IS25WX256-JHLA3-TR
| Part Description |
IC FLASH 256MBIT SPI/OCT 24TFBGA |
|---|---|
| Quantity | 86 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 24-TFBGA (6x8) | Memory Format | FLASH | Technology | FLASH | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Mbit | Access Time | N/A | Grade | Automotive | ||
| Clock Frequency | 200 MHz | Voltage | 1.7V ~ 2V | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 125°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 24-TBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | SPI - Octal I/O | Memory Organization | 32M x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of IS25WX256-JHLA3-TR - 256Mbit Octal SPI NOR Flash Memory
The IS25WX256-JHLA3-TR is a 256-megabit serial NOR flash memory with Octal SPI interface, organized as 32M x 8 bits. This high-performance non-volatile storage solution delivers up to 200MHz clock frequency, enabling data throughput of 400MB/s in Octal DTR mode. Designed for embedded systems requiring fast boot times and code execution, it operates across an extended temperature range of -40°C to 125°C (TA), making it suitable for both consumer and industrial applications.
Key Features
- High-Density Storage - 256Mbit (32MB) of non-volatile flash memory organized as 32M x 8, providing ample space for firmware, code execution, and data storage in embedded designs.
- Octal SPI Interface - Supports Octal I/O SPI with up to 200MHz clock frequency, delivering significantly higher bandwidth than traditional Quad SPI for faster boot and read operations.
- Low Operating Voltage - 1.7V to 2V supply voltage range reduces power consumption and aligns with modern low-power system designs.
- Extended Temperature Range - Operates reliably from -40°C to 125°C (TA), ensuring performance across industrial and automotive-adjacent environments.
- Compact Package - 24-pin TFBGA (6x8mm) footprint minimizes board space requirements while maintaining manufacturability.
Typical Applications
- Embedded Systems - This flash memory serves as boot code storage for microcontrollers and processors, where the Octal SPI interface enables fast system initialization and execute-in-place (XIP) capabilities.
- Industrial Control Systems - The extended temperature rating makes it suitable for storing firmware and configuration data in PLCs, motor drives, and industrial IoT devices that must operate reliably in harsh environments.
- Networking Equipment - High-speed Octal SPI access supports firmware storage in routers, switches, and access points where rapid boot times and firmware updates are critical to network uptime.
- Consumer Electronics - The 256Mbit capacity and compact TFBGA package fit space-constrained designs like smart home devices, wearables, and portable instruments requiring non-volatile program storage.
- Automotive Infotainment - Operating across wide temperature ranges, this flash memory handles code storage for dashboard displays, telematics modules, and ADAS systems where reliability is essential.
Unique Advantages
- Reduced Boot Time: Octal SPI at 200MHz delivers up to 2x faster read speeds compared to Quad SPI, accelerating system initialization and improving user experience.
- Simplified BOM: Single-chip integration of 256Mbit eliminates the need for multiple smaller flash devices, reducing component count and assembly costs.
- Design Flexibility: Wide voltage range (1.7V to 2V) allows compatibility with both 1.8V and newer ultra-low-power processor families without level shifters.
- Enhanced Reliability: Extended temperature operation (-40°C to 125°C) ensures consistent performance across diverse deployment environments without requiring thermal management.
- Board Space Optimization: The 6x8mm TFBGA package provides high density in a small footprint, freeing up board real estate for additional features or size reduction.
- Future-Proof Interface: Octal SPI support positions designs for next-generation processor interfaces while maintaining backward compatibility with standard SPI modes.
Why Choose IS25WX256-JHLA3-TR?
The IS25WX256-JHLA3-TR addresses the growing demand for higher-bandwidth non-volatile storage in embedded systems. By combining 256Mbit capacity with Octal SPI performance, it meets the requirements of applications transitioning from legacy Quad SPI while maintaining a familiar serial flash architecture. The extended temperature range and compact package make it particularly well-suited for industrial designs where reliability and board space are at a premium.
Engineers designing systems that require fast code execution, frequent firmware updates, or execute-in-place capabilities will benefit from the performance headroom provided by 200MHz Octal SPI operation. With active lifecycle status from ISSI, this component offers long-term availability for new designs and production stability for volume deployments.
Get Started with IS25WX256-JHLA3-TR
Ready to integrate high-performance Octal SPI flash into your design? Contact our technical sales team to discuss your application requirements, request samples, or obtain volume pricing for the IS25WX256-JHLA3-TR. Our specialists can help you optimize your memory architecture for performance, cost, and reliability.