IS27TH064G31-JCLA2

64GB, 153 BALL FBGA, 3.3V, ROHS,
Part Description

64GB, 153 BALL FBGA, 3.3V, ROHS,

Quantity 967 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusActive
Manufacturer Standard Lead Time52 Weeks
Datasheet

Specifications & Environmental

Device Package153-VFBGA (11.5x13)Memory FormatFLASHTechnologyFLASH - NAND (TLC)
Memory Size512 GbitAccess TimeN/AGradeAutomotive
Clock Frequency38.4 MHzVoltage2.25V ~ 2.75VMemory TypeNon-Volatile
Operating Temperature-40°C ~ 105°C (TA)Write Cycle Time Word PageN/APackaging153-VFBGA
Mounting MethodNon-VolatileMemory InterfaceUFS 3.1Memory Organization64G x 8
Moisture Sensitivity LevelN/ARoHS ComplianceN/AREACH ComplianceREACH Unknown
QualificationAEC-Q100ECCNN/AHTS CodeN/A

Overview of IS27TH064G31-JCLA2 – 64GB UFS 3.1 NAND Flash, 153-VFBGA

The IS27TH064G31-JCLA2 from ISSI is a 64GB (512 Gbit) non-volatile NAND flash device implemented with TLC technology and organized as 64G × 8. It implements a UFS 3.1 memory interface in a compact 153-ball VFBGA package (11.5 × 13 mm).

Designed for applications that require high-density embedded storage and robust environmental performance, the device carries AEC‑Q100 qualification and supports an extended operating temperature range of -40°C to 105°C, delivering a combination of density, industry-standard interface, and automotive-grade qualification.

Key Features

  • Memory Type & Density Non-volatile NAND flash (TLC) organized as 64G × 8 for a total memory size of 512 Gbit (64GB).
  • Interface UFS 3.1 memory interface for standardized high-performance storage integration.
  • Qualification & Temperature AEC‑Q100 qualification with an operating temperature range of -40°C to 105°C, suitable for demanding environments.
  • Package 153‑VFBGA (153‑ball FBGA) footprint, package dimensions 11.5 × 13 mm to support space-constrained layouts.
  • Voltage Supply voltage range: 2.25 V to 2.75 V.
  • Clock 38.4 MHz clock frequency as indicated in device specifications.
  • Mounting & Format Surface-mount VFBGA package provided as a FLASH memory format for board-level integration.

Typical Applications

  • Automotive systems — High-density non-volatile storage for automotive electronics where AEC‑Q100 qualification and extended temperature range are required.
  • Embedded storage — On-board UFS 3.1 storage for embedded platforms requiring compact, high-capacity flash.
  • Infotainment and telematics — Large-capacity local storage for media, map data, and system logs in vehicle infotainment and telematics modules.

Unique Advantages

  • High storage density: 512 Gbit (64GB) capacity consolidates large data storage into a single device, reducing the need for multiple parts.
  • Automotive-grade qualification: AEC‑Q100 qualification demonstrates suitability for automotive development and reliability requirements.
  • Wide operating temperature: -40°C to 105°C supports deployments in harsh and variable-temperature environments.
  • Compact package: 153‑VFBGA (11.5 × 13 mm) enables space-saving board designs while providing ball-grid mounting robustness.
  • Standards-based interface: UFS 3.1 provides a defined interface for integration into systems using universal flash storage standards.
  • System supply compatibility: 2.25 V to 2.75 V supply range aligns with common embedded power rails.

Why Choose 64GB, 153 BALL FBGA, 3.3V, ROHS,

The IS27TH064G31-JCLA2 positions itself as a high-density, standards-driven embedded storage component that combines 64GB of TLC NAND flash with a UFS 3.1 interface and automotive-level qualification. Its compact 153‑VFBGA package and wide temperature range make it suitable for designs that require reliable, board-mounted non-volatile memory under challenging conditions.

This device is appropriate for designers targeting automotive and embedded applications that need consolidated storage capacity, a standardized interface for system integration, and documented qualification for demanding environments. Its specifications support long-term deployment scenarios where environmental tolerance and component stability are priorities.

Request a quote or submit an inquiry to discuss availability, pricing, and lead time for IS27TH064G31-JCLA2. Our team can provide ordering and support information tailored to your project requirements.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay
    Featured Products
    Latest News
    keyboard_arrow_up