IS43R86400F-5TL-TR

IC DRAM 512MBIT SSTL 66TSOPII
Part Description

IC DRAM 512MBIT SSTL 66TSOPII

Quantity 1,357 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerIntegrated Silicon Solution Inc
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package66-TSOP IIMemory FormatDRAMTechnologySDRAM - DDR
Memory Size512 MbitAccess Time700 psGradeCommercial
Clock Frequency200 MHzVoltage2.3V ~ 2.7VMemory TypeVolatile
Operating Temperature0°C ~ 70°C (TA)Write Cycle Time Word Page15 nsPackaging66-TSSOP (0.400", 10.16mm Width)
Mounting MethodVolatileMemory InterfaceSSTL_2Memory Organization64M x 8
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNN/AHTS CodeN/A

Overview of IS43R86400F-5TL-TR – IC DRAM 512MBIT SSTL 66TSOPII

The IS43R86400F-5TL-TR is a 512 Mbit volatile memory device implemented as DDR SDRAM with a 64M × 8 organization. It provides a 200 MHz clock frequency operation and uses an SSTL_2 memory interface for synchronous DRAM applications.

Packaged in a 66‑TSSOP (66‑TSOP II) footprint and specified for 0°C to 70°C ambient operation, the device targets designs requiring mid‑density DDR memory with a 2.3 V to 2.7 V supply range and defined timing characteristics (700 ps access time, 15 ns word/page write cycle time).

Key Features

  • Memory Core 512 Mbit DRAM organized as 64M × 8, suitable where byte-wide synchronous memory is required.
  • DDR SDRAM Technology Implemented as SDRAM - DDR, supporting synchronous double-data-rate operation at the specified clock frequency.
  • Performance 200 MHz clock frequency with a 700 ps access time and a 15 ns write cycle time for word/page operations.
  • Interface SSTL_2 memory interface for systems that require Stub Series Terminated Logic signaling.
  • Power Operates from a 2.3 V to 2.7 V supply range, enabling integration into systems with low‑voltage DDR rails.
  • Package & Mounting Available in a 66‑TSSOP (0.400", 10.16 mm width) 66‑TSOP II package for surface‑mount assembly.
  • Operating Range Specified for ambient operating temperatures from 0°C to 70°C (TA).

Typical Applications

  • Memory modules and boards Use as a 512 Mbit DDR SDRAM building block where a 64M × 8 configuration and SSTL_2 interface are required.
  • High‑density buffer memory Suitable for designs needing mid‑density synchronous DRAM capacity with defined access timing.
  • Embedded systems with SSTL_2 interfaces Integration into systems that require SSTL_2 signaling and a 2.3 V–2.7 V supply range.

Unique Advantages

  • Defined DDR SDRAM architecture: Ready‑to‑use 64M × 8 DDR SDRAM organization simplifies memory subsystem design.
  • SSTL_2 interface compatibility: Ensures proper signaling for systems designed around SSTL_2 memory interfaces.
  • Compact surface‑mount package: 66‑TSSOP (66‑TSOP II) package provides a space‑efficient footprint for PCB layouts.
  • Controlled timing characteristics: 200 MHz clock, 700 ps access time and 15 ns write cycle time enable predictable performance budgeting.
  • Low‑voltage operation: 2.3 V to 2.7 V supply range aligns with common low‑voltage DDR rails.

Why Choose IS43R86400F-5TL-TR?

The IS43R86400F-5TL-TR offers a clear specification set for designers needing a 512 Mbit DDR SDRAM device with SSTL_2 signaling, compact 66‑TSSOP packaging, and defined timing and voltage parameters. Its combination of 64M × 8 organization, 200 MHz clocking, and specified access/write cycle times supports predictable memory subsystem integration in mid‑density applications.

This device is suited to teams and systems that require a standardized DDR memory element with known electrical and thermal limits (0°C to 70°C) and a 2.3 V–2.7 V supply window, helping streamline component selection and board-level implementation.

Request a quote or submit a parts inquiry to obtain pricing, availability, and lead‑time information for the IS43R86400F-5TL-TR.

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