IS45S32800J-6BLA1-TR
| Part Description |
IC DRAM 256MBIT PAR 90TFBGA |
|---|---|
| Quantity | 1,137 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 90-TFBGA (8x13) | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Mbit | Access Time | 5.4 ns | Grade | Industrial | ||
| Clock Frequency | 166 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 90-TFBGA | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 8M x 32 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | 3A991B2A | HTS Code | 8542.32.0024 |
Overview of IS45S32800J-6BLA1-TR - 256Mbit Parallel SDRAM
The IS45S32800J-6BLA1-TR is a high-performance 256Mbit synchronous DRAM organized as 8M x 32, delivering reliable memory storage for embedded systems and industrial applications. Built on proven SDRAM technology, this memory device operates at clock frequencies up to 166MHz with a fast 5.4ns access time, making it ideal for applications requiring responsive data throughput.
Designed for extended temperature operation from -40°C to 85°C, this DRAM component provides dependable performance in harsh industrial environments where standard commercial-grade memory may fail.
Key Features
- Memory Architecture - 256Mbit capacity organized as 8M x 32, providing flexible data width for 32-bit processors and controllers without additional components.
- High-Speed Performance - 166MHz clock frequency with 5.4ns access time enables rapid data retrieval for time-sensitive embedded applications.
- Parallel Interface - Standard parallel bus connection simplifies integration with microcontrollers, DSPs, and FPGAs using conventional memory interfacing techniques.
- Industrial Temperature Range - Operates reliably from -40°C to 85°C, ensuring consistent performance in factory automation, outdoor equipment, and automotive cabin electronics.
- Compact 90-TFBGA Package - 8mm x 13mm thin fine-pitch ball grid array footprint minimizes PCB real estate while maintaining robust electrical performance.
- Standard 3.3V Operation - Compatible with widely-used 3V to 3.6V supply rails, simplifying power distribution design in mixed-voltage systems.
Typical Applications
- Industrial Automation - This SDRAM provides working memory for programmable logic controllers (PLCs), human-machine interfaces (HMIs), and motion control systems where extended temperature tolerance ensures reliable operation in factory floor environments exposed to heat and cold.
- Embedded Computing Systems - Serves as main system memory for single-board computers and embedded processors in medical devices, point-of-sale terminals, and kiosks where the 32-bit wide data path matches processor bus widths for efficient memory access without additional glue logic.
- Networking Equipment - Functions as packet buffer memory in routers, switches, and wireless access points where the 166MHz clock frequency supports rapid packet processing and the industrial temperature rating accommodates equipment installed in temperature-uncontrolled network closets.
- Test and Measurement Instruments - Provides data acquisition buffer memory in oscilloscopes, logic analyzers, and spectrum analyzers where the fast access time enables high sample rate capture and the extended temperature range supports portable instruments used in field environments.
- Automotive Infotainment - Supplies memory for in-vehicle information systems, navigation displays, and digital instrument clusters where the -40°C to 85°C operating range accommodates cabin temperature extremes during cold starts and summer heat.
Unique Advantages
- Single-chip 32-bit memory solution: Eliminates the need for multiple narrower memory devices, reducing BOM costs and simplifying board layout with fewer traces and connection points.
- Extended temperature reliability: Operates across industrial temperature extremes without derating, avoiding the need for additional thermal management components or restricted deployment environments.
- Proven SDRAM architecture: Leverages mature, well-understood synchronous DRAM technology with broad toolchain support and extensive application notes, reducing design risk compared to newer memory technologies.
- Space-efficient packaging: The compact 90-TFBGA format provides high pin density in a small footprint, enabling memory integration in space-constrained designs such as handheld instruments and compact embedded modules.
- Standard voltage compatibility: Direct connection to 3.3V logic families eliminates voltage translation circuitry, simplifying power supply design and reducing component count.
- Wide availability and active lifecycle: Manufactured by ISSI with active lifecycle status, ensuring consistent supply for production builds and reducing risk of redesign due to component obsolescence.
Why Choose IS45S32800J-6BLA1-TR?
This parallel SDRAM strikes an optimal balance between performance, integration, and environmental robustness for industrial and embedded applications. The 32-bit wide organization provides efficient memory access for modern 32-bit processors without the complexity of multi-chip memory arrays, while the industrial temperature rating expands deployment options beyond climate-controlled environments.
For design teams building industrial controls, embedded systems, automotive electronics, or test instruments that require reliable memory operation across temperature extremes, the IS45S32800J-6BLA1-TR delivers proven SDRAM performance in a compact, industry-standard package that simplifies procurement, design, and long-term manufacturability.
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