volatile
Operating Temperature-40°C ~ 125°C (TA)Write Cycle Time Word PageN/APackaging24-TBGA
Mounting MethodNon-VolatileMemory InterfaceSPI - Octal I/OMemory Organization16M x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of IS25WX128-JHLA3-TR – 128 Mbit Octal SPI Flash, 24-TFBGA

The IS25WX128-JHLA3-TR is a 128 Mbit non-volatile FLASH memory device organized as 16M × 8 with an SPI – Octal I/O memory interface. It supports operation at up to 200 MHz clock frequency and is designed for applications requiring compact, high-density serial flash storage.

Key hardware characteristics include a 1.7 V to 2.0 V supply range, a wide operating ambient temperature of −40°C to 125°C, and a 24-TFBGA (6×8) package for compact board integration.

Key Features

  • Memory Type & Capacity 128 Mbit FLASH non-volatile memory, organized as 16M × 8 for byte-wide access.
  • Interface SPI – Octal I/O serial interface providing octal data lanes for serial communication.
  • Performance Supports operation with a clock frequency up to 200 MHz.
  • Voltage Supply Low-voltage operation with a supply range of 1.7 V to 2.0 V.
  • Package 24-TFBGA package (6×8) offering a compact footprint for PCB space-constrained designs.
  • Operating Temperature Rated for ambient operation from −40°C to 125°C (TA).
  • Memory Format FLASH non-volatile memory format suitable for persistent code and data storage.

Typical Applications

  • Space-Constrained Designs Compact 24-TFBGA footprint and 128 Mbit density for systems with limited PCB area.
  • High-Speed Serial Memory Interfaces Octal SPI I/O and 200 MHz clock support serial access patterns that benefit from wider data lanes.
  • Low-Voltage Systems 1.7 V to 2.0 V supply range for designs targeting reduced core voltages.
  • Wide-Temperature Equipment −40°C to 125°C operating range for applications requiring extended ambient thermal capability.

Unique Advantages

  • Compact BGA Package: 24-TFBGA (6×8) enables high-density placement and board-space savings.
  • Octal SPI I/O: Parallelized serial lanes simplify high-throughput serial memory implementations.
  • 200 MHz Clock Capability: Supports faster serial clocking to reduce serial transfer times where supported by the system.
  • Low-Voltage Operation: 1.7 V–2.0 V supply allows integration into lower-voltage power domains.
  • Wide Operating Temperature: −40°C to 125°C rating supports use in thermally demanding environments.
  • Standard Memory Organization: 16M × 8 layout provides predictable addressing and byte-oriented access.

Why Choose IS25WX128-JHLA3-TR?

The IS25WX128-JHLA3-TR positions itself as a compact, serial flash solution delivering 128 Mbit of non-volatile storage with an Octal SPI interface and up to 200 MHz clock operation. Its combination of low-voltage operation and wide ambient temperature range makes it suitable for designs that require reliable non-volatile memory in constrained footprints.

Designers building systems that need a small-package, octal SPI flash device with defined voltage and temperature characteristics can leverage this device to match application requirements for density, packaging, and operating conditions.

Request a quote or submit an inquiry to receive pricing and availability information for the IS25WX128-JHLA3-TR or to discuss volume needs and lead times.

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