IS25WX512M-JHLA3-TR

The IS25WX512M-JHLA3-TR is a 512 Mbit non-volatile flash memory device featuring an Octal SPI (SPI/Octal I/O) interface in a compact 24-TFBGA package. It provides high-density serial flash storage with support for up to 200 MHz clock operation and low-voltage supply down to 1.7 V.

With a 64M × 8 organization, wide operating temperature range, and a small 24-TFBGA (6 × 8) package, this device is suited for applications that require high-density, low-voltage flash memory in space-constrained designs.

Key Features

• Memory Type & Capacity 512 Mbit non-volatile Flash organized as 64M × 8 for high-density serial storage.
• Interface SPI – Octal I/O interface enabling parallelized serial transfers for increased throughput compared with standard SPI modes.
• Performance Supports a clock frequency up to 200 MHz to enable faster data transfers over the Octal SPI interface.
• Power Low-voltage operation with a supply range of 1.7 V to 2.0 V to support energy-conscious designs.
• Package 24-TFBGA (6 × 8) BGA package that minimizes PCB area while providing a robust surface-mount footprint.
• Temperature Range Rated for −40°C to 125°C (TA), supporting extended-temperature applications.

Typical Applications

• Embedded Memory Storage Provides 512 Mbit of non-volatile storage accessible via Octal SPI for firmware, code, and data storage in embedded systems.
• Space-Constrained Designs The 24-TFBGA package and serial Octal interface enable high-density storage in compact PCB layouts.
• Low-Voltage Systems Suited for designs operating at 1.7 V–2.0 V where reduced supply voltage is required.

Unique Advantages

• High-Density Serial Storage: 512 Mbit capacity (64M × 8) provides substantial non-volatile memory in a serial Flash form factor.
• Faster Serial Throughput: Octal SPI interface combined with up to 200 MHz clocking enables higher transfer rates than conventional SPI modes.
• Low-Voltage Operation: 1.7 V–2.0 V supply range reduces system power budgets and supports low-voltage platforms.
• Compact BGA Footprint: 24-TFBGA (6 × 8) package minimizes PCB area for compact device layouts.
• Extended Temperature Capability: −40°C to 125°C rating supports applications requiring wide operating temperature margins.

Why Choose IS25WX512M-JHLA3-TR?

The IS25WX512M-JHLA3-TR combines high-density 512 Mbit flash storage with an Octal SPI interface and 200 MHz clock capability to deliver a compact, higher-throughput serial memory solution. Its low-voltage operation and small 24-TFBGA package make it suitable for designs that require dense non-volatile storage in constrained form factors and wide-temperature operation.

This device is ideal for engineers specifying reliable, space-efficient flash memory where performance, reduced power, and thermal range are key selection criteria. The straightforward memory organization and standardized Octal SPI interface support integration into a range of embedded applications.

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