IS25WX512M-JHLA3

The IS25WX512M-JHLA3 is a 512 Mbit non-volatile FLASH memory organized as 64M × 8 with an SPI Octal I/O interface. It delivers high-density serial storage in a compact 24-TFBGA (6 × 8 mm) package.

Designed for systems requiring serial FLASH storage with octal SPI throughput, this device supports a 200 MHz clock and operates from 1.7 V to 2.0 V across an ambient temperature range of −40 °C to 125 °C, addressing applications that need wide temperature capability and small-form-factor memory.

Key Features

• Memory Type & Capacity  512 Mbit FLASH memory organized as 64M × 8 for high-density non-volatile code and data storage.
• Interface  SPI – Octal I/O interface for octal serial communication, enabling wider parallelism within an SPI-compatible protocol.
• Performance  Supports a clock frequency up to 200 MHz to enable higher-speed serial transfers.
• Voltage  Operates at a supply voltage range of 1.7 V to 2.0 V for lower-voltage system designs.
• Operating Temperature  Rated for −40 °C to 125 °C (TA), suitable for designs that require extended temperature operation.
• Package  24-TFBGA (6 × 8 mm) ball-grid array package for compact board-level integration and small footprint.

Typical Applications

• Embedded Systems  Use as non-volatile program or data storage where a compact 24-TFBGA package and octal SPI I/O are required.
• Industrial Control  Suitable for industrial controllers and instrumentation that require memory rated for −40 °C to 125 °C operation.
• Networking & Communications  Provides high-density serial storage and 200 MHz clock capability for firmware and configuration storage in compact modules.

Unique Advantages

• High-density 512 Mbit capacity: Enables storage of large firmware images, lookup tables, or data logs in a single device.
• Octal SPI interface: Offers broader serial data path within an SPI-compatible framework to support higher throughput compared with narrower SPI modes.
• 200 MHz clock support: Allows faster serial transfers where system timing supports higher-frequency operation.
• Low-voltage operation (1.7 V–2.0 V): Aligns with lower-voltage system rails to minimize additional power-rail requirements.
• Wide operating temperature (−40 °C to 125 °C): Supports deployment in environments with extended temperature demands.
• Compact 24-TFBGA package: Reduces board area while providing a ball-grid interface for dense PCB layouts.

Why Choose IS25WX512M-JHLA3?

The IS25WX512M-JHLA3 combines 512 Mbit FLASH density with an octal SPI interface and 200 MHz clock capability in a compact 24-TFBGA package. Its 1.7 V–2.0 V supply range and −40 °C to 125 °C operating window make it suitable for designs that require small-form-factor serial storage with extended temperature tolerance.

This device is well suited to engineers specifying high-density non-volatile storage for embedded systems, industrial equipment, and compact communications modules where board space, supply voltage, and temperature range are key constraints.

Request a quote or submit a sales inquiry to obtain pricing, lead times, and availability for IS25WX512M-JHLA3.