IS42S32200N-6BLI-TR
| Part Description |
IC DRAM 64MBIT PARALLEL 90TFBGA |
|---|---|
| Quantity | 777 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 14 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 90-TFBGA (8x13) | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 64 Mbit | Access Time | 5.4 ns | Grade | Industrial | ||
| Clock Frequency | 166 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 90-TFBGA | ||
| Mounting Method | Volatile | Memory Interface | LVTTL | Memory Organization | 2M x 32 | ||
| Moisture Sensitivity Level | N/A | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | N/A | HTS Code | N/A |
Overview of IS42S32200N-6BLI-TR – IC DRAM 64MBIT PARALLEL 90TFBGA
The IS42S32200N-6BLI-TR is a 64 Mbit volatile SDRAM organized as 2M × 32. It implements a parallel SDRAM architecture with LVTTL signaling and is intended for systems requiring off-chip dynamic memory.
Key characteristics include a 166 MHz clock rate, 5.4 ns access time, a 3.0 V to 3.6 V supply range, and operation across a −40°C to 85°C ambient temperature window, delivered in a compact 90‑TFBGA (8×13) package.
Key Features
- Memory Technology SDRAM volatile memory format suitable for standard parallel DRAM implementations.
- Capacity & Organization 64 Mbit total capacity organized as 2M × 32 for wide‑bus data transfers.
- Performance 166 MHz clock frequency with an access time of 5.4 ns, enabling responsive read/write cycles within the specified timing.
- Interface LVTTL memory interface signaling for parallel data communication.
- Power Operating supply voltage from 3.0 V to 3.6 V.
- Package & Mounting Supplied in a 90‑TFBGA (8×13) package for surface mounting and space‑constrained board layouts.
- Operating Temperature Rated for −40°C to 85°C (TA) operation.
Unique Advantages
- Compact BGA footprint: The 90‑TFBGA (8×13) package provides a small board area for dense PCB designs while supporting a wide data bus.
- Wide voltage tolerance: Operation across 3.0 V to 3.6 V accommodates typical 3 V system rails and variations.
- High-speed access: 166 MHz clocking and 5.4 ns access time support fast memory transactions for latency-sensitive tasks.
- Wide operating temperature: −40°C to 85°C rating addresses a broad range of ambient environments.
- Parallel 32-bit data path: 2M × 32 organization enables wide, efficient data transfers in parallel memory architectures.
Why Choose IS42S32200N-6BLI-TR?
The IS42S32200N-6BLI-TR provides a straightforward 64 Mbit SDRAM solution combining a parallel 32‑bit data organization with 166 MHz operation and low‑nanosecond access time. Its electrical and thermal specifications make it suitable for designs that require predictable SDRAM performance within a 3.0 V–3.6 V power domain and an extended ambient temperature range.
This device is appropriate for system designs that need compact BGA packaging, a parallel LVTTL interface, and well‑defined timing characteristics. Selecting this part supports consistent memory performance and board‑level density where a 64 Mbit volatile SDRAM is required.
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