IS43R86400F-5TLI-TR

IC DRAM 512MBIT PAR 66TSOP II
Part Description

IC DRAM 512MBIT PAR 66TSOP II

Quantity 1,703 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package66-TSOP IIMemory FormatDRAMTechnologySDRAM - DDR
Memory Size512 MbitAccess Time700 psGradeIndustrial
Clock Frequency200 MHzVoltage2.5V ~ 2.7VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word Page15 nsPackaging66-TSSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceParallelMemory Organization64M x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0028

Overview of IS43R86400F-5TLI-TR - 512Mbit DDR SDRAM Memory IC

The IS43R86400F-5TLI-TR is a 512-megabit DDR SDRAM memory integrated circuit organized as 64M x 8, designed for high-speed data applications requiring reliable volatile memory storage. Built on DDR SDRAM technology with a 200MHz clock frequency and 7ns access time, this memory IC delivers efficient performance for embedded systems, computing platforms, and industrial equipment operating across extended temperature ranges from -40°C to 85°C.

Key Features

  • Memory Architecture: 512Mbit capacity in a 64M x 8 organization provides flexible memory configuration for system designs requiring moderate density and byte-wide data paths.
  • DDR SDRAM Technology: Double data rate synchronous DRAM technology enables data transfers on both rising and falling clock edges, maximizing bandwidth efficiency at the 200MHz clock frequency.
  • High-Speed Performance: 7ns access time and 15ns write cycle time deliver fast read and write operations suitable for real-time processing and data-intensive applications.
  • Power Supply: Operates on 2.5V to 2.7V supply voltage, consistent with standard DDR SDRAM power requirements for mainstream embedded system integration.
  • Extended Temperature Range: -40°C to 85°C operating temperature qualification ensures reliable operation in industrial and automotive environments with demanding thermal conditions.
  • Package: Available in a 66-pin TSOP II surface-mount package with 10.16mm width, providing a compact footprint for space-constrained PCB designs.

Typical Applications

  • Industrial Control Systems: This DDR SDRAM serves as main memory for programmable logic controllers, motion controllers, and industrial PCs where extended temperature tolerance ensures consistent performance in factory floor environments with variable thermal conditions.
  • Networking Equipment: Provides buffer memory and data storage for routers, switches, and network appliances that require moderate memory density with fast access times to handle packet processing and routing table operations.
  • Embedded Computing Platforms: Functions as system memory in single-board computers, embedded controllers, and IoT gateways where the 64M x 8 organization offers efficient byte-wide data access for microprocessor and microcontroller interfaces.
  • Test and Measurement Instruments: Supplies data capture and storage memory for oscilloscopes, logic analyzers, and data acquisition systems that demand reliable volatile memory with fast write cycles to capture high-speed signal data.
  • Automotive Infotainment: Supports non-safety-critical automotive electronics such as dashboard displays and entertainment systems where the extended temperature range accommodates in-cabin temperature variations.

Unique Advantages

  • Extended Temperature Qualification: -40°C to 85°C rating eliminates the need for thermal management in many industrial applications, simplifying system design and reducing component costs.
  • Standard DDR Interface: Industry-standard DDR SDRAM interface ensures compatibility with a wide range of processors and controllers, accelerating time-to-market with proven interface IP and drivers.
  • Compact TSOP II Package: 66-pin TSOP II form factor provides a space-efficient surface-mount solution with established manufacturing processes for reliable PCB assembly.
  • Moderate Density Sweet Spot: 512Mbit capacity addresses applications between low-density SRAM and high-density DDR2/DDR3 solutions, optimizing cost and power for mid-range memory requirements.
  • Active Lifecycle Status: Current production availability ensures long-term supply stability for products with multi-year lifecycles and reduces obsolescence risk for industrial designs.
  • Proven DDR SDRAM Technology: Mature technology node offers predictable electrical characteristics and well-understood design considerations, reducing development risk compared to newer memory technologies.

Why Choose IS43R86400F-5TLI-TR?

The IS43R86400F-5TLI-TR delivers a proven balance of memory density, performance, and environmental tolerance for embedded and industrial applications. Its 512Mbit capacity and 64M x 8 organization fit designs requiring byte-wide memory access without the complexity of higher-density solutions. The extended -40°C to 85°C temperature range positions this memory IC for industrial control, networking, and automotive applications where commercial-grade components fall short.

For design teams developing embedded systems with multi-year production lifecycles, this active-status DDR SDRAM component from ISSI provides supply continuity and the reliability of mature SDRAM technology. The standard DDR interface ensures broad processor compatibility and leverages existing software drivers, while the compact TSOP II package supports space-efficient PCB layouts.

Get Started

To discuss pricing, availability, and technical specifications for the IS43R86400F-5TLI-TR in your design, contact our sales team for a detailed quotation. Our technical support engineers can assist with integration guidance, reference designs, and application-specific recommendations.

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