IS27TH064G31-JCLI
| Part Description |
64GB, 153 BALL FBGA, 3.3V, ROHS |
|---|---|
| Quantity | 140 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 52 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 153-VFBGA (11.5x13) | Memory Format | FLASH | Technology | FLASH - NAND (TLC) | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | 38.4 MHz | Voltage | 2.25V ~ 2.75V | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 153-VFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | UFS 3.1 | Memory Organization | 64G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of IS27TH064G31-JCLI - 64GB UFS 3.1 NAND Flash Memory
The IS27TH064G31-JCLI is a high-capacity 64-gigabyte NAND flash memory device utilizing TLC (Triple-Level Cell) technology with a UFS 3.1 interface. Designed for applications requiring fast, reliable non-volatile storage, this memory component delivers efficient data access and retention in compact mobile and embedded systems.
With its 153-ball VFBGA package and extended temperature range, the IS27TH064G31-JCLI provides a robust storage solution for industrial, automotive infotainment, and consumer electronics applications where space constraints and environmental resilience are critical design factors.
Key Features
- High-Density Storage - 64GB (512 Gbit) capacity organized as 64G x 8, providing ample non-volatile storage for data-intensive applications in a single compact package.
- UFS 3.1 Interface - Industry-standard Universal Flash Storage 3.1 interface operating at 38.4 MHz clock frequency enables fast sequential read/write performance and efficient random access for mobile and embedded applications.
- TLC NAND Technology - Triple-Level Cell flash architecture maximizes storage density while maintaining cost-effectiveness, making it ideal for applications where high capacity is prioritized.
- Extended Temperature Range - Rated for operation from -40°C to 85°C (ambient), ensuring reliable performance across industrial, automotive, and harsh-environment deployments.
- Compact Package - 153-ball VFBGA in 11.5mm x 13mm footprint minimizes board space requirements while providing robust connection reliability.
- Low Voltage Operation - Operates on 2.25V to 2.75V supply voltage, supporting power-efficient designs and compatibility with modern low-voltage systems.
Typical Applications
- Mobile Computing Devices - This UFS 3.1 flash memory serves as embedded storage in smartphones, tablets, and portable gaming devices where the high-speed interface ensures responsive app performance and quick file access while the 64GB capacity accommodates modern operating systems and user data.
- Automotive Infotainment Systems - The extended temperature range and high capacity make this memory ideal for storing maps, media libraries, and system software in vehicle head units and digital instrument clusters where reliability across temperature extremes is essential.
- Industrial IoT Gateways - Provides non-volatile storage for data logging, firmware, and buffered sensor data in edge computing devices where the wide temperature tolerance ensures operation in factory floors and outdoor installations.
- Surveillance and Security Systems - High-capacity storage supports video buffering and event logging in IP cameras and NVR systems where continuous write operations benefit from the UFS interface's efficient wear-leveling and error correction.
- Portable Medical Devices - Enables secure storage of patient data, diagnostic images, and device firmware in handheld medical instruments where the compact package and low voltage operation support battery-powered designs.
Unique Advantages
- Proven UFS Standard: Leverages the widely-adopted UFS 3.1 specification, simplifying integration with existing host controllers and reducing software development time compared to proprietary interfaces.
- Balance of Capacity and Cost: TLC NAND technology delivers higher bit density than SLC or MLC alternatives, enabling 64GB capacity at competitive pricing for cost-sensitive volume applications.
- Industrial-Grade Temperature Range: -40°C to 85°C operation expands deployment options beyond consumer-grade components, eliminating the need for thermal management in many industrial use cases.
- Board Space Efficiency: The 153-ball VFBGA package concentrates high-density storage in a minimal footprint, freeing valuable PCB area for additional functionality or enabling smaller product enclosures.
- Active Lifecycle Status: Currently in active production, ensuring long-term availability for product designs with multi-year lifecycles and reducing obsolescence risk in fielded systems.
- RoHS Compliant: Meets environmental regulations for lead-free manufacturing, supporting global market access and corporate sustainability initiatives.
Why Choose IS27TH064G31-JCLI?
The IS27TH064G31-JCLI addresses the growing demand for high-capacity embedded storage in space- and power-constrained applications. Its combination of industry-standard UFS 3.1 interface, extended temperature qualification, and compact ball-grid-array packaging makes it particularly well-suited for industrial and automotive designs where consumer-grade components fall short on environmental resilience.
For engineers designing next-generation mobile devices, infotainment systems, or industrial equipment, this memory component provides a reliable foundation with proven technology backed by ISSI's expertise in memory solutions. The active production status ensures design longevity while the standard interface minimizes integration complexity.
Get a Quote
Contact our sales team to discuss pricing, lead times, and volume availability for the IS27TH064G31-JCLI. Our technical support staff can assist with integration questions and provide additional documentation to accelerate your design cycle.
