IS27TH064G21-JCLA2

The IS27TH064G21-JCLA2 is a 64GB (512 Gbit) non-volatile NAND flash memory device implemented in TLC technology with a UFS 2.1 memory interface. Packaged in a compact 153‑VFBGA (11.5 × 13 mm) ball-grid format, it is designed for systems that require integrated high-density flash storage with a defined operating voltage and temperature range.

This device targets applications requiring robust storage in demanding environments: it supports a 2.7 V–3.6 V supply range, a 38.4 MHz clock frequency, and an operating temperature range of −40 °C to 105 °C, and carries AEC‑Q100 qualification for automotive use.

Key Features

• Memory Type & Capacity 64G × 8 organization delivering 512 Gbit of TLC NAND non-volatile flash memory for high-density storage.
• Interface UFS 2.1 memory interface support for serial flash connectivity requirements.
• Clock Supports a 38.4 MHz clock frequency as specified for interface timing.
• Voltage Wide supply range of 2.7 V to 3.6 V (nominal 3.3 V operation) to accommodate common system rails.
• Package 153‑VFBGA (11.5 × 13 mm) ball‑grid package optimized for compact board-level integration.
• Temperature & Qualification Industrial/automotive grade operation from −40 °C to 105 °C and AEC‑Q100 qualification for automotive system requirements.
• Compliance Marked as RoHS (product listing indicates RoHS status), supporting environmental regulatory considerations.

Typical Applications

• Automotive Infotainment and Telematics High-density non-volatile storage for firmware, media, and data in systems that require AEC‑Q100 qualification and extended temperature operation.
• In-Vehicle Data Logging Persistent storage for logging and recording applications that operate across −40 °C to 105 °C and require a compact package footprint.
• Industrial Embedded Storage Solid-state storage for controllers and embedded modules needing a wide supply range (2.7 V–3.6 V) and durable NAND memory.

Unique Advantages

• High Density in a Compact Package: 512 Gbit (64GB) of TLC NAND in a 153‑VFBGA (11.5 × 13 mm) package reduces board area for high-capacity designs.
• Automotive-Grade Qualification: AEC‑Q100 qualification and −40 °C to 105 °C operating range support deployment in automotive applications.
• Flexible Power Options: Operates across a 2.7 V–3.6 V supply range (nominal 3.3 V), providing compatibility with common system power rails.
• UFS 2.1 Interface: Standard UFS 2.1 memory interface support for integration with UFS-capable controllers.
• Defined Timing Support: Specification includes a 38.4 MHz clock frequency for predictable interface timing in system design.

Why Choose IS27TH064G21-JCLA2?

The IS27TH064G21-JCLA2 provides a high-density, automotive‑qualified NAND flash solution in a space-efficient 153‑VFBGA package. Its combination of TLC NAND capacity, UFS 2.1 interface support, wide supply voltage range, and extended temperature rating make it suitable for embedded systems where robust non-volatile storage and predictable electrical/timing characteristics are required.

This device is appropriate for designers building automotive and industrial systems that need scalable storage capacity, package-level integration, and supplier-backed qualification for harsh operating environments.

Request a quote or submit an inquiry to receive pricing, availability, and integration support for the IS27TH064G21-JCLA2.