IS25WX256-JHLE-TR

IC FLASH 256MBIT SPI/OCT 24TFBGA
Part Description

IC FLASH 256MBIT SPI/OCT 24TFBGA

Quantity 142 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package24-TFBGA (6x8)Memory FormatFLASHTechnologyFLASH
Memory Size256 MbitAccess TimeN/AGradeAutomotive
Clock Frequency200 MHzVoltage1.7V ~ 2VMemory TypeNon-Volatile
Operating Temperature-40°C ~ 105°C (TA)Write Cycle Time Word PageN/APackaging24-TBGA
Mounting MethodNon-VolatileMemory InterfaceSPI - Octal I/OMemory Organization32M x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCN3A991B1AHTS Code8542.32.0071

Overview of IS25WX256-JHLE-TR – IC FLASH 256Mbit SPI/Octal I/O 24-TFBGA

The IS25WX256-JHLE-TR is a 256 Mbit non-volatile FLASH memory device with an SPI — Octal I/O memory interface. It is organized as 32M x 8 and provides a serial flash option in a compact 24-TFBGA (6x8) package.

Key electrical and environmental characteristics include a 200 MHz clock frequency, a low-voltage supply range of 1.7 V to 2.0 V, and an operating temperature range of –40°C to 105°C, making it suitable for embedded designs that require compact, low-voltage non-volatile storage.

Key Features

  • Memory: 256 Mbit FLASH organized as 32M x 8 for byte-oriented access and data storage.
  • Interface & Performance: SPI — Octal I/O memory interface with a 200 MHz clock frequency for high-rate serial flash transfers.
  • Power: Low-voltage operation with a supply range of 1.7 V to 2.0 V to support low-power system designs.
  • Package: 24-TBGA package; supplier device package listed as 24-TFBGA (6x8) for compact board footprint.
  • Temperature Range: Operating temperature from –40°C to 105°C (TA) for extended-temperature deployments.
  • Technology: Non-volatile FLASH memory technology providing persistent storage.

Unique Advantages

  • Octal I/O Serial Interface: The SPI — Octal I/O interface increases parallel data lanes compared to single/dual SPI, enabling faster serial transfers within the specified 200 MHz clocking.
  • Compact BGA Footprint: 24-TFBGA (6x8) package reduces board area for space-constrained designs.
  • Low-Voltage Operation: 1.7 V to 2.0 V supply range supports designs targeting lower-power rails and reduced system power consumption.
  • Wide Operating Temperature: –40°C to 105°C rating supports deployment in extended-temperature environments.
  • Standard Memory Organization: 32M x 8 organization offers straightforward byte-oriented memory mapping for firmware and data storage.

Why Choose IS25WX256-JHLE-TR?

The IS25WX256-JHLE-TR delivers a compact, low-voltage FLASH memory option with an SPI — Octal I/O interface and a 200 MHz clock frequency. Its 256 Mbit capacity (32M x 8) in a 24-TFBGA (6x8) package combines a small footprint with non-volatile storage suitable for embedded and system applications requiring persistent memory.

This device is appropriate for designs where low-voltage operation, extended operating temperature, and a compact BGA package are important. Its clear, verifiable specifications help streamline component selection for engineers focused on robust, space-efficient memory integration.

Request a quote or submit a request for pricing and availability for the IS25WX256-JHLE-TR to evaluate it for your design needs.

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