IS27TH064G21-JCLI

The IS27TH064G21-JCLI is a 64GB non-volatile NAND flash memory device from Integrated Silicon Solution Inc (ISSI). It implements TLC NAND technology with a UFS 2.1 memory interface and is organized as 64G × 8 (512 Gbit), delivering high-density embedded storage in a compact BGA package.

Designed for systems that require high-capacity, board-mounted flash, the device supports a 2.7V–3.6V supply range, a 38.4 MHz clock frequency, and an extended operating temperature range of –40°C to 85°C.

Key Features

• Memory Type & Technology Non-volatile NAND flash using TLC (triple-level cell) technology for high-density storage in a single device.
• Capacity & Organization 64G × 8 organization providing 512 Gbit total memory capacity (listed as 64GB in product naming).
• Interface UFS 2.1 memory interface for standardized high-throughput connectivity to host controllers.
• Clock Supports a 38.4 MHz clock frequency as specified for device operation.
• Power Wide supply voltage range from 2.7V to 3.6V, allowing flexibility across system power domains (nominal 3.3V indicated in product name).
• Package 153-ball Very Fine Ball Grid Array (153-VFBGA) with package dimensions 11.5 × 13 mm, suitable for compact board-level integration.
• Operating Temperature Rated for –40°C to 85°C ambient operation, supporting deployments requiring extended temperature performance.
• Compliance Product listing includes RoHS designation in the product name.

Typical Applications

• Embedded storage systems — High-density on-board flash memory for devices requiring large non-volatile storage capacity with a UFS 2.1 interface.
• Consumer electronics — Compact BGA package and 64GB capacity enable integration into space-constrained consumer products that need onboard program or data storage.
• Industrial equipment — Extended operating temperature range (–40°C to 85°C) supports deployment in temperature-demanding industrial environments.

Unique Advantages

• High-density storage in a single component: 512 Gbit (64G × 8) organization delivers substantial capacity without multiple devices or complex board routing.
• Standard UFS 2.1 interface: Provides a standardized host interface for simpler integration into systems that support UFS.
• Wide supply voltage compatibility: 2.7V–3.6V operating range accommodates a range of system power architectures while the product name indicates 3.3V nominal operation.
• Compact VFBGA package: 153-ball 11.5 × 13 mm package reduces PCB footprint for space-constrained designs.
• Extended temperature rating: –40°C to 85°C operation suitable for applications with demanding thermal environments.
• Vendor-backed solution: Manufactured by Integrated Silicon Solution Inc (ISSI), enabling procurement from a known memory supplier.

Why Choose 64GB, 153 BALL FBGA, 3.3V, ROHS?

The IS27TH064G21-JCLI positions itself as a compact, high-capacity NAND flash option for designs requiring on-board non-volatile storage with a UFS 2.1 interface. Its 512 Gbit (64GB) capacity in a 153-VFBGA package, combined with a broad supply voltage window and extended temperature rating, makes it suitable for systems that balance density, form factor, and environmental robustness.

Designers targeting embedded storage solutions that need standardized interface support and a small PCB footprint can leverage this device for streamlined integration. Backed by Integrated Silicon Solution Inc (ISSI), the component provides a clear specification set for engineering evaluation and procurement.

If you need pricing, availability, or technical clarification for the IS27TH064G21-JCLI, request a quote or submit an inquiry to discuss your design requirements and lead times.