IS43R86400F-5TLI
| Part Description |
IC DRAM 512MBIT PAR 66TSOP II |
|---|---|
| Quantity | 566 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 66-TSOP II | Memory Format | DRAM | Technology | SDRAM - DDR | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Mbit | Access Time | 700 ps | Grade | Industrial | ||
| Clock Frequency | 200 MHz | Voltage | 2.5V ~ 2.7V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | 15 ns | Packaging | 66-TSSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 64M x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0028 |
Overview of IS43R86400F-5TLI - 512Mb DDR SDRAM for Industrial Applications
The IS43R86400F-5TLI from ISSI is a 512-megabit DDR SDRAM memory IC delivering reliable parallel memory access for embedded systems. With its 64M x 8 organization and 200 MHz clock frequency, this device provides efficient data throughput for mid-range processing applications. Operating across the industrial temperature range of -40°C to 85°C, it ensures consistent performance in demanding environmental conditions.
Key Features
- Memory Core: 512-megabit capacity organized as 64M x 8, providing flexible word-aligned data access for embedded processors and controllers.
- DDR SDRAM Technology: Double Data Rate architecture transfers data on both rising and falling clock edges, maximizing bandwidth efficiency at 200 MHz clock frequency with 0.7ns access time.
- Power Supply: 2.5V to 2.7V operating voltage delivers power-efficient operation suitable for battery-powered and energy-conscious designs.
- Industrial Temperature Range: -40°C to 85°C operation ensures reliable performance in factory automation, transportation systems, and outdoor equipment installations.
- Package: 66-TSOP II (0.400", 10.16mm width) footprint provides space-efficient PCB layout for compact embedded system designs.
- Parallel Interface: Standard parallel memory bus simplifies integration with microprocessors, DSPs, and FPGAs using established interface protocols.
Typical Applications
- Industrial Automation: This DDR SDRAM provides working memory for programmable logic controllers (PLCs) and human-machine interfaces (HMIs) where extended temperature tolerance ensures consistent operation in factory floor environments exposed to heat and cold.
- Transportation Systems: The industrial-grade temperature specification makes this memory suitable for automotive infotainment, telematics, and vehicle control systems that must operate reliably across seasonal temperature extremes.
- Networking Equipment: Router, switch, and gateway designs benefit from the parallel interface and moderate clock speed for packet buffering and configuration storage in telecom infrastructure applications.
- Medical Devices: Embedded medical equipment requiring stable memory performance across varying operating conditions can leverage the wide temperature range and proven DDR SDRAM architecture.
- Test and Measurement Instruments: Data acquisition systems and portable test equipment utilize this memory for sample buffering and waveform storage where industrial temperature operation is essential.
Unique Advantages
- Proven DDR Architecture: Standard DDR SDRAM interface minimizes development risk and leverages mature controller IP available for most embedded processors.
- Industrial Temperature Qualification: -40°C to 85°C operation eliminates the need for thermal management in many embedded applications, reducing BOM cost and design complexity.
- Efficient Power Profile: 2.5V core voltage reduces power consumption compared to legacy SDRAM technologies while maintaining compatibility with common system power rails.
- Parallel Interface Simplicity: Direct processor bus connection avoids the complexity and latency of serial memory interfaces, simplifying firmware development and debugging.
- Compact TSOP Footprint: Space-efficient package enables higher memory density on constrained PCB layouts common in embedded and industrial designs.
- Active Lifecycle Status: Ongoing production availability supports long product lifecycles required for industrial and embedded systems with multi-year deployment horizons.
Why Choose IS43R86400F-5TLI?
The IS43R86400F-5TLI addresses the memory requirements of embedded systems operating in industrial environments where temperature extremes demand component-level resilience. Its 512-megabit capacity strikes a practical balance for applications requiring moderate working memory without over-provisioning, while the DDR architecture provides bandwidth efficiency for real-time processing tasks. The parallel interface and standard footprint enable straightforward integration with established processor platforms.
For designs prioritizing industrial temperature operation, proven technology, and supply chain stability, this ISSI DDR SDRAM delivers reliable memory performance backed by active production status suitable for long-term embedded deployments.
Get Started
Contact our technical sales team to discuss your memory requirements, request pricing for production volumes, or obtain evaluation samples of the IS43R86400F-5TLI for your next embedded system design.